JP4617145B2 - 液体吐出ヘッド用基板の製造方法 - Google Patents
液体吐出ヘッド用基板の製造方法 Download PDFInfo
- Publication number
- JP4617145B2 JP4617145B2 JP2004342245A JP2004342245A JP4617145B2 JP 4617145 B2 JP4617145 B2 JP 4617145B2 JP 2004342245 A JP2004342245 A JP 2004342245A JP 2004342245 A JP2004342245 A JP 2004342245A JP 4617145 B2 JP4617145 B2 JP 4617145B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- liquid discharge
- layer
- manufacturing
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title claims description 65
- 239000007788 liquid Substances 0.000 title claims description 41
- 238000004519 manufacturing process Methods 0.000 title claims description 29
- 238000000034 method Methods 0.000 claims description 39
- 238000007747 plating Methods 0.000 claims description 21
- 230000008569 process Effects 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 18
- 239000004020 conductor Substances 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 238000009429 electrical wiring Methods 0.000 claims description 9
- 239000010410 layer Substances 0.000 description 64
- 239000010931 gold Substances 0.000 description 23
- 229910052782 aluminium Inorganic materials 0.000 description 19
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 19
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 17
- 229910052737 gold Inorganic materials 0.000 description 17
- 239000000463 material Substances 0.000 description 17
- 238000010586 diagram Methods 0.000 description 14
- 229920002120 photoresistant polymer Polymers 0.000 description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 7
- 239000003870 refractory metal Substances 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 230000006872 improvement Effects 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 238000005338 heat storage Methods 0.000 description 3
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 238000004528 spin coating Methods 0.000 description 3
- 238000007599 discharging Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- DKNPRRRKHAEUMW-UHFFFAOYSA-N Iodine aqueous Chemical compound [K+].I[I-]I DKNPRRRKHAEUMW-UHFFFAOYSA-N 0.000 description 1
- 229920002614 Polyether block amide Polymers 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- SRCZENKQCOSNAI-UHFFFAOYSA-H gold(3+);trisulfite Chemical compound [Au+3].[Au+3].[O-]S([O-])=O.[O-]S([O-])=O.[O-]S([O-])=O SRCZENKQCOSNAI-UHFFFAOYSA-H 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000001454 recorded image Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
Description
102 蓄熱層
103 発熱抵抗体層
104a 個別アルミ配線
104b 電極用アルミ配線
105 保護膜
106 発熱部
107 密着向上層
108 めっき用導体の金層
109 フォトレジスト
110a 共通配線
110b 電極パッド
111 樹脂層
112 流路形成層
113 吐出口
114 インク流路
Claims (5)
- 吐出エネルギー発生部から発生する吐出エネルギーによって液体吐出口より液体を吐出する液体吐出ヘッド用基板の製造方法であって、
基板に形成された密着向上層の上にめっき用の導体層を形成する工程と、
前記導体層に対して電流を流すめっき法により、前記吐出エネルギー発生部に電力を供給するための電気配線としての金属膜と、前記液体吐出ヘッド用基板の外部から前記電気配線へ供給される電力を受ける電極パッドを、同一工程で形成する工程と、
前記金属膜の幅より広い幅で残存するように前記導電膜を除去する工程と、
