JP4596587B2 - リニア基板ポリシング・オペレーションのｉｎ−ｓｉｔｕモニタリング - Google Patents

リニア基板ポリシング・オペレーションのｉｎ−ｓｉｔｕモニタリング Download PDF

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Publication number
JP4596587B2
JP4596587B2 JP2000028219A JP2000028219A JP4596587B2 JP 4596587 B2 JP4596587 B2 JP 4596587B2 JP 2000028219 A JP2000028219 A JP 2000028219A JP 2000028219 A JP2000028219 A JP 2000028219A JP 4596587 B2 JP4596587 B2 JP 4596587B2
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JP
Japan
Prior art keywords
polishing
sheet
abrasive
substrate
abrasive sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2000028219A
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English (en)
Japanese (ja)
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JP2000225564A (ja
JP2000225564A5 (enExample
Inventor
シー． レデカー フレッド
ビラング マヌーチャー
リ シジアン
ソメクー サッソン
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Applied Materials Inc
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Applied Materials Inc
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Publication of JP2000225564A5 publication Critical patent/JP2000225564A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
JP2000028219A 1999-02-04 2000-02-04 リニア基板ポリシング・オペレーションのｉｎ−ｓｉｔｕモニタリング Expired - Fee Related JP4596587B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/244816 1999-02-04
US09/244,816 US6179709B1 (en) 1999-02-04 1999-02-04 In-situ monitoring of linear substrate polishing operations

Publications (3)

Publication Number Publication Date
JP2000225564A JP2000225564A (ja) 2000-08-15
JP2000225564A5 JP2000225564A5 (enExample) 2007-03-22
JP4596587B2 true JP4596587B2 (ja) 2010-12-08

Family

ID=22924218

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000028219A Expired - Fee Related JP4596587B2 (ja) 1999-02-04 2000-02-04 リニア基板ポリシング・オペレーションのｉｎ−ｓｉｔｕモニタリング

Country Status (5)

Country Link
US (4) US6179709B1 (enExample)
EP (1) EP1025954A3 (enExample)
JP (1) JP4596587B2 (enExample)
KR (1) KR100715083B1 (enExample)
TW (1) TW426580B (enExample)

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TW426580B (en) 2001-03-21
JP2000225564A (ja) 2000-08-15
US20030181137A1 (en) 2003-09-25
US6179709B1 (en) 2001-01-30
US20040198185A1 (en) 2004-10-07
US6991517B2 (en) 2006-01-31
EP1025954A3 (en) 2003-04-16
US6796880B2 (en) 2004-09-28
US6585563B1 (en) 2003-07-01

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