JP4632872B2 - レジスト除去用組成物 - Google Patents

レジスト除去用組成物 Download PDF

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Publication number
JP4632872B2
JP4632872B2 JP2005178090A JP2005178090A JP4632872B2 JP 4632872 B2 JP4632872 B2 JP 4632872B2 JP 2005178090 A JP2005178090 A JP 2005178090A JP 2005178090 A JP2005178090 A JP 2005178090A JP 4632872 B2 JP4632872 B2 JP 4632872B2
Authority
JP
Japan
Prior art keywords
resist
composition
tertiary amine
alkylene carbonate
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005178090A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006011433A (ja
Inventor
キム、ビュン−ウク
キム、セオン−バエ
ユン、スク−イル
ジャン、スク−チャン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongjin Semichem Co Ltd
Original Assignee
Dongjin Semichem Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongjin Semichem Co Ltd filed Critical Dongjin Semichem Co Ltd
Publication of JP2006011433A publication Critical patent/JP2006011433A/ja
Application granted granted Critical
Publication of JP4632872B2 publication Critical patent/JP4632872B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • C11D1/38—Cationic compounds
    • C11D1/52—Carboxylic amides, alkylolamides or imides or their condensation products with alkylene oxides
    • C11D1/526—Carboxylic amides (R1-CO-NR2R3), where R1, R2 or R3 are polyalkoxylated
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/02—Inorganic compounds ; Elemental compounds
    • C11D3/04—Water-soluble compounds
    • C11D3/044—Hydroxides or bases
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/20—Organic compounds containing oxygen
    • C11D3/2068—Ethers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • C11D2111/22—
JP2005178090A 2004-06-21 2005-06-17 レジスト除去用組成物 Expired - Fee Related JP4632872B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020040046031A KR20050120914A (ko) 2004-06-21 2004-06-21 레지스트 제거용 조성물

Publications (2)

Publication Number Publication Date
JP2006011433A JP2006011433A (ja) 2006-01-12
JP4632872B2 true JP4632872B2 (ja) 2011-02-16

Family

ID=35718734

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005178090A Expired - Fee Related JP4632872B2 (ja) 2004-06-21 2005-06-17 レジスト除去用組成物

Country Status (4)

Country Link
JP (1) JP4632872B2 (ko)
KR (1) KR20050120914A (ko)
CN (1) CN1713077B (ko)
TW (1) TW200613933A (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101257409B1 (ko) * 2006-01-10 2013-04-23 주식회사 동진쎄미켐 레지스트 제거용 조성물
KR20100046139A (ko) * 2007-06-12 2010-05-06 도아고세이가부시키가이샤 도전성 고분자 상의 레지스트막의 박리제, 레지스트막의 박리 방법, 및 패터닝한 도전성 고분자를 갖는 기판
JP5143230B2 (ja) * 2007-08-01 2013-02-13 アプライド マテリアルズ インコーポレイテッド 電子デバイス基板表面からの有機含有材料のストリッピングと除去
JP5697945B2 (ja) * 2010-10-27 2015-04-08 富士フイルム株式会社 多剤型半導体基板用洗浄剤、それを用いた洗浄方法及び半導体素子の製造方法
JP7175316B2 (ja) * 2018-01-25 2022-11-18 メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツング フォトレジストリムーバ組成物
JP7377206B2 (ja) * 2018-01-25 2023-11-09 メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツング フォトレジストリムーバ組成物

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003203856A (ja) * 2001-10-23 2003-07-18 Ums:Kk 有機被膜の除去方法
JP2003282518A (ja) * 2002-03-25 2003-10-03 Pyuarekkusu:Kk 有機被膜の除去方法および除去剤
JP2003305418A (ja) * 2002-04-11 2003-10-28 Ums:Kk 基体表面の有機被膜の除去装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998053016A1 (en) * 1997-05-23 1998-11-26 Huntsman Petrochemical Corporation Paint and coating remover
JPH11282176A (ja) * 1998-03-26 1999-10-15 Toray Fine Chemical Kk フォトレジスト剥離用組成物
KR19990007139A (ko) * 1997-06-19 1999-01-25 이시하라 고로 포토레지스트 박리용 조성물
JPH1116882A (ja) * 1997-06-19 1999-01-22 Toray Fine Chem Co Ltd フォトレジスト剥離用組成物
AU3360399A (en) * 1998-03-30 1999-10-18 Leisa B. Davenhall Composition and method for removing photoresist materials from electronic components
JP3914842B2 (ja) * 2001-10-23 2007-05-16 有限会社ユーエムエス 有機被膜の除去方法および除去装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003203856A (ja) * 2001-10-23 2003-07-18 Ums:Kk 有機被膜の除去方法
JP2003282518A (ja) * 2002-03-25 2003-10-03 Pyuarekkusu:Kk 有機被膜の除去方法および除去剤
JP2003305418A (ja) * 2002-04-11 2003-10-28 Ums:Kk 基体表面の有機被膜の除去装置

Also Published As

Publication number Publication date
KR20050120914A (ko) 2005-12-26
CN1713077A (zh) 2005-12-28
CN1713077B (zh) 2010-12-22
JP2006011433A (ja) 2006-01-12
TW200613933A (en) 2006-05-01

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