前記残存した導電膜をマスクとして前記密着向上層を除去する工程と、
を有することを特徴とする液体吐出ヘッド用基板の製造方法。 - 前記電気配線は、前記液体吐出口の複数によって形成される液体吐出口列に沿って形成されていることを特徴とする請求項1に記載の液体吐出ヘッド用基板の製造方法。
- 前記電気配線は、前記液体吐出口へ供給する液体供給口に沿って形成されていることを特徴とする請求項1または2に記載の液体吐出ヘッド用基板の製造方法。
- 前記電気配線の断面形状は、下方に向かって広がる斜面を有する台形状に形成されていることを特徴とする請求項1ないし3のいずれかに記載の液体吐出ヘッド用基板の製造方法。
- 前記電気配線を形成する工程の後に、当該電気配線の上方を覆う樹脂層を形成する工程と、当該樹脂層を介して前記液体吐出口と該液体吐出口へ液体を案内する液体流路とを形成するための液路形成層を形成する工程を有することを特徴とする請求項1ないし4のいずれかに記載の液体吐出ヘッド用基板の製造方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004342245A JP4617145B2 (ja) | 2003-12-16 | 2004-11-26 | 液体吐出ヘッド用基板の製造方法 |
US11/006,615 US7255426B2 (en) | 2003-12-16 | 2004-12-08 | Substrate for liquid discharge head, liquid discharge head using substrate for liquid discharge head and method of manufacturing the same |
DE602004020043T DE602004020043D1 (de) | 2003-12-16 | 2004-12-14 | Substrat für einen Flüssigkeitsausstosskopf, Flüssigkeitsausstosskopf und dazugehöriges Herstellungsverfahren |
EP04029553A EP1543977B1 (en) | 2003-12-16 | 2004-12-14 | Substrate for liquid discharge head, liquid discharge head using substrate for liquid discharge head and method of manufacturing the same |
CNB2004101022235A CN100376400C (zh) | 2003-12-16 | 2004-12-16 | 液体排出头用基板、液体排出头和其制造方法 |
US11/746,251 US7338150B2 (en) | 2003-12-16 | 2007-05-09 | Substrate for liquid discharge head, liquid discharge head using substrate for liquid discharge head and method of manufacturing the same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003417703 | 2003-12-16 | ||
JP2004342245A JP4617145B2 (ja) | 2003-12-16 | 2004-11-26 | 液体吐出ヘッド用基板の製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005199701A JP2005199701A (ja) | 2005-07-28 |
JP2005199701A5 JP2005199701A5 (ja) | 2007-11-22 |
JP4617145B2 true JP4617145B2 (ja) | 2011-01-19 |
Family
ID=34525517
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004342245A Expired - Fee Related JP4617145B2 (ja) | 2003-12-16 | 2004-11-26 | 液体吐出ヘッド用基板の製造方法 |
Country Status (5)
Country | Link |
---|---|
US (2) | US7255426B2 (ja) |
EP (1) | EP1543977B1 (ja) |
JP (1) | JP4617145B2 (ja) |
CN (1) | CN100376400C (ja) |
DE (1) | DE602004020043D1 (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5897930A (en) * | 1996-12-31 | 1999-04-27 | Minnesota Mining And Manufacturing Company | Multiple embossed webs |
JP4865309B2 (ja) * | 2005-11-29 | 2012-02-01 | キヤノン株式会社 | インクジェット記録ヘッド用基板の製造方法 |
JP4886187B2 (ja) * | 2004-12-15 | 2012-02-29 | キヤノン株式会社 | インクジェット記録ヘッド用基板および該基板を用いるインクジェット記録ヘッド |
JP4845415B2 (ja) * | 2005-04-18 | 2011-12-28 | キヤノン株式会社 | インクジェット記録ヘッド |
US7614726B2 (en) * | 2005-12-19 | 2009-11-10 | Canon Kabushiki Kaisha | Recording head chip, recording head employing recording head chip, and recording apparatus employing recording head |
US8438729B2 (en) | 2006-03-09 | 2013-05-14 | Canon Kabushiki Kaisha | Method of producing liquid discharge head |
JP5008448B2 (ja) * | 2007-04-20 | 2012-08-22 | キヤノン株式会社 | インクジェット記録ヘッド用の基板の製造方法 |
JP5147282B2 (ja) * | 2007-05-02 | 2013-02-20 | キヤノン株式会社 | インクジェット記録用基板、該基板を備えた記録ヘッド及び記録装置 |
