JP4640177B2 - 感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 - Google Patents

感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 Download PDF

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Publication number
JP4640177B2
JP4640177B2 JP2005514066A JP2005514066A JP4640177B2 JP 4640177 B2 JP4640177 B2 JP 4640177B2 JP 2005514066 A JP2005514066 A JP 2005514066A JP 2005514066 A JP2005514066 A JP 2005514066A JP 4640177 B2 JP4640177 B2 JP 4640177B2
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JP
Japan
Prior art keywords
photosensitive element
light
resin composition
compound
photosensitive resin
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Expired - Fee Related
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JP2005514066A
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English (en)
Japanese (ja)
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JPWO2005029188A1 (ja
Inventor
尚 熊木
昌宏 宮坂
靖久 市橋
伊藤　　俊樹
誠 鍛治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/115—Cationic or anionic

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Polymerisation Methods In General (AREA)
JP2005514066A 2003-09-24 2004-09-17 感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 Expired - Fee Related JP4640177B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003331461 2003-09-24
JP2003331461 2003-09-24
PCT/JP2004/013677 WO2005029188A1 (ja) 2003-09-24 2004-09-17 感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法

Publications (2)

Publication Number Publication Date
JPWO2005029188A1 JPWO2005029188A1 (ja) 2007-11-15
JP4640177B2 true JP4640177B2 (ja) 2011-03-02

Family

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JP2005514066A Expired - Fee Related JP4640177B2 (ja) 2003-09-24 2004-09-17 感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法

Country Status (6)

Country Link
US (1) US7622243B2 (https=)
JP (1) JP4640177B2 (https=)
KR (2) KR20060055547A (https=)
CN (1) CN1856742B (https=)
TW (1) TW200512540A (https=)
WO (1) WO2005029188A1 (https=)

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US7776509B2 (en) * 2007-02-06 2010-08-17 Canon Kabushiki Kaisha Photosensitive compound, photosensitive composition, resist pattern forming method, and device production process
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CN101759814B (zh) * 2009-12-25 2013-06-19 深圳市有为化学技术有限公司 单或双官能团硫杂蒽酮及含有该单或双官能团硫杂蒽酮的光引发剂
US10796912B2 (en) 2017-05-16 2020-10-06 Lam Research Corporation Eliminating yield impact of stochastics in lithography
CN111279804B (zh) * 2017-12-20 2023-10-24 住友电气工业株式会社 制造印刷电路板和层压结构的方法
CN113039486B (zh) 2018-11-14 2024-11-12 朗姆研究公司 可用于下一代光刻法中的硬掩模制作方法
US12211691B2 (en) 2018-12-20 2025-01-28 Lam Research Corporation Dry development of resists
TW202514246A (zh) 2019-03-18 2025-04-01 美商蘭姆研究公司 基板處理方法與設備
US12062538B2 (en) 2019-04-30 2024-08-13 Lam Research Corporation Atomic layer etch and selective deposition process for extreme ultraviolet lithography resist improvement
TWI837391B (zh) 2019-06-26 2024-04-01 美商蘭姆研究公司 利用鹵化物化學品的光阻顯影
SG11202108851RA (en) 2020-01-15 2021-09-29 Lam Res Corp Underlayer for photoresist adhesion and dose reduction
CN115244664A (zh) 2020-02-28 2022-10-25 朗姆研究公司 用于减少euv图案化缺陷的多层硬掩模
CN115702475A (zh) 2020-06-22 2023-02-14 朗姆研究公司 用于含金属光致抗蚀剂沉积的表面改性
EP4078292A4 (en) 2020-07-07 2023-11-22 Lam Research Corporation Integrated dry processes for patterning radiation photoresist patterning
US20230107357A1 (en) 2020-11-13 2023-04-06 Lam Research Corporation Process tool for dry removal of photoresist
JP7681106B2 (ja) 2020-12-08 2025-05-21 ラム リサーチ コーポレーション 有機蒸気によるフォトレジストの現像
KR102725782B1 (ko) 2022-07-01 2024-11-05 램 리써치 코포레이션 에칭 정지 억제 (etch stop deterrence) 를 위한 금속 옥사이드 기반 포토레지스트의 순환적 현상
US12474640B2 (en) 2023-03-17 2025-11-18 Lam Research Corporation Integration of dry development and etch processes for EUV patterning in a single process chamber
JP7852072B2 (ja) 2023-07-27 2026-04-27 ラム リサーチ コーポレーション 金属含有フォトレジストのためのオールインワン乾式現像

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JPH01159637A (ja) * 1987-12-16 1989-06-22 Daicel Chem Ind Ltd 感光性硬化組成物
JPH0235454A (ja) * 1988-07-25 1990-02-06 Sekisui Chem Co Ltd 感光性樹脂組成物
JPH0262545A (ja) * 1988-08-29 1990-03-02 Asahi Chem Ind Co Ltd 感光性樹脂組成物
JPH02113251A (ja) * 1988-10-24 1990-04-25 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いた感光性エレメント
JPH02161441A (ja) * 1988-12-15 1990-06-21 Daicel Chem Ind Ltd 光重合性組成物
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JP2001133968A (ja) * 1999-11-09 2001-05-18 Fuji Photo Film Co Ltd 感光性組成物
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Publication number Priority date Publication date Assignee Title
JPH01159637A (ja) * 1987-12-16 1989-06-22 Daicel Chem Ind Ltd 感光性硬化組成物
JPH0235454A (ja) * 1988-07-25 1990-02-06 Sekisui Chem Co Ltd 感光性樹脂組成物
JPH0262545A (ja) * 1988-08-29 1990-03-02 Asahi Chem Ind Co Ltd 感光性樹脂組成物
JPH02113251A (ja) * 1988-10-24 1990-04-25 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いた感光性エレメント
JPH02161441A (ja) * 1988-12-15 1990-06-21 Daicel Chem Ind Ltd 光重合性組成物
JPH02161437A (ja) * 1988-12-15 1990-06-21 Daicel Chem Ind Ltd 光重合性組成物
JPH07248623A (ja) * 1994-03-11 1995-09-26 Asahi Chem Ind Co Ltd 光硬化性樹脂積層体及びそれを用いるプリント配線板の製造方法
JP2001133968A (ja) * 1999-11-09 2001-05-18 Fuji Photo Film Co Ltd 感光性組成物
JP2001201851A (ja) * 2000-01-18 2001-07-27 Asahi Kasei Corp 光重合性樹脂組成物
JP2002351086A (ja) * 2001-03-22 2002-12-04 Fuji Photo Film Co Ltd 露光装置
JP2003262956A (ja) * 2002-03-12 2003-09-19 Hitachi Chem Co Ltd 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法

Also Published As

Publication number Publication date
JPWO2005029188A1 (ja) 2007-11-15
KR20080017492A (ko) 2008-02-26
KR20060055547A (ko) 2006-05-23
KR100907368B1 (ko) 2009-07-10
CN1856742A (zh) 2006-11-01
TWI365354B (https=) 2012-06-01
US20070105036A1 (en) 2007-05-10
WO2005029188A1 (ja) 2005-03-31
US7622243B2 (en) 2009-11-24
CN1856742B (zh) 2010-11-24
TW200512540A (en) 2005-04-01

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