JP5008448B2 - インクジェット記録ヘッド用の基板の製造方法 - Google Patents
インクジェット記録ヘッド用の基板の製造方法 Download PDFInfo
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- JP5008448B2 JP5008448B2 JP2007111992A JP2007111992A JP5008448B2 JP 5008448 B2 JP5008448 B2 JP 5008448B2 JP 2007111992 A JP2007111992 A JP 2007111992A JP 2007111992 A JP2007111992 A JP 2007111992A JP 5008448 B2 JP5008448 B2 JP 5008448B2
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- JP
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- Prior art keywords
- layer
- substrate
- metal
- plating
- recording head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000000758 substrate Substances 0.000 title claims description 41
- 238000000034 method Methods 0.000 title claims description 32
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 239000010410 layer Substances 0.000 claims description 109
- 229910052751 metal Inorganic materials 0.000 claims description 33
- 239000002184 metal Substances 0.000 claims description 33
- 239000010931 gold Substances 0.000 claims description 32
- 238000007747 plating Methods 0.000 claims description 30
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 21
- 229910052737 gold Inorganic materials 0.000 claims description 21
- 238000010438 heat treatment Methods 0.000 claims description 17
- 239000004020 conductor Substances 0.000 claims description 14
- 239000011241 protective layer Substances 0.000 claims description 6
- 238000007599 discharging Methods 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 2
- MAKDTFFYCIMFQP-UHFFFAOYSA-N titanium tungsten Chemical compound [Ti].[W] MAKDTFFYCIMFQP-UHFFFAOYSA-N 0.000 claims description 2
- 238000001039 wet etching Methods 0.000 claims description 2
- 239000003792 electrolyte Substances 0.000 claims 1
- 238000009792 diffusion process Methods 0.000 description 20
- 229910052782 aluminium Inorganic materials 0.000 description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 13
- 229920002120 photoresistant polymer Polymers 0.000 description 12
- 229920005989 resin Polymers 0.000 description 11
- 239000011347 resin Substances 0.000 description 11
- 230000002265 prevention Effects 0.000 description 10
- 239000000463 material Substances 0.000 description 7
- 238000000206 photolithography Methods 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000005338 heat storage Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229920002614 Polyether block amide Polymers 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052681 coesite Inorganic materials 0.000 description 2
- 229910052906 cristobalite Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 238000005187 foaming Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 229910052682 stishovite Inorganic materials 0.000 description 2
- 229910052905 tridymite Inorganic materials 0.000 description 2
- DKNPRRRKHAEUMW-UHFFFAOYSA-N Iodine aqueous Chemical compound [K+].I[I-]I DKNPRRRKHAEUMW-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- SRCZENKQCOSNAI-UHFFFAOYSA-H gold(3+);trisulfite Chemical compound [Au+3].[Au+3].[O-]S([O-])=O.[O-]S([O-])=O.[O-]S([O-])=O SRCZENKQCOSNAI-UHFFFAOYSA-H 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14088—Structure of heating means
- B41J2/14112—Resistive element
- B41J2/14129—Layer structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14387—Front shooter
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/18—Electrical connection established using vias
Description
101 蓄熱層
102 発熱抵抗体層
103 保護膜
104 個別アルミ配線
105 拡散防止層
107 樹脂層
108 流路形成層
110 発熱部
111 インク吐出口
112 インク流路
120 インク供給口
