JP4605225B2 - 回路接続材料、これを用いた回路部材の接続構造及びその製造方法 - Google Patents

回路接続材料、これを用いた回路部材の接続構造及びその製造方法 Download PDF

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JP4605225B2
JP4605225B2 JP2007532716A JP2007532716A JP4605225B2 JP 4605225 B2 JP4605225 B2 JP 4605225B2 JP 2007532716 A JP2007532716 A JP 2007532716A JP 2007532716 A JP2007532716 A JP 2007532716A JP 4605225 B2 JP4605225 B2 JP 4605225B2
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circuit
circuit member
particles
connection structure
connection
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JPWO2007099965A1 (ja
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哲之 白川
潤 竹田津
勝 田中
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Showa Denko Materials Co Ltd
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Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Combinations Of Printed Boards (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Multi-Conductor Connections (AREA)
  • Wire Bonding (AREA)
  • Non-Insulated Conductors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
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US8124232B2 (en) * 2007-10-22 2012-02-28 Nippon Chemical Industrial Co., Ltd. Coated conductive powder and conductive adhesive using the same
JP5304019B2 (ja) * 2008-05-14 2013-10-02 日立化成株式会社 回路接続材料
KR20110019392A (ko) * 2008-07-01 2011-02-25 히다치 가세고교 가부시끼가이샤 회로 접속 재료 및 회로 접속 구조체
JP5375374B2 (ja) * 2009-07-02 2013-12-25 日立化成株式会社 回路接続材料及び回路接続構造体
KR101374927B1 (ko) * 2009-11-17 2014-03-14 히타치가세이가부시끼가이샤 회로 접속 재료, 이를 이용한 접속 구조체 및 가압착 방법
JP6632618B2 (ja) * 2015-05-28 2020-01-22 タツタ電線株式会社 実装用導電性ペースト
WO2019194133A1 (ja) * 2018-04-04 2019-10-10 積水化学工業株式会社 絶縁性粒子付き導電性粒子、絶縁性粒子付き導電性粒子の製造方法、導電材料及び接続構造体
CN111902884B (zh) * 2018-04-04 2023-03-14 积水化学工业株式会社 导电性粒子、其制造方法、导电材料及连接结构体

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JPH04259766A (ja) * 1991-02-14 1992-09-16 Hitachi Chem Co Ltd 回路の接続部材
JPH07247467A (ja) * 1994-03-10 1995-09-26 Casio Comput Co Ltd 異方導電性接着剤およびそれを用いた導電接続構造
JPH1077460A (ja) * 1996-09-02 1998-03-24 Sony Corp 異方性導電膜
JP2000251536A (ja) * 1999-03-04 2000-09-14 Toshiba Chem Corp 異方性導電接着剤
JP2005044773A (ja) * 2003-07-07 2005-02-17 Sekisui Chem Co Ltd 被覆導電性粒子、異方性導電材料及び導電接続構造体
JP2005197091A (ja) * 2004-01-07 2005-07-21 Hitachi Chem Co Ltd 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法
JP2005197089A (ja) * 2004-01-07 2005-07-21 Hitachi Chem Co Ltd 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04259766A (ja) * 1991-02-14 1992-09-16 Hitachi Chem Co Ltd 回路の接続部材
JPH07247467A (ja) * 1994-03-10 1995-09-26 Casio Comput Co Ltd 異方導電性接着剤およびそれを用いた導電接続構造
JPH1077460A (ja) * 1996-09-02 1998-03-24 Sony Corp 異方性導電膜
JP2000251536A (ja) * 1999-03-04 2000-09-14 Toshiba Chem Corp 異方性導電接着剤
JP2005044773A (ja) * 2003-07-07 2005-02-17 Sekisui Chem Co Ltd 被覆導電性粒子、異方性導電材料及び導電接続構造体
JP2005197091A (ja) * 2004-01-07 2005-07-21 Hitachi Chem Co Ltd 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法
JP2005197089A (ja) * 2004-01-07 2005-07-21 Hitachi Chem Co Ltd 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法

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KR20080106308A (ko) 2008-12-04

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