JP4584385B2 - 基板処理装置および基板処理方法 - Google Patents

基板処理装置および基板処理方法 Download PDF

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Publication number
JP4584385B2
JP4584385B2 JP31878399A JP31878399A JP4584385B2 JP 4584385 B2 JP4584385 B2 JP 4584385B2 JP 31878399 A JP31878399 A JP 31878399A JP 31878399 A JP31878399 A JP 31878399A JP 4584385 B2 JP4584385 B2 JP 4584385B2
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Japan
Prior art keywords
substrate
holding
wafer
etching solution
processing apparatus
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Expired - Fee Related
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JP31878399A
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English (en)
Japanese (ja)
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JP2001118824A5 (https=
JP2001118824A (ja
Inventor
雅視 澤村
克之 三宅
薫 新原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Dainippon Screen Manufacturing Co Ltd
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Screen Holdings Co Ltd
Dainippon Screen Manufacturing Co Ltd
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Priority to JP31878399A priority Critical patent/JP4584385B2/ja
Publication of JP2001118824A publication Critical patent/JP2001118824A/ja
Publication of JP2001118824A5 publication Critical patent/JP2001118824A5/ja
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Publication of JP4584385B2 publication Critical patent/JP4584385B2/ja
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  • Weting (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP31878399A 1999-08-10 1999-11-09 基板処理装置および基板処理方法 Expired - Fee Related JP4584385B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP31878399A JP4584385B2 (ja) 1999-08-10 1999-11-09 基板処理装置および基板処理方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP11-226654 1999-08-10
JP22665499 1999-08-10
JP31878399A JP4584385B2 (ja) 1999-08-10 1999-11-09 基板処理装置および基板処理方法

Publications (3)

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JP2001118824A JP2001118824A (ja) 2001-04-27
JP2001118824A5 JP2001118824A5 (https=) 2006-12-28
JP4584385B2 true JP4584385B2 (ja) 2010-11-17

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JP31878399A Expired - Fee Related JP4584385B2 (ja) 1999-08-10 1999-11-09 基板処理装置および基板処理方法

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JP (1) JP4584385B2 (https=)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4365605B2 (ja) * 2002-07-26 2009-11-18 大日本スクリーン製造株式会社 基板保持装置および基板保持方法、ならびにそれらを用いた基板処理装置および基板処理方法
JP4571515B2 (ja) * 2004-01-27 2010-10-27 芝浦メカトロニクス株式会社 スピン処理装置
JP4293366B2 (ja) * 2004-10-28 2009-07-08 大日本スクリーン製造株式会社 基板処理装置
JP2007220890A (ja) 2006-02-16 2007-08-30 Toshiba Corp 塗布現像処理装置における基板周縁処理方法
JP4837017B2 (ja) * 2008-10-02 2011-12-14 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP5199419B2 (ja) * 2011-05-09 2013-05-15 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP6660202B2 (ja) 2016-02-19 2020-03-11 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
CN107403717B (zh) * 2016-04-28 2023-07-18 应用材料公司 一种用于处理腔室的改进侧注入喷嘴设计
TWI816968B (zh) 2019-01-23 2023-10-01 日商東京威力科創股份有限公司 基板處理裝置及基板處理方法
JP7304737B2 (ja) * 2019-05-14 2023-07-07 東京エレクトロン株式会社 基板処理装置および基板処理方法
CN112420548B (zh) * 2019-08-23 2025-02-07 盛美半导体设备(上海)股份有限公司 洗边装置
JP7453020B2 (ja) * 2020-03-06 2024-03-19 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法
CN112652530A (zh) * 2020-12-11 2021-04-13 联合微电子中心有限责任公司 一种提高斜面刻蚀良率的方法
JP2023139604A (ja) * 2022-03-22 2023-10-04 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
CN114695210B (zh) * 2022-06-02 2022-09-09 西安奕斯伟材料科技有限公司 一种用于硅片边缘刻蚀的装置和方法
CN114899132A (zh) * 2022-07-12 2022-08-12 太原市立科致业科技有限公司 一种智能电子检测仪加工用半导体晶圆清理设备
CN116313987B (zh) * 2022-12-30 2025-08-26 浙江求是创芯半导体设备有限公司 外延设备中晶圆的传动装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62264626A (ja) * 1986-05-12 1987-11-17 Nec Kyushu Ltd ウエツトエツチング装置
JPH0795540B2 (ja) * 1988-04-11 1995-10-11 株式会社日立製作所 超音波洗浄スプレイノズルを用いた基板両面の洗浄方法及び洗浄装置
JPH02197126A (ja) * 1989-01-26 1990-08-03 Nec Kyushu Ltd 枚葉式半導体基板両面洗浄装置
JPH04186626A (ja) * 1990-11-16 1992-07-03 Nec Yamaguchi Ltd エッチング装置
JP2998259B2 (ja) * 1991-04-09 2000-01-11 ソニー株式会社 ディスク保持装置及びそれを用いたディスク処理方法
JP3326994B2 (ja) * 1994-09-08 2002-09-24 ソニー株式会社 被処理材の液体処理装置、ウエハの液体処理装置、液体処理方法、並びに半導体装置の製造方法
JPH08323303A (ja) * 1995-06-02 1996-12-10 Toshiba Corp 洗浄処理装置
JPH09107023A (ja) * 1995-10-13 1997-04-22 Toshiba Microelectron Corp 被処理物の回転保持装置
JPH09275087A (ja) * 1996-04-05 1997-10-21 Sony Corp 半導体処理装置
JP3745863B2 (ja) * 1997-02-28 2006-02-15 芝浦メカトロニクス株式会社 ウエットエッチング処理方法およびその処理装置
JP3934745B2 (ja) * 1997-06-30 2007-06-20 住友精密工業株式会社 基板授受ユニット及びこれを用いたウエット処理装置
JP3395696B2 (ja) * 1999-03-15 2003-04-14 日本電気株式会社 ウェハ処理装置およびウェハ処理方法

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