TWI348166B - - Google Patents

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Publication number
TWI348166B
TWI348166B TW096106861A TW96106861A TWI348166B TW I348166 B TWI348166 B TW I348166B TW 096106861 A TW096106861 A TW 096106861A TW 96106861 A TW96106861 A TW 96106861A TW I348166 B TWI348166 B TW I348166B
Authority
TW
Taiwan
Application number
TW096106861A
Other versions
TW200739612A (en
Inventor
Tetsuyuki Shirakawa
Jun Taketatsu
Masaru Tanaka
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200739612A publication Critical patent/TW200739612A/zh
Application granted granted Critical
Publication of TWI348166B publication Critical patent/TWI348166B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
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    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Combinations Of Printed Boards (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Insulated Conductors (AREA)
  • Wire Bonding (AREA)
  • Multi-Conductor Connections (AREA)
TW096106861A 2006-02-27 2007-02-27 Circuit connecting material, connection structure for circuit member using the same, and method for producing such connection structure TW200739612A (en)

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US8124232B2 (en) * 2007-10-22 2012-02-28 Nippon Chemical Industrial Co., Ltd. Coated conductive powder and conductive adhesive using the same
JP5304019B2 (ja) * 2008-05-14 2013-10-02 日立化成株式会社 回路接続材料
WO2010001900A1 (ja) * 2008-07-01 2010-01-07 日立化成工業株式会社 回路接続材料及び回路接続構造体
JP5375374B2 (ja) * 2009-07-02 2013-12-25 日立化成株式会社 回路接続材料及び回路接続構造体
CN104877611B (zh) * 2009-11-17 2020-04-10 日立化成株式会社 电路连接材料、使用其的连接结构体、临时压接方法以及应用
JP6632618B2 (ja) * 2015-05-28 2020-01-22 タツタ電線株式会社 実装用導電性ペースト
KR102674579B1 (ko) * 2018-04-04 2024-06-13 세키스이가가쿠 고교가부시키가이샤 절연성 입자를 갖는 도전성 입자, 절연성 입자를 갖는 도전성 입자의 제조 방법, 도전 재료 및 접속 구조체
CN111971757B (zh) * 2018-04-04 2023-03-14 积水化学工业株式会社 导电性粒子、其制造方法、导电材料及连接结构体

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JP2748705B2 (ja) * 1991-02-14 1998-05-13 日立化成工業株式会社 回路の接続部材
JP2737647B2 (ja) * 1994-03-10 1998-04-08 カシオ計算機株式会社 異方導電性接着剤およびそれを用いた導電接続構造
JPH1077460A (ja) * 1996-09-02 1998-03-24 Sony Corp 異方性導電膜
JP2000251536A (ja) * 1999-03-04 2000-09-14 Toshiba Chem Corp 異方性導電接着剤
JP4387175B2 (ja) * 2003-07-07 2009-12-16 積水化学工業株式会社 被覆導電性粒子、異方性導電材料及び導電接続構造体
JP4380327B2 (ja) * 2004-01-07 2009-12-09 日立化成工業株式会社 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法
JP4380328B2 (ja) * 2004-01-07 2009-12-09 日立化成工業株式会社 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法

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JPWO2007099965A1 (ja) 2009-07-23
KR20080106308A (ko) 2008-12-04

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