JP4617145B2 - 液体吐出ヘッド用基板の製造方法 - Google Patents

液体吐出ヘッド用基板の製造方法 Download PDF

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Publication number
JP4617145B2
JP4617145B2 JP2004342245A JP2004342245A JP4617145B2 JP 4617145 B2 JP4617145 B2 JP 4617145B2 JP 2004342245 A JP2004342245 A JP 2004342245A JP 2004342245 A JP2004342245 A JP 2004342245A JP 4617145 B2 JP4617145 B2 JP 4617145B2
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JP
Japan
Prior art keywords
substrate
liquid discharge
layer
manufacturing
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004342245A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005199701A5 (enExample
JP2005199701A (ja
Inventor
智 伊部
照夫 尾崎
良行 今仲
琢也 初井
賢二 小野
一郎 斉藤
宇 横山
稔康 坂井
和昭 柴田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2004342245A priority Critical patent/JP4617145B2/ja
Priority to US11/006,615 priority patent/US7255426B2/en
Priority to EP04029553A priority patent/EP1543977B1/en
Priority to DE602004020043T priority patent/DE602004020043D1/de
Priority to CNB2004101022235A priority patent/CN100376400C/zh
Publication of JP2005199701A publication Critical patent/JP2005199701A/ja
Priority to US11/746,251 priority patent/US7338150B2/en
Publication of JP2005199701A5 publication Critical patent/JP2005199701A5/ja
Application granted granted Critical
Publication of JP4617145B2 publication Critical patent/JP4617145B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B41J2/1603—Production of bubble jet print heads of the front shooter type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1629—Manufacturing processes etching wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
JP2004342245A 2003-12-16 2004-11-26 液体吐出ヘッド用基板の製造方法 Expired - Fee Related JP4617145B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2004342245A JP4617145B2 (ja) 2003-12-16 2004-11-26 液体吐出ヘッド用基板の製造方法
US11/006,615 US7255426B2 (en) 2003-12-16 2004-12-08 Substrate for liquid discharge head, liquid discharge head using substrate for liquid discharge head and method of manufacturing the same
DE602004020043T DE602004020043D1 (de) 2003-12-16 2004-12-14 Substrat für einen Flüssigkeitsausstosskopf, Flüssigkeitsausstosskopf und dazugehöriges Herstellungsverfahren
EP04029553A EP1543977B1 (en) 2003-12-16 2004-12-14 Substrate for liquid discharge head, liquid discharge head using substrate for liquid discharge head and method of manufacturing the same
CNB2004101022235A CN100376400C (zh) 2003-12-16 2004-12-16 液体排出头用基板、液体排出头和其制造方法
US11/746,251 US7338150B2 (en) 2003-12-16 2007-05-09 Substrate for liquid discharge head, liquid discharge head using substrate for liquid discharge head and method of manufacturing the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003417703 2003-12-16
JP2004342245A JP4617145B2 (ja) 2003-12-16 2004-11-26 液体吐出ヘッド用基板の製造方法

Publications (3)

Publication Number Publication Date
JP2005199701A JP2005199701A (ja) 2005-07-28
JP2005199701A5 JP2005199701A5 (enExample) 2007-11-22
JP4617145B2 true JP4617145B2 (ja) 2011-01-19

Family

ID=34525517

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004342245A Expired - Fee Related JP4617145B2 (ja) 2003-12-16 2004-11-26 液体吐出ヘッド用基板の製造方法

Country Status (5)