131 フォトレジスト
132 めっき用導体の金(Au)層
133 フォトレジスト
134 電力配線
140 段差
Claims (6)
- 通電によって発熱する発熱抵抗層と、
該発熱抵抗層に接して設けられた一対の配線と、
インクを吐出するためのエネルギを発生する発熱抵抗体として作用する前記発熱抵抗層の前記一対の配線の間に位置する部分および前記一対の配線を被覆し、前記一対の配線の一方の上に貫通部を有する、絶縁材料からなる保護層と、
を備えた基体を用意する工程と、
少なくとも前記貫通部を含む前記保護層の上に第2の金属の金属層を形成する工程と、
前記金属層が形成された基板の全面に、前記第2の金属よりイオン化傾向が小さい第1の金属からなるめっき用導体層を真空成膜法により設ける工程と、
前記金属層の端部に対応した前記めっき用導体層の段差部より前記金属層が設けられていない方向に少し離れた位置から、前記段差部と前記金属層に対応する前記めっき用導体層の上部全面とを少なくとも被覆するように、前記第1の金属からなるめっき層を設ける工程と、
前記めっき層が設けられていない前記めっき用導体層をウェットエッチング法により除去する工程と、
を有することを特徴とするインクジェット記録ヘッド用の基板の製造方法。 - 前記第1の金属は金(Au)であることを特徴とする請求項1に記載のインクジェット記録ヘッド用の基板の製造方法。
- 前記第2の金属はチタンタングステン(TiW)であることを特徴とする請求項1又は請求項2に記載のインクジェット記録ヘッド用の基板の製造方法。
- 前記めっき層の上に、インクを吐出するための吐出口と該吐出口にインクを導くための流路の壁面とを有する流路形成層を設ける工程を更に有することを特徴とする請求項1乃至3のいずれかに記載のインクジェット記録ヘッド用の基板の製造方法。
- 前記めっき層を設ける工程は、
前記めっき用導体層が設けられた基板上の一部にレジスト層を形成する工程と、
前記レジスト層を形成した後に、めっき用の電解液中で前記めっき用導体に電流を流す工程と、
前記電流を流す工程の後に、前記レジスト層を除去する工程と、
を含むことを特徴とする請求項1乃至4のいずれか1項に記載のインクジェット記録ヘッド用の基板の製造方法。 - 前記レジスト層を形成する工程において、前記レジスト層は前記めっき層の膜厚よりも厚い膜厚となるように形成されることを特徴とする請求項5に記載のインクジェット記録ヘッド用の基板の製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007111992A JP5008448B2 (ja) | 2007-04-20 | 2007-04-20 | インクジェット記録ヘッド用の基板の製造方法 |
US12/105,931 US8182072B2 (en) | 2007-04-20 | 2008-04-18 | Substrate for inkjet printing head and method for manufacturing the substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007111992A JP5008448B2 (ja) | 2007-04-20 | 2007-04-20 | インクジェット記録ヘッド用の基板の製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008265164A JP2008265164A (ja) | 2008-11-06 |
JP2008265164A5 JP2008265164A5 (ja) | 2010-06-03 |
JP5008448B2 true JP5008448B2 (ja) | 2012-08-22 |
Family
ID=39871764
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007111992A Expired - Fee Related JP5008448B2 (ja) | 2007-04-20 | 2007-04-20 | インクジェット記録ヘッド用の基板の製造方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8182072B2 (ja) |
JP (1) | JP5008448B2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5596962B2 (ja) * | 2009-11-18 | 2014-09-24 | キヤノン株式会社 | 液体吐出ヘッド用基板の製造方法及び液体吐出ヘッドの製造方法 |
JP2013033843A (ja) * | 2011-08-02 | 2013-02-14 | Sony Corp | 回路基板、回路基板の製造方法、表示装置および電子機器 |
WO2015116050A1 (en) * | 2014-01-29 | 2015-08-06 | Hewlett-Packard Development Company, L.P. | Thermal ink jet printhead |
JP7094693B2 (ja) * | 2017-11-27 | 2022-07-04 | キヤノン株式会社 | 液体吐出ヘッドの製造方法及び液体吐出ヘッド |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3143307B2 (ja) | 1993-02-03 | 2001-03-07 | キヤノン株式会社 | インクジェット記録ヘッドの製造方法 |
JP3705652B2 (ja) * | 1996-06-28 | 2005-10-12 | 富士写真フイルム株式会社 | インクジェット記録装置およびその製造方法 |
JP4146933B2 (ja) | 1998-06-03 | 2008-09-10 | キヤノン株式会社 | インクジェットヘッドおよびインクジェットヘッドの製造方法 |
JP4654494B2 (ja) * | 2000-08-07 | 2011-03-23 | ソニー株式会社 | プリンタ、プリンタヘッド及びプリンタヘッドの製造方法 |
JP4604337B2 (ja) * | 2000-11-07 | 2011-01-05 | ソニー株式会社 | プリンタ、プリンタヘッド及びプリンタヘッドの製造方法 |
JP2003127367A (ja) * | 2001-10-26 | 2003-05-08 | Fuji Xerox Co Ltd | インクジェット式プリンタヘッドの圧電アクチュエータおよびその製造方法 |
JP4617145B2 (ja) * | 2003-12-16 | 2011-01-19 | キヤノン株式会社 | 液体吐出ヘッド用基板の製造方法 |
US7697020B2 (en) * | 2004-11-04 | 2010-04-13 | Rohm Co., Ltd. | Thermal print head and method for manufacturing same |
JP4630680B2 (ja) * | 2005-01-31 | 2011-02-09 | キヤノン株式会社 | 半導体素子の製造方法およびインクジェット記録ヘッドの製造方法 |
-
2007
- 2007-04-20 JP JP2007111992A patent/JP5008448B2/ja not_active Expired - Fee Related
-
2008
- 2008-04-18 US US12/105,931 patent/US8182072B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US8182072B2 (en) | 2012-05-22 |
JP2008265164A (ja) | 2008-11-06 |
US20080259130A1 (en) | 2008-10-23 |
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