JP4573373B2 - 接着構造体 - Google Patents
接着構造体 Download PDFInfo
- Publication number
- JP4573373B2 JP4573373B2 JP14020499A JP14020499A JP4573373B2 JP 4573373 B2 JP4573373 B2 JP 4573373B2 JP 14020499 A JP14020499 A JP 14020499A JP 14020499 A JP14020499 A JP 14020499A JP 4573373 B2 JP4573373 B2 JP 4573373B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive composition
- weight
- parts
- epoxy
- vinyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Sealing Material Composition (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Paper (AREA)
- Seal Device For Vehicle (AREA)
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14020499A JP4573373B2 (ja) | 1999-05-20 | 1999-05-20 | 接着構造体 |
| KR1020017014737A KR100730680B1 (ko) | 1999-05-20 | 2000-05-17 | 접착제/밀봉제 조성물 및 이를 사용한 접착된 구조체 |
| DE60015754T DE60015754T2 (de) | 1999-05-20 | 2000-05-17 | Gefertigte verbundene struktur |
| US09/959,107 US6656979B1 (en) | 1999-05-20 | 2000-05-17 | Adhesive/sealant composition and bonded structure using the same |
| AT00932553T ATE282075T1 (de) | 1999-05-20 | 2000-05-17 | Gefertigte verbundene struktur |
| AU50255/00A AU5025500A (en) | 1999-05-20 | 2000-05-17 | Adhesive/sealant composition and bonded structure using the same |
| EP00932553A EP1187888B1 (en) | 1999-05-20 | 2000-05-17 | bonded structure |
| PCT/US2000/013617 WO2000071632A1 (en) | 1999-05-20 | 2000-05-17 | Adhesive/sealant composition and bonded structure using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14020499A JP4573373B2 (ja) | 1999-05-20 | 1999-05-20 | 接着構造体 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000328009A JP2000328009A (ja) | 2000-11-28 |
| JP2000328009A5 JP2000328009A5 (enExample) | 2006-07-06 |
| JP4573373B2 true JP4573373B2 (ja) | 2010-11-04 |
Family
ID=15263349
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14020499A Expired - Lifetime JP4573373B2 (ja) | 1999-05-20 | 1999-05-20 | 接着構造体 |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP1187888B1 (enExample) |
| JP (1) | JP4573373B2 (enExample) |
| KR (1) | KR100730680B1 (enExample) |
| AT (1) | ATE282075T1 (enExample) |
| AU (1) | AU5025500A (enExample) |
| DE (1) | DE60015754T2 (enExample) |
| WO (1) | WO2000071632A1 (enExample) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4566304B2 (ja) * | 1999-08-06 | 2010-10-20 | ニチバン株式会社 | 光硬化型シーリング剤 |
| US6750301B1 (en) * | 2000-07-07 | 2004-06-15 | National Starch And Chemical Investment Holding Corporation | Die attach adhesives with epoxy compound or resin having allyl or vinyl groups |
| US6620501B1 (en) | 2000-08-07 | 2003-09-16 | L&L Products, Inc. | Paintable seal system |
| US7473715B2 (en) | 2001-05-02 | 2009-01-06 | Zephyros, Inc. | Two component (epoxy/amine) structural foam-in-place material |
| KR20030014187A (ko) * | 2002-11-07 | 2003-02-15 | 이상일 | 후로킹 접착제 |
| US7125461B2 (en) | 2003-05-07 | 2006-10-24 | L & L Products, Inc. | Activatable material for sealing, baffling or reinforcing and method of forming same |
| US7199165B2 (en) | 2003-06-26 | 2007-04-03 | L & L Products, Inc. | Expandable material |
| US8070994B2 (en) | 2004-06-18 | 2011-12-06 | Zephyros, Inc. | Panel structure |
