JP4597295B2 - 半導体装置およびその作製方法 - Google Patents
半導体装置およびその作製方法 Download PDFInfo
- Publication number
- JP4597295B2 JP4597295B2 JP36628199A JP36628199A JP4597295B2 JP 4597295 B2 JP4597295 B2 JP 4597295B2 JP 36628199 A JP36628199 A JP 36628199A JP 36628199 A JP36628199 A JP 36628199A JP 4597295 B2 JP4597295 B2 JP 4597295B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- insulating film
- semiconductor
- gate insulating
- silicon nitride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Landscapes
- Liquid Crystal (AREA)
- Formation Of Insulating Films (AREA)
- Thin Film Transistor (AREA)
- Dram (AREA)
- Shift Register Type Memory (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP36628199A JP4597295B2 (ja) | 1998-12-25 | 1999-12-24 | 半導体装置およびその作製方法 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10-370170 | 1998-12-25 | ||
JP37017098 | 1998-12-25 | ||
JP36628199A JP4597295B2 (ja) | 1998-12-25 | 1999-12-24 | 半導体装置およびその作製方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2000243974A JP2000243974A (ja) | 2000-09-08 |
JP2000243974A5 JP2000243974A5 (ko) | 2007-05-10 |
JP4597295B2 true JP4597295B2 (ja) | 2010-12-15 |
Family
ID=26581766
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP36628199A Expired - Lifetime JP4597295B2 (ja) | 1998-12-25 | 1999-12-24 | 半導体装置およびその作製方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4597295B2 (ko) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG101479A1 (en) * | 2000-09-14 | 2004-01-30 | Semiconductor Energy Lab | Semiconductor device and manufacturing method thereof |
US6509616B2 (en) * | 2000-09-29 | 2003-01-21 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and its manufacturing method |
JP3643067B2 (ja) * | 2001-10-11 | 2005-04-27 | 株式会社半導体エネルギー研究所 | 半導体表示装置の設計方法 |
CN103928476A (zh) | 2008-10-03 | 2014-07-16 | 株式会社半导体能源研究所 | 显示装置及其制造方法 |
US9171640B2 (en) * | 2009-10-09 | 2015-10-27 | Semiconductor Energy Laboratory Co., Ltd. | Shift register and display device |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2903134B2 (ja) * | 1990-11-10 | 1999-06-07 | 株式会社 半導体エネルギー研究所 | 半導体装置 |
JPH0818053A (ja) * | 1994-06-28 | 1996-01-19 | Mitsubishi Electric Corp | 薄膜トランジスタ及びその製造方法 |
JP3420653B2 (ja) * | 1995-03-16 | 2003-06-30 | 株式会社東芝 | 薄膜トランジスタおよび液晶表示素子 |
-
1999
- 1999-12-24 JP JP36628199A patent/JP4597295B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2000243974A (ja) | 2000-09-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5244885B2 (ja) | 半導体装置の作製方法 | |
US6380007B1 (en) | Semiconductor device and manufacturing method of the same | |
US6579736B2 (en) | Semiconductor device and method of manufacturing thereof | |
US9097953B2 (en) | Semiconductor device, and method of forming the same | |
JP4536187B2 (ja) | 半導体装置およびその作製方法 | |
JP4641581B2 (ja) | 半導体装置およびその作製方法 | |
JP2000315798A (ja) | 半導体装置およびその作製方法 | |
JP4776766B2 (ja) | 半導体装置の作製方法 | |
EP1017108B1 (en) | Semiconductor devices and methods of manufacturing the same | |
JP4357672B2 (ja) | 露光装置および露光方法および半導体装置の作製方法 | |
JP4531177B2 (ja) | 半導体装置の作製方法 | |
JP4939689B2 (ja) | 半導体装置およびその作製方法 | |
JP4540776B2 (ja) | 半導体装置および電子機器 | |
JP4656685B2 (ja) | 半導体装置 | |
JP4986332B2 (ja) | 半導体装置の作製方法 | |
JP4597295B2 (ja) | 半導体装置およびその作製方法 | |
JP4896286B2 (ja) | 半導体装置の作製方法 | |
JP2000252473A (ja) | 配線およびその作製方法、半導体装置およびその作製方法 | |
JP4850326B2 (ja) | 半導体装置の作製方法 | |
JP4545260B2 (ja) | 半導体装置の作製方法 | |
JP4641586B2 (ja) | 半導体装置の作製方法 | |
JP4472082B2 (ja) | 半導体装置の作製方法 | |
JP4700159B2 (ja) | 半導体装置の作製方法 | |
JP4700510B2 (ja) | 半導体装置の作製方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20061220 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20061220 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20100921 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20100922 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20100922 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4597295 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20131001 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20131001 Year of fee payment: 3 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term |