US8152279B2 (en) | 2008-06-18 | 2012-04-10 | Canon Kabushiki Kaisha | Liquid ejection head having substrate with nickel-containing layer |
JP2010000632A (ja) | 2008-06-18 | 2010-01-07 | Canon Inc | インクジェットヘッド用基板および該基板を具えるインクジェットヘッド |
US8291576B2 (en) | 2008-06-18 | 2012-10-23 | Canon Kabushiki Kaisha | Method of manufacturing liquid ejection head |
JP5335611B2 (ja) * | 2009-08-18 | 2013-11-06 | キヤノン株式会社 | 液体吐出ヘッド及び液体吐出ヘッドの製造方法 |
JP5233937B2 (ja) * | 2009-09-29 | 2013-07-10 | ブラザー工業株式会社 | 液体吐出ヘッドの製造方法及び液体吐出ヘッド |
JP5596962B2 (ja) * | 2009-11-18 | 2014-09-24 | キヤノン株式会社 | 液体吐出ヘッド用基板の製造方法及び液体吐出ヘッドの製造方法 |
CN103609007A (zh) * | 2011-07-28 | 2014-02-26 | 三菱电机株式会社 | 旋转电机 |
JP5921186B2 (ja) * | 2011-12-26 | 2016-05-24 | キヤノン株式会社 | インクジェットヘッド基板の加工方法 |
JP7191669B2 (ja) | 2018-12-17 | 2022-12-19 | キヤノン株式会社 | 液体吐出ヘッド用基板およびその製造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05235200A (ja) * | 1992-02-24 | 1993-09-10 | Ibiden Co Ltd | 電子部品搭載用基板 |
JPH10315469A (ja) * | 1997-05-23 | 1998-12-02 | Tec Corp | インクジェットプリンタヘッド及びその製造方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0344809B1 (en) * | 1988-06-03 | 1994-08-31 | Canon Kabushiki Kaisha | Liquid emission recording head, substrate therefor and liquid emission recording apparatus utilizing said head |
JP2840271B2 (ja) * | 1989-01-27 | 1998-12-24 | キヤノン株式会社 | 記録ヘッド |
CA2075097C (en) * | 1991-08-02 | 2000-03-28 | Hiroyuki Ishinaga | Recording apparatus, recording head and substrate therefor |
US5648806A (en) * | 1992-04-02 | 1997-07-15 | Hewlett-Packard Company | Stable substrate structure for a wide swath nozzle array in a high resolution inkjet printer |
EP0622235B1 (en) * | 1993-04-30 | 1997-07-30 | Hewlett-Packard Company | Reliable contact pad arrangement on plastic print cartridge |
US6174046B1 (en) * | 1994-10-06 | 2001-01-16 | Hewlett-Packard Company | Reliable contact pad arrangement on plastic print cartridge |
GB9626686D0 (en) * | 1996-12-23 | 1997-02-12 | Domino Printing Sciences Plc | Continuous inkjet printer |
US6155674A (en) | 1997-03-04 | 2000-12-05 | Hewlett-Packard Company | Structure to effect adhesion between substrate and ink barrier in ink jet printhead |
EP1172212B1 (en) * | 2000-07-11 | 2007-02-28 | Samsung Electronics Co., Ltd. | Bubble-jet type ink-jet printhead |
CN1408548A (zh) * | 2001-09-28 | 2003-04-09 | 飞赫科技股份有限公司 | 压电式喷墨打印头及其制造方法 |
CN1218616C (zh) * | 2002-04-26 | 2005-09-07 | 国际联合科技股份有限公司 | 电镀墨水匣上的软式印刷电路板的方法 |
JP2004050637A (ja) | 2002-07-19 | 2004-02-19 | Canon Inc | インクジェットヘッド用基板、インクジェットヘッド及び該インクジェットヘッドを備えたインクジェット記録装置 |
KR100472485B1 (ko) * | 2002-12-20 | 2005-03-09 | 삼성전자주식회사 | 잉크젯 프린트헤드 및 그 제조방법 |
-
2004
- 2004-11-26 JP JP2004342245A patent/JP4617145B2/ja not_active Expired - Fee Related
- 2004-12-08 US US11/006,615 patent/US7255426B2/en not_active Expired - Fee Related
- 2004-12-14 DE DE602004020043T patent/DE602004020043D1/de active Active
- 2004-12-14 EP EP04029553A patent/EP1543977B1/en not_active Expired - Fee Related
