KR100715083B1 - 연마 시트, 기판 연마 장치 및 기판 연마 방법 - Google Patents

연마 시트, 기판 연마 장치 및 기판 연마 방법 Download PDF

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Publication number
KR100715083B1
KR100715083B1 KR1020000005124A KR20000005124A KR100715083B1 KR 100715083 B1 KR100715083 B1 KR 100715083B1 KR 1020000005124 A KR1020000005124 A KR 1020000005124A KR 20000005124 A KR20000005124 A KR 20000005124A KR 100715083 B1 KR100715083 B1 KR 100715083B1
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South Korea
Prior art keywords
polishing
sheet
substrate
region
polishing sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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KR1020000005124A
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English (en)
Korean (ko)
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KR20000057876A (ko
Inventor
프레드씨. 레데커
마누쳐 바이랭
시지안 리
새손 소메크
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
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Publication of KR20000057876A publication Critical patent/KR20000057876A/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
KR1020000005124A 1999-02-04 2000-02-02 연마 시트, 기판 연마 장치 및 기판 연마 방법 Expired - Lifetime KR100715083B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/244,816 US6179709B1 (en) 1999-02-04 1999-02-04 In-situ monitoring of linear substrate polishing operations
US09/244,816 1999-02-04
US9/244,816 1999-02-04

Publications (2)

Publication Number Publication Date
KR20000057876A KR20000057876A (ko) 2000-09-25
KR100715083B1 true KR100715083B1 (ko) 2007-05-07

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020000005124A Expired - Lifetime KR100715083B1 (ko) 1999-02-04 2000-02-02 연마 시트, 기판 연마 장치 및 기판 연마 방법

Country Status (5)

Country Link
US (4) US6179709B1 (enExample)
EP (1) EP1025954A3 (enExample)
JP (1) JP4596587B2 (enExample)
KR (1) KR100715083B1 (enExample)
TW (1) TW426580B (enExample)

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US20030181137A1 (en) 2003-09-25
US6179709B1 (en) 2001-01-30
US20040198185A1 (en) 2004-10-07
JP4596587B2 (ja) 2010-12-08
US6991517B2 (en) 2006-01-31
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US6796880B2 (en) 2004-09-28
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