JP4584144B2 - 回路基板装置及び配線基板間接続方法 - Google Patents

回路基板装置及び配線基板間接続方法 Download PDF

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Publication number
JP4584144B2
JP4584144B2 JP2005508117A JP2005508117A JP4584144B2 JP 4584144 B2 JP4584144 B2 JP 4584144B2 JP 2005508117 A JP2005508117 A JP 2005508117A JP 2005508117 A JP2005508117 A JP 2005508117A JP 4584144 B2 JP4584144 B2 JP 4584144B2
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JP
Japan
Prior art keywords
wiring board
circuit board
electrode terminals
wiring
conductive member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005508117A
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English (en)
Japanese (ja)
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JPWO2004066691A1 (ja
Inventor
淳哉 佐藤
佳幸 橋本
正和 小泉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Polymer Industries Co Ltd
NEC Corp
Original Assignee
Fuji Polymer Industries Co Ltd
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Polymer Industries Co Ltd, NEC Corp filed Critical Fuji Polymer Industries Co Ltd
Publication of JPWO2004066691A1 publication Critical patent/JPWO2004066691A1/ja
Application granted granted Critical
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Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0314—Elastomeric connector or conductor, e.g. rubber with metallic filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the PCB or at the walls of large holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
JP2005508117A 2003-01-22 2004-01-22 回路基板装置及び配線基板間接続方法 Expired - Fee Related JP4584144B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003012992 2003-01-22
JP2003012992 2003-01-22
PCT/JP2004/000546 WO2004066691A1 (ja) 2003-01-22 2004-01-22 回路基板装置及び配線基板間接続方法

Publications (2)

Publication Number Publication Date
JPWO2004066691A1 JPWO2004066691A1 (ja) 2006-05-18
JP4584144B2 true JP4584144B2 (ja) 2010-11-17

Family

ID=32767348

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005508117A Expired - Fee Related JP4584144B2 (ja) 2003-01-22 2004-01-22 回路基板装置及び配線基板間接続方法

Country Status (6)

Country Link
US (1) US7405948B2 (zh)
JP (1) JP4584144B2 (zh)
KR (1) KR100718850B1 (zh)
CN (2) CN101553086B (zh)
RU (1) RU2308178C2 (zh)
WO (1) WO2004066691A1 (zh)

