CN1825095A - 凸起检查装置以及方法 - Google Patents
凸起检查装置以及方法 Download PDFInfo
- Publication number
- CN1825095A CN1825095A CNA2005100488143A CN200510048814A CN1825095A CN 1825095 A CN1825095 A CN 1825095A CN A2005100488143 A CNA2005100488143 A CN A2005100488143A CN 200510048814 A CN200510048814 A CN 200510048814A CN 1825095 A CN1825095 A CN 1825095A
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- CN
- China
- Prior art keywords
- image
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
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- Immunology (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Pathology (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Signal Processing (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Image Processing (AREA)
- Image Analysis (AREA)
Abstract
Description
Claims (5)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005051393 | 2005-02-25 | ||
JP2005051393A JP4577717B2 (ja) | 2005-02-25 | 2005-02-25 | バンプ検査装置および方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1825095A true CN1825095A (zh) | 2006-08-30 |
CN100470239C CN100470239C (zh) | 2009-03-18 |
Family
ID=36935865
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100488143A Expired - Fee Related CN100470239C (zh) | 2005-02-25 | 2005-12-28 | 凸起检查装置以及方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4577717B2 (zh) |
KR (1) | KR100719712B1 (zh) |
CN (1) | CN100470239C (zh) |
TW (1) | TWI274869B (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5346720B2 (ja) * | 2009-07-10 | 2013-11-20 | 東レエンジニアリング株式会社 | 接合強度測定装置および接合強度測定方法 |
KR101654825B1 (ko) | 2014-07-08 | 2016-09-22 | (주)자비스 | 기판의 밀집 검사 부위의 엑스레이 검사 방법 |
KR20160006052A (ko) | 2014-07-08 | 2016-01-18 | (주)자비스 | 전자 기판의 엑스레이 검사 방법 |
KR20160011222A (ko) | 2016-01-18 | 2016-01-29 | (주)자비스 | 전자 기판의 엑스레이 검사 방법 |
KR102137186B1 (ko) | 2017-01-20 | 2020-07-23 | (주)자비스 | 전자 기판의 엑스레이 검사 방법 |
JP2022061127A (ja) * | 2020-10-06 | 2022-04-18 | 東レエンジニアリング株式会社 | 外観検査装置および方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62239005A (ja) * | 1986-04-11 | 1987-10-19 | Fuji Photo Film Co Ltd | 表面形状検査装置 |
JP3051279B2 (ja) * | 1993-05-13 | 2000-06-12 | シャープ株式会社 | バンプ外観検査方法およびバンプ外観検査装置 |
JPH07140090A (ja) * | 1993-11-17 | 1995-06-02 | Nichiden Mach Ltd | 外観検査の項目判別方法 |
JP3515199B2 (ja) * | 1995-01-06 | 2004-04-05 | 大日本スクリーン製造株式会社 | 欠陥検査装置 |
JPH11218499A (ja) * | 1998-02-03 | 1999-08-10 | Hitachi Denshi Ltd | 外観検査装置およびその画像処理方法 |
JP2001176907A (ja) * | 1999-12-16 | 2001-06-29 | Shinko Electric Ind Co Ltd | バンプ検査装置 |
JP4546607B2 (ja) * | 2000-04-18 | 2010-09-15 | パナソニック株式会社 | 良品パターン登録方法及びパターン検査方法 |
JP2002358509A (ja) * | 2001-06-01 | 2002-12-13 | Dainippon Screen Mfg Co Ltd | 穴検査装置 |
JP2003065970A (ja) * | 2001-08-27 | 2003-03-05 | Nec Corp | 異物検査方法およびその装置 |
-
2005
- 2005-02-25 JP JP2005051393A patent/JP4577717B2/ja not_active Expired - Fee Related
- 2005-12-05 TW TW094142738A patent/TWI274869B/zh not_active IP Right Cessation
- 2005-12-28 CN CNB2005100488143A patent/CN100470239C/zh not_active Expired - Fee Related
- 2005-12-29 KR KR1020050133919A patent/KR100719712B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR100719712B1 (ko) | 2007-05-17 |
JP4577717B2 (ja) | 2010-11-10 |
CN100470239C (zh) | 2009-03-18 |
TWI274869B (en) | 2007-03-01 |
JP2006234667A (ja) | 2006-09-07 |
KR20060094844A (ko) | 2006-08-30 |
TW200630608A (en) | 2006-09-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: SCREEN GROUP CO., LTD. Free format text: FORMER NAME: DAINIPPON SCREEN MFG. CO., LTD. Owner name: DAINIPPON SCREEN MFG. CO., LTD. Free format text: FORMER NAME: DAINIPPON MESH PLATE MFR. CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Kyoto Japan Patentee after: Skilling Group Address before: Kyoto Japan Patentee before: DAINIPPON SCREEN MFG Co.,Ltd. Address after: Kyoto Japan Patentee after: DAINIPPON SCREEN MFG Co.,Ltd. Address before: Kyoto Japan Patentee before: Dainippon Screen Mfg. Co.,Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090318 Termination date: 20151228 |
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EXPY | Termination of patent right or utility model |