Country Link
US (2) US7255426B2 (enExample)
EP (1) EP1543977B1 (enExample)
JP (1) JP4617145B2 (enExample)
CN (1) CN100376400C (enExample)
DE (1) DE602004020043D1 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5897930A (en) * 1996-12-31 1999-04-27 Minnesota Mining And Manufacturing Company Multiple embossed webs
JP4865309B2 (ja) * 2005-11-29 2012-02-01 キヤノン株式会社 インクジェット記録ヘッド用基板の製造方法
JP4886187B2 (ja) * 2004-12-15 2012-02-29 キヤノン株式会社 インクジェット記録ヘッド用基板および該基板を用いるインクジェット記録ヘッド
JP4845415B2 (ja) * 2005-04-18 2011-12-28 キヤノン株式会社 インクジェット記録ヘッド
US7614726B2 (en) * 2005-12-19 2009-11-10 Canon Kabushiki Kaisha Recording head chip, recording head employing recording head chip, and recording apparatus employing recording head
US8438729B2 (en) 2006-03-09 2013-05-14 Canon Kabushiki Kaisha Method of producing liquid discharge head
JP5008448B2 (ja) * 2007-04-20 2012-08-22 キヤノン株式会社 インクジェット記録ヘッド用の基板の製造方法
JP5147282B2 (ja) * 2007-05-02 2013-02-20 キヤノン株式会社 インクジェット記録用基板、該基板を備えた記録ヘッド及び記録装置
US8291576B2 (en) 2008-06-18 2012-10-23 Canon Kabushiki Kaisha Method of manufacturing liquid ejection head
US8152279B2 (en) 2008-06-18 2012-04-10 Canon Kabushiki Kaisha Liquid ejection head having substrate with nickel-containing layer
JP2010000632A (ja) 2008-06-18 2010-01-07 Canon Inc インクジェットヘッド用基板および該基板を具えるインクジェットヘッド
JP5335611B2 (ja) * 2009-08-18 2013-11-06 キヤノン株式会社 液体吐出ヘッド及び液体吐出ヘッドの製造方法
JP5233937B2 (ja) * 2009-09-29 2013-07-10 ブラザー工業株式会社 液体吐出ヘッドの製造方法及び液体吐出ヘッド
JP5596962B2 (ja) * 2009-11-18 2014-09-24 キヤノン株式会社 液体吐出ヘッド用基板の製造方法及び液体吐出ヘッドの製造方法
US9653969B2 (en) * 2011-07-28 2017-05-16 Mitsubishi Electric Corporation Brush structure with heat dissipation member
JP5921186B2 (ja) * 2011-12-26 2016-05-24 キヤノン株式会社 インクジェットヘッド基板の加工方法
JP7191669B2 (ja) 2018-12-17 2022-12-19 キヤノン株式会社 液体吐出ヘッド用基板およびその製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0344809B1 (en) * 1988-06-03 1994-08-31 Canon Kabushiki Kaisha Liquid emission recording head, substrate therefor and liquid emission recording apparatus utilizing said head
JP2840271B2 (ja) * 1989-01-27 1998-12-24 キヤノン株式会社 記録ヘッド
CA2075097C (en) * 1991-08-02 2000-03-28 Hiroyuki Ishinaga Recording apparatus, recording head and substrate therefor
JP3095857B2 (ja) * 1992-02-24 2000-10-10 イビデン株式会社 電子部品搭載用基板
US5648806A (en) * 1992-04-02 1997-07-15 Hewlett-Packard Company Stable substrate structure for a wide swath nozzle array in a high resolution inkjet printer
SG72611A1 (en) * 1993-04-30 2000-05-23 Hewlett Packard Co Reliable contact and arrangement on plastic print cartridge
US6174046B1 (en) * 1994-10-06 2001-01-16 Hewlett-Packard Company Reliable contact pad arrangement on plastic print cartridge
GB9626686D0 (en) * 1996-12-23 1997-02-12 Domino Printing Sciences Plc Continuous inkjet printer
US6155674A (en) 1997-03-04 2000-12-05 Hewlett-Packard Company Structure to effect adhesion between substrate and ink barrier in ink jet printhead
JP3502743B2 (ja) * 1997-05-23 2004-03-02 東芝テック株式会社 インクジェットプリンタヘッド及びその製造方法
DE60126869T2 (de) * 2000-07-11 2007-11-08 Samsung Electronics Co., Ltd., Suwon Tintenstrahldruckkopf des mit Bläschen angetrieben Typs
CN1408548A (zh) * 2001-09-28 2003-04-09 飞赫科技股份有限公司 压电式喷墨打印头及其制造方法
CN1218616C (zh) * 2002-04-26 2005-09-07 国际联合科技股份有限公司 电镀墨水匣上的软式印刷电路板的方法
JP2004050637A (ja) * 2002-07-19 2004-02-19 Canon Inc インクジェットヘッド用基板、インクジェットヘッド及び該インクジェットヘッドを備えたインクジェット記録装置
KR100472485B1 (ko) * 2002-12-20 2005-03-09 삼성전자주식회사 잉크젯 프린트헤드 및 그 제조방법

Also Published As

Publication number Publication date
EP1543977B1 (en) 2009-03-18
US7255426B2 (en) 2007-08-14
US20070206061A1 (en) 2007-09-06
DE602004020043D1 (de) 2009-04-30
US20050128254A1 (en) 2005-06-16
US7338150B2 (en) 2008-03-04
JP2005199701A (ja) 2005-07-28
CN100376400C (zh) 2008-03-26
CN1628984A (zh) 2005-06-22
EP1543977A1 (en) 2005-06-22

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