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JP4356683B2 (ja) * 2005-01-25 2009-11-04 セイコーエプソン株式会社 デバイス実装構造とデバイス実装方法、液滴吐出ヘッド及びコネクタ並びに半導体装置
KR100747336B1 (ko) * 2006-01-20 2007-08-07 엘에스전선 주식회사 이방성 도전 필름을 이용한 회로기판의 접속 구조체, 이를위한 제조 방법 및 이를 이용한 접속 상태 평가방법
JP5056051B2 (ja) * 2007-02-19 2012-10-24 パナソニック株式会社 カード型情報装置
JPWO2008156175A1 (ja) * 2007-06-20 2010-08-26 株式会社ブリヂストン 情報表示用パネル
CN101803480B (zh) * 2007-07-13 2012-05-09 揖斐电株式会社 布线基板及其制造方法
US8178789B2 (en) * 2007-07-17 2012-05-15 Ibiden Co., Ltd. Wiring board and method of manufacturing wiring board
US8035983B2 (en) * 2007-07-17 2011-10-11 Ibiden Co., Ltd. Wiring board and method of manufacturing wiring board
US8072764B2 (en) * 2009-03-09 2011-12-06 Apple Inc. Multi-part substrate assemblies for low profile portable electronic devices
CN101944672A (zh) * 2010-08-18 2011-01-12 中国电子科技集团公司第十研究所 低频电信号挠性线缆传输互联连接结构
JP5263999B2 (ja) 2011-12-16 2013-08-14 Ｎｅｃインフロンティア株式会社 情報処理装置
RU2489814C1 (ru) * 2012-07-20 2013-08-10 Открытое акционерное общество "Федеральный научно-производственный центр "Нижегородский научно-исследовательский институт радиотехники" Способ изготовления многослойных гибко-жестких интегральных плат
US10303227B2 (en) * 2013-02-27 2019-05-28 Dell Products L.P. Information handling system housing heat spreader
GB2525605B (en) * 2014-04-28 2018-10-24 Flexenable Ltd Method of bonding flexible printed circuits
DE102014222951B4 (de) * 2014-11-11 2016-07-28 Würth Elektronik eiSos Gmbh & Co. KG Befestigungselement zur Befestigung an einer Leiterplatte sowie Befestigungsvorrichtung und Verfahren zum beabstandeten Verbinden von Leiterplatten mit einem derartigen Befestigungselement
CN104822226B (zh) * 2015-04-28 2018-09-14 武汉华星光电技术有限公司 电路板组件
US10356902B2 (en) * 2015-12-26 2019-07-16 Intel Corporation Board to board interconnect
TWI600945B (zh) * 2016-03-30 2017-10-01 友達光電股份有限公司 一種顯示器模組以及一種顯示器模組製造方法
US9780465B1 (en) * 2016-09-20 2017-10-03 Northrop Grumman Systems Corporation Angled circuit board connector
US10608159B2 (en) 2016-11-15 2020-03-31 Northrop Grumman Systems Corporation Method of making a superconductor device
JP6711416B2 (ja) 2016-12-01 2020-06-17 株式会社村田製作所 多層基板接続体および伝送線路デバイス
US10276504B2 (en) 2017-05-17 2019-04-30 Northrop Grumman Systems Corporation Preclean and deposition methodology for superconductor interconnects
US10763419B2 (en) 2017-06-02 2020-09-01 Northrop Grumman Systems Corporation Deposition methodology for superconductor interconnects
JP6898827B2 (ja) * 2017-10-23 2021-07-07 新光電気工業株式会社 ソケット
CN108054490B (zh) * 2017-12-08 2020-01-03 中国电子科技集团公司第五十四研究所 一种多层柔性基板局部微弹簧低应力组装结构
CN111602189B (zh) * 2018-01-24 2022-03-22 堺显示器制品株式会社 布线基板的电连接结构及显示装置
CN108513434B (zh) * 2018-05-17 2023-11-10 扬州市玄裕电子有限公司 一种平板用多层柔性线路板
US10985059B2 (en) 2018-11-01 2021-04-20 Northrop Grumman Systems Corporation Preclean and dielectric deposition methodology for superconductor interconnect fabrication
KR102612390B1 (ko) 2018-12-19 2023-12-12 엘지디스플레이 주식회사 표시 패널 및 표시 장치
US11380461B2 (en) 2019-07-02 2022-07-05 Northrop Grumman Systems Corporation Superconducting flexible interconnecting cable connector
CN110379775B (zh) * 2019-07-23 2020-12-25 上海彤程电子材料有限公司 一种基板叠置封装结构及其封装方法
EP3955713A1 (de) * 2020-08-14 2022-02-16 Kamedi GmbH Leiterplatte zum anbinden einer parallel angeordneten kontaktierungsleiterplatte

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56169376U (zh) * 1980-05-19 1981-12-15
JPS58155780U (ja) * 1982-04-14 1983-10-18 株式会社日立製作所 導電ゴムの取付装置
JPS61151979A (ja) * 1984-12-25 1986-07-10 日本電気株式会社 印刷配線基板の接続方式
JPH02110990A (ja) * 1988-10-19 1990-04-24 Sanyo Electric Co Ltd 混成集積回路
JPH08228074A (ja) * 1994-11-30 1996-09-03 Ncr Internatl Inc 印刷回路基板の接続装置と接続方法
JP2001102743A (ja) * 1999-09-29 2001-04-13 Oki Electric Ind Co Ltd 一枚基板化構造

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Patent Citations (6)

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JPS56169376U (zh) * 1980-05-19 1981-12-15
JPS58155780U (ja) * 1982-04-14 1983-10-18 株式会社日立製作所 導電ゴムの取付装置
JPS61151979A (ja) * 1984-12-25 1986-07-10 日本電気株式会社 印刷配線基板の接続方式
JPH02110990A (ja) * 1988-10-19 1990-04-24 Sanyo Electric Co Ltd 混成集積回路
JPH08228074A (ja) * 1994-11-30 1996-09-03 Ncr Internatl Inc 印刷回路基板の接続装置と接続方法
JP2001102743A (ja) * 1999-09-29 2001-04-13 Oki Electric Ind Co Ltd 一枚基板化構造

Also Published As

Publication number Publication date
KR20050123092A (ko) 2005-12-29
RU2308178C2 (ru) 2007-10-10
RU2005126413A (ru) 2006-06-10
WO2004066691A1 (ja) 2004-08-05
JPWO2004066691A1 (ja) 2006-05-18
CN101553086B (zh) 2011-08-31
US7405948B2 (en) 2008-07-29
KR100718850B1 (ko) 2007-05-16
US20060273446A1 (en) 2006-12-07
CN1742525A (zh) 2006-03-01
CN1742525B (zh) 2010-09-29
CN101553086A (zh) 2009-10-07

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