- 2004-12-16 CN CNB2004101022235A patent/CN100376400C/zh not_active Expired - Fee Related
-
2007
- 2007-05-09 US US11/746,251 patent/US7338150B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05235200A (ja) * | 1992-02-24 | 1993-09-10 | Ibiden Co Ltd | 電子部品搭載用基板 |
JPH10315469A (ja) * | 1997-05-23 | 1998-12-02 | Tec Corp | インクジェットプリンタヘッド及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
EP1543977B1 (en) | 2009-03-18 |
CN100376400C (zh) | 2008-03-26 |
US7338150B2 (en) | 2008-03-04 |
US20070206061A1 (en) | 2007-09-06 |
US20050128254A1 (en) | 2005-06-16 |
CN1628984A (zh) | 2005-06-22 |
JP2005199701A (ja) | 2005-07-28 |
US7255426B2 (en) | 2007-08-14 |
EP1543977A1 (en) | 2005-06-22 |
DE602004020043D1 (de) | 2009-04-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4617145B2 (ja) | 液体吐出ヘッド用基板の製造方法 | |
US5576748A (en) | Recording head with through-hole wiring connection which is disposed within the liquid chamber | |
KR20040033183A (ko) | 잉크젯 프린트헤드 및 그 제조방법 | |
KR20060050415A (ko) | 잉크 제트 헤드 회로 보드, 그 제조 방법 및 그를 사용한잉크 제트 헤드 | |
JP5355223B2 (ja) | 液体吐出ヘッド | |
US4835553A (en) | Thermal ink jet printhead with increased drop generation rate | |
JP5065453B2 (ja) | 液体吐出ヘッド用基板及びその製造方法及び、液体吐出ヘッド用基板を用いた液体吐出ヘッド及びその製造方法 | |
US8256878B2 (en) | Substrate for ink ejection heads, ink ejection head, method of manufacturing substrate, and method of manufacturing ink ejection head | |
JP5008448B2 (ja) | インクジェット記録ヘッド用の基板の製造方法 | |
JP5464919B2 (ja) | 液体吐出ヘッドの製造方法 | |
JP7191669B2 (ja) | 液体吐出ヘッド用基板およびその製造方法 | |
JP3970016B2 (ja) | インクジェット記録ヘッド及びインクジェット記録装置 | |
US7901045B2 (en) | Ink jet recording head and method for manufacturing the same | |
JP4107496B2 (ja) | インクジェットプリントヘッド及びその製造方法 | |
JP2007269009A (ja) | 液体吐出ヘッド及びその製造方法 | |
JP2010143116A (ja) | 記録ヘッド、インクジェット記録装置および半導体デバイス | |
JP5171377B2 (ja) | 回路基板及び液体吐出装置 | |
JP5341688B2 (ja) | 液体吐出ヘッド及びその製造方法 | |
JP2001038919A (ja) | インクジェットヘッドの製造方法 | |
JP2006088676A (ja) | インクジェット記録ヘッド、インクジェット記録装置及びインクジェット記録ヘッドの製造方法 | |
KR100421026B1 (ko) | 잉크젯 프린트헤드 제조방법 | |
JP2005161763A (ja) | インクジェット記録ヘッドの製造方法 | |
JP2010000633A (ja) | インクジェット記録ヘッド用基板、インクジェット記録ヘッドおよびインクジェット記録ヘッドの製造方法 | |
JPH07314682A (ja) | インクジェット記録ヘッドおよびその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20071010 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20071010 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20100201 |
|
RD01 | Notification of change of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7421 Effective date: 20100630 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100720 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100916 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20101019 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20101025 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4617145 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20131029 Year of fee payment: 3 |
|
LAPS | Cancellation because of no payment of annual fees |