| US7521093B2 (en) | 2004-07-21 | 2009-04-21 | Zephyros, Inc. | Method of sealing an interface |
| US7838589B2 (en) | 2004-07-21 | 2010-11-23 | Zephyros, Inc. | Sealant material |
| KR101492629B1 (ko) * | 2007-06-28 | 2015-02-12 | 린텍 가부시키가이샤 | 점접착제 조성물, 점접착 시트 및 반도체장치의 제조방법 |
| GB0806434D0 (en) | 2008-04-09 | 2008-05-14 | Zephyros Inc | Improvements in or relating to structural adhesives |
| GB0916205D0 (en) | 2009-09-15 | 2009-10-28 | Zephyros Inc | Improvements in or relating to cavity filling |
| BR112012022319B1 (pt) | 2010-03-04 | 2020-01-28 | Zephyros Inc | laminado estrutural compósito |
| CN102690611B (zh) * | 2011-12-27 | 2015-06-24 | 3M中国有限公司 | 胶带组合物以及由其制备的胶带 |
| DE102012018630A1 (de) * | 2012-09-21 | 2014-03-27 | Lohmann Gmbh & Co. Kg | Hitzeaktivierbares strukturelles Haftklebeband |
| US10577522B2 (en) | 2013-07-26 | 2020-03-03 | Zephyros, Inc. | Thermosetting adhesive films including a fibrous carrier |
| JP6355422B2 (ja) * | 2014-05-16 | 2018-07-11 | 積水化学工業株式会社 | インクジェット用光及び熱硬化性接着剤、電子部品の製造方法及び電子部品 |
| GB201417985D0 (en) | 2014-10-10 | 2014-11-26 | Zephyros Inc | Improvements in or relating to structural adhesives |
| EP3412743B1 (en) | 2017-02-22 | 2019-08-07 | LG Chem, Ltd. | Adhesive composition |
| KR102157352B1 (ko) | 2017-05-02 | 2020-09-17 | 주식회사 엘지화학 | 이액형 접착제 조성물 |
| KR102136705B1 (ko) | 2017-06-02 | 2020-07-22 | 주식회사 엘지화학 | 이액형 접착제 조성물 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1340130C (en) * | 1988-06-28 | 1998-11-17 | Mark D. Purgett | Pressure-sensitive adhesive tapes |
| US7575653B2 (en) * | 1993-04-15 | 2009-08-18 | 3M Innovative Properties Company | Melt-flowable materials and method of sealing surfaces |
| WO1995013328A1 (en) * | 1993-11-10 | 1995-05-18 | Minnesota Mining And Manufacturing Company | Pressure sensitive thermosetting adhesives |
| EP0833874A1 (en) * | 1995-06-21 | 1998-04-08 | Minnesota Mining And Manufacturing Company | Adhesive compositions, bonding films made therefrom and processes for making bonding films |
| EP0938526B1 (en) * | 1996-11-12 | 2003-04-23 | Minnesota Mining And Manufacturing Company | Thermosettable pressure sensitive adhesive |
-
1999
- 1999-05-20 JP JP14020499A patent/JP4573373B2/ja not_active Expired - Lifetime
-
2000
- 2000-05-17 EP EP00932553A patent/EP1187888B1/en not_active Expired - Lifetime
- 2000-05-17 KR KR1020017014737A patent/KR100730680B1/ko not_active Expired - Lifetime
- 2000-05-17 DE DE60015754T patent/DE60015754T2/de not_active Expired - Lifetime
- 2000-05-17 AU AU50255/00A patent/AU5025500A/en not_active Abandoned
- 2000-05-17 AT AT00932553T patent/ATE282075T1/de not_active IP Right Cessation
- 2000-05-17 WO PCT/US2000/013617 patent/WO2000071632A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| JP2000328009A (ja) | 2000-11-28 |
| KR20020034081A (ko) | 2002-05-08 |
| EP1187888A1 (en) | 2002-03-20 |
| EP1187888B1 (en) | 2004-11-10 |
| DE60015754T2 (de) | 2005-12-01 |
| WO2000071632A1 (en) | 2000-11-30 |
| DE60015754D1 (de) | 2004-12-16 |
| AU5025500A (en) | 2000-12-12 |
| KR100730680B1 (ko) | 2007-06-27 |
| ATE282075T1 (de) | 2004-11-15 |
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