JP4615813B2 - 化学機械平坦化用の研磨パッド - Google Patents

化学機械平坦化用の研磨パッド Download PDF

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Publication number
JP4615813B2
JP4615813B2 JP2001587968A JP2001587968A JP4615813B2 JP 4615813 B2 JP4615813 B2 JP 4615813B2 JP 2001587968 A JP2001587968 A JP 2001587968A JP 2001587968 A JP2001587968 A JP 2001587968A JP 4615813 B2 JP4615813 B2 JP 4615813B2
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JP
Japan
Prior art keywords
pad
polishing
kel
polishing pad
modulus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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JP2001587968A
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English (en)
Japanese (ja)
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JP2004507076A5 (enExample
JP2004507076A (ja
Inventor
ヴィシュウォナサン，アラン
ジェームズ，デービッド・ビー
クック，リー・メルボルン
ピーター・エー バーク，
シドナー，デービッド
ソォー，ヨセフ・ケー
ロバーツ，ジョン・ブイ・エイチ
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DuPont Electronic Materials Holding Inc
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DuPont Electronic Materials Holding Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Application filed by DuPont Electronic Materials Holding Inc filed Critical DuPont Electronic Materials Holding Inc
Publication of JP2004507076A publication Critical patent/JP2004507076A/ja
Publication of JP2004507076A5 publication Critical patent/JP2004507076A5/ja
Application granted granted Critical
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Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2001587968A 2000-05-27 2001-05-24 化学機械平坦化用の研磨パッド Expired - Lifetime JP4615813B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US20793800P 2000-05-27 2000-05-27
US22209900P 2000-07-28 2000-07-28
PCT/US2001/016869 WO2001091971A1 (en) 2000-05-27 2001-05-24 Polishing pads for chemical mechanical planarization

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2008245811A Division JP5016576B2 (ja) 2000-05-27 2008-09-25 化学機械平坦化用の研磨パッド

Publications (3)

Publication Number Publication Date
JP2004507076A JP2004507076A (ja) 2004-03-04
JP2004507076A5 JP2004507076A5 (enExample) 2006-01-05
JP4615813B2 true JP4615813B2 (ja) 2011-01-19

Family

ID=26902748

Family Applications (12)

Application Number Title Priority Date Filing Date
JP2001587969A Expired - Lifetime JP4959901B2 (ja) 2000-05-27 2001-05-24 化学機械平坦化用溝付き研磨パッド
JP2001587968A Expired - Lifetime JP4615813B2 (ja) 2000-05-27 2001-05-24 化学機械平坦化用の研磨パッド
JP2008245811A Expired - Lifetime JP5016576B2 (ja) 2000-05-27 2008-09-25 化学機械平坦化用の研磨パッド
JP2011199659A Expired - Lifetime JP5584666B2 (ja) 2000-05-27 2011-09-13 化学機械平坦化用溝付き研磨パッド
JP2012020977A Expired - Lifetime JP5544381B2 (ja) 2000-05-27 2012-02-02 化学機械平坦化用の研磨パッド
JP2013156497A Expired - Lifetime JP5767280B2 (ja) 2000-05-27 2013-07-29 化学機械平坦化用溝付き研磨パッド
JP2013235414A Expired - Lifetime JP5993360B2 (ja) 2000-05-27 2013-11-13 化学機械平坦化用の研磨パッド
JP2014264802A Pending JP2015092610A (ja) 2000-05-27 2014-12-26 化学機械平坦化用溝付き研磨パッド
JP2015121009A Expired - Lifetime JP6141359B2 (ja) 2000-05-27 2015-06-16 化学機械平坦化用の研磨パッド
JP2016217133A Expired - Lifetime JP6375352B2 (ja) 2000-05-27 2016-11-07 化学機械平坦化用の研磨パッド
JP2018058015A Pending JP2018117150A (ja) 2000-05-27 2018-03-26 化学機械平坦化用の研磨パッド
JP2018104803A Expired - Lifetime JP6655848B2 (ja) 2000-05-27 2018-05-31 化学機械平坦化用の研磨パッド

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2001587969A Expired - Lifetime JP4959901B2 (ja) 2000-05-27 2001-05-24 化学機械平坦化用溝付き研磨パッド

Family Applications After (10)

Application Number Title Priority Date Filing Date
JP2008245811A Expired - Lifetime JP5016576B2 (ja) 2000-05-27 2008-09-25 化学機械平坦化用の研磨パッド
JP2011199659A Expired - Lifetime JP5584666B2 (ja) 2000-05-27 2011-09-13 化学機械平坦化用溝付き研磨パッド
JP2012020977A Expired - Lifetime JP5544381B2 (ja) 2000-05-27 2012-02-02 化学機械平坦化用の研磨パッド
JP2013156497A Expired - Lifetime JP5767280B2 (ja) 2000-05-27 2013-07-29 化学機械平坦化用溝付き研磨パッド
JP2013235414A Expired - Lifetime JP5993360B2 (ja) 2000-05-27 2013-11-13 化学機械平坦化用の研磨パッド
JP2014264802A Pending JP2015092610A (ja) 2000-05-27 2014-12-26 化学機械平坦化用溝付き研磨パッド
JP2015121009A Expired - Lifetime JP6141359B2 (ja) 2000-05-27 2015-06-16 化学機械平坦化用の研磨パッド
JP2016217133A Expired - Lifetime JP6375352B2 (ja) 2000-05-27 2016-11-07 化学機械平坦化用の研磨パッド
JP2018058015A Pending JP2018117150A (ja) 2000-05-27 2018-03-26 化学機械平坦化用の研磨パッド
JP2018104803A Expired - Lifetime JP6655848B2 (ja) 2000-05-27 2018-05-31 化学機械平坦化用の研磨パッド

Country Status (6)

Country Link
EP (2) EP1284841B1 (enExample)
JP (12) JP4959901B2 (enExample)
KR (2) KR100770852B1 (enExample)
DE (2) DE60114183T2 (enExample)
TW (2) TW528646B (enExample)
WO (2) WO2001091971A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200066316A (ko) * 2017-10-12 2020-06-09 후지보홀딩스가부시끼가이샤 연마 패드 및 그 제조 방법

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KR20200066316A (ko) * 2017-10-12 2020-06-09 후지보홀딩스가부시끼가이샤 연마 패드 및 그 제조 방법
KR102587715B1 (ko) 2017-10-12 2023-10-12 후지보홀딩스가부시끼가이샤 연마 패드 및 그 제조 방법
EP3695936B1 (en) * 2017-10-12 2024-08-28 Fujibo Holdings, Inc. Polishing pad and method for manufacturing the same

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JP5544381B2 (ja) 2014-07-09
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