JP4605272B2 - Ｃｏｆ基板 - Google Patents

Ｃｏｆ基板 Download PDF

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Publication number
JP4605272B2
JP4605272B2 JP2008213921A JP2008213921A JP4605272B2 JP 4605272 B2 JP4605272 B2 JP 4605272B2 JP 2008213921 A JP2008213921 A JP 2008213921A JP 2008213921 A JP2008213921 A JP 2008213921A JP 4605272 B2 JP4605272 B2 JP 4605272B2
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JP
Japan
Prior art keywords
cof substrate
orthogonal
insulating film
bending
bending direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2008213921A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010050330A (ja
Inventor
由裕 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal Mining Co Ltd
Original Assignee
Sumitomo Metal Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Priority to JP2008213921A priority Critical patent/JP4605272B2/ja
Priority to TW098122795A priority patent/TWI398937B/zh
Priority to KR1020090069256A priority patent/KR101061278B1/ko
Publication of JP2010050330A publication Critical patent/JP2010050330A/ja
Application granted granted Critical
Publication of JP4605272B2 publication Critical patent/JP4605272B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structure Of Printed Boards (AREA)
JP2008213921A 2008-08-22 2008-08-22 Ｃｏｆ基板 Active JP4605272B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008213921A JP4605272B2 (ja) 2008-08-22 2008-08-22 Ｃｏｆ基板
TW098122795A TWI398937B (zh) 2008-08-22 2009-07-06 Flip chip substrate
KR1020090069256A KR101061278B1 (ko) 2008-08-22 2009-07-29 Ｃｏｆ 기판

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008213921A JP4605272B2 (ja) 2008-08-22 2008-08-22 Ｃｏｆ基板

Publications (2)

Publication Number Publication Date
JP2010050330A JP2010050330A (ja) 2010-03-04
JP4605272B2 true JP4605272B2 (ja) 2011-01-05

Family

ID=42067172

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008213921A Active JP4605272B2 (ja) 2008-08-22 2008-08-22 Ｃｏｆ基板

Country Status (3)

Country Link
JP (1) JP4605272B2 (ko)
KR (1) KR101061278B1 (ko)
TW (1) TWI398937B (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101979361B1 (ko) * 2012-10-25 2019-05-17 삼성디스플레이 주식회사 칩 온 필름 및 이를 포함하는 표시 장치
KR102059942B1 (ko) 2013-07-24 2019-12-30 삼성디스플레이 주식회사 유기 발광 표시 장치
KR102194822B1 (ko) 2014-01-16 2020-12-24 삼성디스플레이 주식회사 디스플레이 장치
JP6301738B2 (ja) * 2014-05-29 2018-03-28 京セラ株式会社 電子素子搭載用パッケージおよび電子装置
CN114845464A (zh) * 2022-05-20 2022-08-02 广州华星光电半导体显示技术有限公司 覆晶薄膜及其补偿方法、显示装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001351953A (ja) * 2001-04-09 2001-12-21 Seiko Epson Corp テープキャリア
JP2002232086A (ja) * 2001-02-06 2002-08-16 Matsushita Electric Ind Co Ltd フレキシブル基板
JP2006294929A (ja) * 2005-04-12 2006-10-26 Fuji Photo Film Co Ltd フレキシブルプリント配線板、及び、カメラモジュール
JP2008028396A (ja) * 2006-07-20 2008-02-07 Samsung Electronics Co Ltd Ｃｏｆ型半導体パッケージ

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3329073B2 (ja) * 1993-06-04 2002-09-30 セイコーエプソン株式会社 半導体装置およびその製造方法
KR100771890B1 (ko) 2006-07-20 2007-11-01 삼성전자주식회사 씨오에프(ｃｏｆ)형 반도체 패키지

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002232086A (ja) * 2001-02-06 2002-08-16 Matsushita Electric Ind Co Ltd フレキシブル基板
JP2001351953A (ja) * 2001-04-09 2001-12-21 Seiko Epson Corp テープキャリア
JP2006294929A (ja) * 2005-04-12 2006-10-26 Fuji Photo Film Co Ltd フレキシブルプリント配線板、及び、カメラモジュール
JP2008028396A (ja) * 2006-07-20 2008-02-07 Samsung Electronics Co Ltd Ｃｏｆ型半導体パッケージ

Also Published As

Publication number Publication date
KR101061278B1 (ko) 2011-08-31
JP2010050330A (ja) 2010-03-04
TW201023321A (en) 2010-06-16
TWI398937B (zh) 2013-06-11
KR20100023739A (ko) 2010-03-04

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