JP4603370B2 - 基板上に作製された半導体光デバイスおよびその作製方法 - Google Patents
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- 230000003287 optical effect Effects 0.000 title claims description 53
- 238000000034 method Methods 0.000 title claims description 17
- 238000004519 manufacturing process Methods 0.000 title description 14
- 229910000476 molybdenum oxide Inorganic materials 0.000 claims description 72
- PQQKPALAQIIWST-UHFFFAOYSA-N oxomolybdenum Chemical compound [Mo]=O PQQKPALAQIIWST-UHFFFAOYSA-N 0.000 claims description 71
- 229910052710 silicon Inorganic materials 0.000 claims description 19
- 239000010703 silicon Substances 0.000 claims description 19
- 239000013078 crystal Substances 0.000 claims description 17
- 150000001875 compounds Chemical class 0.000 claims description 10
- IPDVFXZDWDPGAA-UHFFFAOYSA-N chromium;oxomolybdenum Chemical compound [Cr].[Mo]=O IPDVFXZDWDPGAA-UHFFFAOYSA-N 0.000 claims description 9
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- 239000000463 material Substances 0.000 description 28
- 229910052751 metal Inorganic materials 0.000 description 21
- 239000002184 metal Substances 0.000 description 21
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 19
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 18
- 229910002601 GaN Inorganic materials 0.000 description 17
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 12
- 238000000151 deposition Methods 0.000 description 11
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- 239000011733 molybdenum Substances 0.000 description 11
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- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 2
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- PFNQVRZLDWYSCW-UHFFFAOYSA-N (fluoren-9-ylideneamino) n-naphthalen-1-ylcarbamate Chemical compound C12=CC=CC=C2C2=CC=CC=C2C1=NOC(=O)NC1=CC=CC2=CC=CC=C12 PFNQVRZLDWYSCW-UHFFFAOYSA-N 0.000 description 1
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 229910005540 GaP Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
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- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
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- -1 tellurium selenide Chemical class 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
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Description
より具体的には、本発明は、窒化ガリウム(GaN)、シリコン・カーバイド(SiC)等の既知の半導体を用いて青色発光デバイスを実現しようとすることに伴う諸問題が解決できる可能性をもつ既存の半導体光デバイスに用いられている材料から成る基板上に作製された新しい半導体を用いた青色発光デバイスの実現に関する。また、既知の半導体で発光可能なGaNの361nmより短い波長の光を放射できる既存の半導体光デバイスに用いられている材料から成る基板上に作製された新しい半導体を用いた短波長発光デバイスの実現に関する。さらには、短波長の光を選択的に吸収し、光−電変換効果を発現する光吸収デバイスに関する。
一般に、光デバイスに用いられる半導体材料は、高純度で結晶性の材料をさし、そのような材料について禁制帯幅等の物性値を測定するが、従来の研究においては、触媒を用途としているため、真空蒸着で作製した試料についての測定結果が示されていると考えられる。真空蒸着で作製した材料は通常非晶質で、構造的に乱れていることは、当業者には良く知られている。更に、真空蒸着で作製される薄膜の厚さは、一般に100nm程度以下と薄く、1μmの厚さの薄膜を形成することは通常ない。そのような薄い材料の場合は、基板の影響を受け、禁制帯幅のような物性値も、薄膜の厚さや基板によって変化することとなる。上述の禁制帯幅の値は、そのような薄い材料を測定して得られたもので、酸化モリブデンの本質的な物性値とは限らない。100nm以上に厚く、かつ高純度の酸化モリブデンについて検討が行なわれなかったのは、酸化モリブデンを発光ダイオードやレーザダイオードのような光デバイスに用いる意図が全くなかったためと考えられる。
(i)純度99.99%のモリブデン板を、純度99.9995%の酸素中で酸化し、その物性を評価するために、550℃で120分間酸化することにより作製された酸化モリブデンの光反射特性を実測した。この試料の酸化形成された酸化モリブデン層の厚さは10.2μmである。結果として、光の吸収は338nm以下の波長で起り、3.66eVという大きな禁制帯幅の値を得た。試料の厚さが10.2μmと厚いことから、基板の影響はなく、この禁制帯幅は酸化モリブデン固有の値と考えられる。
しかしながら、先の出願に係る発明のみでは解決できない上記の課題が残存することから、本願発明者は、さらに酸化モリブデンを既存の材料基板上に比較的低温で作製する技術の開発をおし進め、今回これに成功したものである。
