JP4577717B2 - バンプ検査装置および方法 - Google Patents

バンプ検査装置および方法 Download PDF

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Publication number
JP4577717B2
JP4577717B2 JP2005051393A JP2005051393A JP4577717B2 JP 4577717 B2 JP4577717 B2 JP 4577717B2 JP 2005051393 A JP2005051393 A JP 2005051393A JP 2005051393 A JP2005051393 A JP 2005051393A JP 4577717 B2 JP4577717 B2 JP 4577717B2
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JP
Japan
Prior art keywords
bump
image
inspection
area
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005051393A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006234667A (ja
Inventor
祐司 赤木
潤 大西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Screen Holdings Co Ltd
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd, Dainippon Screen Manufacturing Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP2005051393A priority Critical patent/JP4577717B2/ja
Priority to TW094142738A priority patent/TWI274869B/zh
Priority to CNB2005100488143A priority patent/CN100470239C/zh
Priority to KR1020050133919A priority patent/KR100719712B1/ko
Publication of JP2006234667A publication Critical patent/JP2006234667A/ja
Application granted granted Critical
Publication of JP4577717B2 publication Critical patent/JP4577717B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process

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  • Immunology (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Pathology (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)
JP2005051393A 2005-02-25 2005-02-25 バンプ検査装置および方法 Expired - Fee Related JP4577717B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2005051393A JP4577717B2 (ja) 2005-02-25 2005-02-25 バンプ検査装置および方法
TW094142738A TWI274869B (en) 2005-02-25 2005-12-05 Apparatus and method for inspecting bumps
CNB2005100488143A CN100470239C (zh) 2005-02-25 2005-12-28 凸起检查装置以及方法
KR1020050133919A KR100719712B1 (ko) 2005-02-25 2005-12-29 범프 검사 장치 및 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005051393A JP4577717B2 (ja) 2005-02-25 2005-02-25 バンプ検査装置および方法

Publications (2)

Publication Number Publication Date
JP2006234667A JP2006234667A (ja) 2006-09-07
JP4577717B2 true JP4577717B2 (ja) 2010-11-10

Family

ID=36935865

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005051393A Expired - Fee Related JP4577717B2 (ja) 2005-02-25 2005-02-25 バンプ検査装置および方法

Country Status (4)

Country Link
JP (1) JP4577717B2 (zh)
KR (1) KR100719712B1 (zh)
CN (1) CN100470239C (zh)
TW (1) TWI274869B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5346720B2 (ja) * 2009-07-10 2013-11-20 東レエンジニアリング株式会社 接合強度測定装置および接合強度測定方法
KR101654825B1 (ko) 2014-07-08 2016-09-22 (주)자비스 기판의 밀집 검사 부위의 엑스레이 검사 방법
KR20160006052A (ko) 2014-07-08 2016-01-18 (주)자비스 전자 기판의 엑스레이 검사 방법
KR20160011222A (ko) 2016-01-18 2016-01-29 (주)자비스 전자 기판의 엑스레이 검사 방법
KR102137186B1 (ko) 2017-01-20 2020-07-23 (주)자비스 전자 기판의 엑스레이 검사 방법
JP2022061127A (ja) * 2020-10-06 2022-04-18 東レエンジニアリング株式会社 外観検査装置および方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06323824A (ja) * 1993-05-13 1994-11-25 Sharp Corp バンプ外観検査方法およびバンプ外観検査装置
JPH07140090A (ja) * 1993-11-17 1995-06-02 Nichiden Mach Ltd 外観検査の項目判別方法
JPH08189898A (ja) * 1995-01-06 1996-07-23 Dainippon Screen Mfg Co Ltd 欠陥検査装置
JPH11218499A (ja) * 1998-02-03 1999-08-10 Hitachi Denshi Ltd 外観検査装置およびその画像処理方法
JP2001176907A (ja) * 1999-12-16 2001-06-29 Shinko Electric Ind Co Ltd バンプ検査装置
JP2001307070A (ja) * 2000-04-18 2001-11-02 Matsushita Electric Ind Co Ltd 良品パターン登録方法
JP2003065970A (ja) * 2001-08-27 2003-03-05 Nec Corp 異物検査方法およびその装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62239005A (ja) * 1986-04-11 1987-10-19 Fuji Photo Film Co Ltd 表面形状検査装置
JP2002358509A (ja) * 2001-06-01 2002-12-13 Dainippon Screen Mfg Co Ltd 穴検査装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06323824A (ja) * 1993-05-13 1994-11-25 Sharp Corp バンプ外観検査方法およびバンプ外観検査装置
JPH07140090A (ja) * 1993-11-17 1995-06-02 Nichiden Mach Ltd 外観検査の項目判別方法
JPH08189898A (ja) * 1995-01-06 1996-07-23 Dainippon Screen Mfg Co Ltd 欠陥検査装置
JPH11218499A (ja) * 1998-02-03 1999-08-10 Hitachi Denshi Ltd 外観検査装置およびその画像処理方法
JP2001176907A (ja) * 1999-12-16 2001-06-29 Shinko Electric Ind Co Ltd バンプ検査装置
JP2001307070A (ja) * 2000-04-18 2001-11-02 Matsushita Electric Ind Co Ltd 良品パターン登録方法
JP2003065970A (ja) * 2001-08-27 2003-03-05 Nec Corp 異物検査方法およびその装置

Also Published As

Publication number Publication date
KR100719712B1 (ko) 2007-05-17
CN100470239C (zh) 2009-03-18
TWI274869B (en) 2007-03-01
JP2006234667A (ja) 2006-09-07
KR20060094844A (ko) 2006-08-30
TW200630608A (en) 2006-09-01
CN1825095A (zh) 2006-08-30

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