TW200613933A - Composition for removing a (photo)resist - Google Patents

Composition for removing a (photo)resist

Info

Publication number
TW200613933A
TW200613933A TW094120519A TW94120519A TW200613933A TW 200613933 A TW200613933 A TW 200613933A TW 094120519 A TW094120519 A TW 094120519A TW 94120519 A TW94120519 A TW 94120519A TW 200613933 A TW200613933 A TW 200613933A
Authority
TW
Taiwan
Prior art keywords
composition
resist
metal film
patterned metal
photo
Prior art date
Application number
TW094120519A
Other languages
English (en)
Inventor
Byung-Uk Kim
Seong-Bae Kim
Suk-Il Yoon
Suk-Chang Jang
Original Assignee
Dongjin Semichem Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongjin Semichem Co Ltd filed Critical Dongjin Semichem Co Ltd
Publication of TW200613933A publication Critical patent/TW200613933A/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • C11D1/38—Cationic compounds
    • C11D1/52—Carboxylic amides, alkylolamides or imides or their condensation products with alkylene oxides
    • C11D1/526—Carboxylic amides (R1-CO-NR2R3), where R1, R2 or R3 are polyalkoxylated
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/02—Inorganic compounds ; Elemental compounds
    • C11D3/04—Water-soluble compounds
    • C11D3/044—Hydroxides or bases
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/20—Organic compounds containing oxygen
    • C11D3/2068—Ethers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Wood Science & Technology (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Inorganic Chemistry (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW094120519A 2004-06-21 2005-06-21 Composition for removing a (photo)resist TW200613933A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020040046031A KR20050120914A (ko) 2004-06-21 2004-06-21 레지스트 제거용 조성물

Publications (1)

Publication Number Publication Date
TW200613933A true TW200613933A (en) 2006-05-01

Family

ID=35718734

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094120519A TW200613933A (en) 2004-06-21 2005-06-21 Composition for removing a (photo)resist

Country Status (4)

Country Link
JP (1) JP4632872B2 (zh)
KR (1) KR20050120914A (zh)
CN (1) CN1713077B (zh)
TW (1) TW200613933A (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101257409B1 (ko) * 2006-01-10 2013-04-23 주식회사 동진쎄미켐 레지스트 제거용 조성물
US20100183853A1 (en) * 2007-06-12 2010-07-22 Takashi Ihara Stripping agent for resist film on/above conductive polymer, method for stripping resist film, and substrate having patterned conductive polymer
KR101431506B1 (ko) * 2007-08-01 2014-08-20 어플라이드 머티어리얼스, 인코포레이티드 전자 디바이스 기판 표면으로부터 유기-함유 물질의 스트리핑 및 제거
JP5697945B2 (ja) * 2010-10-27 2015-04-08 富士フイルム株式会社 多剤型半導体基板用洗浄剤、それを用いた洗浄方法及び半導体素子の製造方法
CN111512239B (zh) * 2018-01-25 2024-05-03 默克专利股份有限公司 光致抗蚀剂去除剂组合物
SG11202004421WA (en) * 2018-01-25 2020-06-29 Merck Patent Gmbh Photoresist remover compositions
EP3997521B1 (en) 2019-07-11 2023-08-30 Merck Patent GmbH Photoresist remover compositions

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU738869B2 (en) * 1997-05-23 2001-09-27 Huntsman Petrochemical Corporation Paint and coating remover
KR19990007139A (ko) * 1997-06-19 1999-01-25 이시하라 고로 포토레지스트 박리용 조성물
JPH11282176A (ja) * 1998-03-26 1999-10-15 Toray Fine Chemical Kk フォトレジスト剥離用組成物
JPH1116882A (ja) * 1997-06-19 1999-01-22 Toray Fine Chem Co Ltd フォトレジスト剥離用組成物
WO1999049998A1 (en) * 1998-03-30 1999-10-07 The Regents Of The University Of California Composition and method for removing photoresist materials from electronic components
JP3914842B2 (ja) * 2001-10-23 2007-05-16 有限会社ユーエムエス 有機被膜の除去方法および除去装置
JP2003203856A (ja) * 2001-10-23 2003-07-18 Ums:Kk 有機被膜の除去方法
JP4004318B2 (ja) * 2002-03-25 2007-11-07 野村マイクロ・サイエンス株式会社 有機被膜の除去方法および除去剤
JP4114395B2 (ja) * 2002-04-11 2008-07-09 東亞合成株式会社 基体表面の有機被膜の除去装置

Also Published As

Publication number Publication date
JP2006011433A (ja) 2006-01-12
CN1713077B (zh) 2010-12-22
KR20050120914A (ko) 2005-12-26
CN1713077A (zh) 2005-12-28
JP4632872B2 (ja) 2011-02-16

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