本発明の目的を達成するために、本発明に係る半導体光デバイスは、基本的に、該光デバイスが、IV族元素半導体、III−V族化合物半導体、II−VI族化合物半導体、IV族化合物半導体、有機化合物半導体、金属結晶もしくはそれらの誘導体又はガラスから成る基板上に形成された酸化モリブデンから成る層を有する。
前記光デバイスは、具体的には、光導電デバイス、ホトダイオード、ホトトランジスタ、発光ダイオード、半導体レーザ、太陽電池又はCCDである。
そして、好適には、本発明の発光ダイオードにおいては、前記酸化モリブデンの層と前記n形酸化モリブデンの層の間に、さらに酸化モリブデンのバッファ層がはさみ込まれている。
そして、好適には、前記レーザダイオードにおいて、前記酸化モリブデンの層と前記第1のクラッド層の間に、酸化モリブデンのバッファ層がはさみ込まれている。
さらに、好適には、本発明の半導体光デバイスにおいては、前記基板がシリコンから成り、前記第1および第2のクラッド層は、クロム・モリブデン酸化物の層である。
第2層以後の酸化モリブデンの層は、上述の第1層を形成するのと同様に、気相成長により形成することができる。その際、各層の厚さは堆積速度やターゲット基板およびソース金属板の温度、酸素流量等によって制御できる。また、各層の電気的特性はドーピングを行なったり、ターゲット基板またはソース金属板の温度を変えることにより、制御することができる。更に、ソース金属板の種類を増すことにより、三元以上の混晶半導体層を形成することも可能である。酸化モリブデン又は酸化モリブデンを含む混晶半導体の層は、上述の気相成長の方法により、基板温度700℃以下、多くの場合650℃以下で作成することができる。
2 基板
3 層
4 バッファ層
5 層
6 酸化モリブデン層
7 電極
8 電極
100 レーザダイオード
101 基板
102 層
103 バッファ層
104 クロム・モリブデン酸化物層
105 層
106 クロム・モリブデン酸化物層
107 二酸化シリコン層
108 ストライプ
109 電極層
110 電極
Claims (10)
- 半導体光デバイスであって、
該光デバイスが、IV族元素半導体、III−V族化合物半導体、IV族化合物半導体、有機半導体、もしくはそれらの誘導体又はガラスから成る基板上に、気相堆積法により直接堆積させた酸化モリブデンの結晶層及び酸化モリブデンから成るpn接合を有することを特徴とする半導体光デバイス。 - 請求項1に記載の半導体光デバイスにおいて、
前記光デバイスが、ホトダイオード、ホトトランジスタ、発光ダイオード、半導体レーザ、太陽電池又はCCDである半導体光デバイス。 - 半導体光デバイスであって、
該光デバイスが、IV族元素半導体、III−V族化合物半導体、IV族化合物半導体、有機半導体もしくはそれらの誘導体又はガラスから成る基板上に、気相堆積法により直接堆積させた酸化モリブデンの結晶層を有し、発光又は受光領域に酸化モリブデンを含むことを特徴とする半導体光デバイス。 - 請求項3に記載の半導体光デバイスにおいて、
前記光デバイスが光導電デバイスである半導体光デバイス。 - 請求項1に記載の半導体光デバイスにおいて、
前記半導体光デバイスが発光ダイオードであり、前記酸化モリブデンの層上に、さらにn形酸化モリブデンの層およびその上のp形酸化モリブデンの層を含むものである半導体光デバイス。 - 請求項5に記載の半導体光デバイスにおいて、
前記酸化モリブデンの層と前記n形酸化モリブデンの層の間に、さらに酸化モリブデンのバッファ層がはさみ込まれている半導体光デバイス。 - 請求項1に記載の半導体光デバイスにおいて、
前記半導体光デバイスがレーザダイオードであり、前記酸化モリブデンの層上に形成される積層をさらに含み、この積層が、酸化モリブデンより禁制帯幅が大きいn形の半導体の第1のクラッド層と、その上のp形酸化モリブデンの活性層と、さらにその上の酸化モリブデンより禁制帯幅が大きくp形の半導体の第2のクラッド層と、を含むものである半導体光デバイス。 - 請求項7に記載の半導体光デバイスにおいて、
前記酸化モリブデンの層と前記第1のクラッド層の間に、酸化モリブデンのバッファ層がはさみ込まれている半導体光デバイス。 - 請求項5ないし8のいずれかに記載の半導体光デバイスにおいて、
前記基板がシリコンから成るものである半導体光デバイス。 - 請求項7又は8のいずれかに記載の半導体光デバイスにおいて、
前記第1および第2のクラッド層が、クロム・モリブデン酸化物の層である半導体光デバイス。
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DE06000615T DE06000615T1 (de) | 2005-01-18 | 2006-01-12 | Photonische Vorrichtung mit Molybdänoxid und Herstellungsverfahren |
EP06000615A EP1681730A3 (en) | 2005-01-18 | 2006-01-12 | Photonic device comprising molybdenum oxide and method of fabrication |
US11/330,154 US7671378B2 (en) | 2005-01-18 | 2006-01-12 | Photonic devices formed on substrates and their fabrication methods |
TW095101453A TWI392109B (zh) | 2005-01-18 | 2006-01-13 | 形成於基底上之光子裝置及其製造方法 |
KR1020060004305A KR101247415B1 (ko) | 2005-01-18 | 2006-01-16 | 기판 상에 제작된 반도체 광 디바이스 및 그 제작 방법 |
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WO2010062643A1 (en) | 2008-10-28 | 2010-06-03 | The Regents Of The University Of Michigan | Stacked white oled having separate red, green and blue sub-elements |
US8895107B2 (en) | 2008-11-06 | 2014-11-25 | Veeco Instruments Inc. | Chemical vapor deposition with elevated temperature gas injection |
JP5655666B2 (ja) * | 2011-03-31 | 2015-01-21 | 大日本印刷株式会社 | 有機エレクトロルミネッセンス素子、有機エレクトロルミネッセンス素子の製造方法および電子注入輸送層用塗工液 |
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US4965594A (en) * | 1986-02-28 | 1990-10-23 | Canon Kabushiki Kaisha | Liquid jet recording head with laminated heat resistive layers on a support member |
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EP1681730A2 (en) | 2006-07-19 |
US7671378B2 (en) | 2010-03-02 |
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