AU6099196A - Adhesive compositions, bonding films made therefrom and processes for making bonding films - Google Patents

Adhesive compositions, bonding films made therefrom and processes for making bonding films

Info

Publication number
AU6099196A
AU6099196A AU60991/96A AU6099196A AU6099196A AU 6099196 A AU6099196 A AU 6099196A AU 60991/96 A AU60991/96 A AU 60991/96A AU 6099196 A AU6099196 A AU 6099196A AU 6099196 A AU6099196 A AU 6099196A
Authority
AU
Australia
Prior art keywords
bonding films
processes
adhesive compositions
made therefrom
making
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU60991/96A
Inventor
Cameron T. Murray
Dennis C. Ngo
William J. Schultz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Co
Original Assignee
Minnesota Mining and Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining and Manufacturing Co filed Critical Minnesota Mining and Manufacturing Co
Publication of AU6099196A publication Critical patent/AU6099196A/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/70—Chelates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J181/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur, with or without nitrogen, oxygen, or carbon only; Adhesives based on polysulfones; Adhesives based on derivatives of such polymers
    • C09J181/06—Polysulfones; Polyethersulfones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
AU60991/96A 1995-06-21 1996-06-05 Adhesive compositions, bonding films made therefrom and processes for making bonding films Abandoned AU6099196A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US49326395A 1995-06-21 1995-06-21
US493263 1995-06-21
PCT/US1996/009412 WO1997000923A1 (en) 1995-06-21 1996-06-05 Adhesive compositions, bonding films made therefrom and processes for making bonding films

Publications (1)

Publication Number Publication Date
AU6099196A true AU6099196A (en) 1997-01-22

Family

ID=23959532

Family Applications (1)

Application Number Title Priority Date Filing Date
AU60991/96A Abandoned AU6099196A (en) 1995-06-21 1996-06-05 Adhesive compositions, bonding films made therefrom and processes for making bonding films

Country Status (6)

Country Link
EP (1) EP0833874A1 (en)
JP (1) JPH11508301A (en)
KR (1) KR19990028271A (en)
AU (1) AU6099196A (en)
CA (1) CA2224809A1 (en)
WO (1) WO1997000923A1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4573373B2 (en) * 1999-05-20 2010-11-04 スリーエム イノベイティブ プロパティズ カンパニー Adhesive structure
JP2003268337A (en) * 2002-03-15 2003-09-25 Denki Kagaku Kogyo Kk Adhesive composition and adhesive sheet
US6949602B2 (en) 2002-12-19 2005-09-27 Illinois Tool Works, Inc. Heat resistant, impact resistant, acrylic/epoxy adhesives
CA2926975C (en) † 2006-02-09 2019-10-29 Deka Products Limited Partnership Peripheral systems
US8437825B2 (en) 2008-07-03 2013-05-07 Cercacor Laboratories, Inc. Contoured protrusion for improving spectroscopic measurement of blood constituents
US8515509B2 (en) 2008-08-04 2013-08-20 Cercacor Laboratories, Inc. Multi-stream emitter for noninvasive measurement of blood constituents
GB0817795D0 (en) * 2008-09-30 2008-11-05 3M Innovative Properties Co Fast curing oil-uptaking epozxy-based structural adhesives
JP5571968B2 (en) * 2010-02-05 2014-08-13 大阪ガスケミカル株式会社 Curable composition and cured product thereof
US9464217B2 (en) 2010-09-01 2016-10-11 The Boeing Company Composite structures using interpenetrating polymer network adhesives
US8882956B2 (en) * 2010-09-01 2014-11-11 The Boeing Company Composite structures using interpenetrating polymer network adhesives
US20180230337A1 (en) * 2014-10-20 2018-08-16 Sekisui Plastics Co., Ltd. Tacky gel sheet having adhesive applications, method for producing same, method for fixing a pair of objects, and composite material
US10448871B2 (en) 2015-07-02 2019-10-22 Masimo Corporation Advanced pulse oximetry sensor
KR102063052B1 (en) * 2016-11-25 2020-01-07 주식회사 엘지화학 Curable Composition
CN115066203A (en) 2020-01-13 2022-09-16 梅西莫股份有限公司 Wearable device with physiological parameter monitoring

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4612209A (en) * 1983-12-27 1986-09-16 Ciba-Geigy Corporation Process for the preparation of heat-curable adhesive films
JPH0715087B2 (en) * 1988-07-21 1995-02-22 リンテック株式会社 Adhesive tape and method of using the same
JPH05506691A (en) * 1990-06-08 1993-09-30 ミネソタ　マイニング　アンド　マニュファクチャリング　カンパニー Reworkable adhesives for electronic applications

Also Published As

Publication number Publication date
KR19990028271A (en) 1999-04-15
EP0833874A1 (en) 1998-04-08
CA2224809A1 (en) 1997-01-09
WO1997000923A1 (en) 1997-01-09
JPH11508301A (en) 1999-07-21

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Legal Events

Date Code Title Description
MK5 Application lapsed section 142(2)(e) - patent request and compl. specification not accepted