JP4573138B2 - 銀含有粉体の製造方法、銀含有粉体及びその分散液 - Google Patents

銀含有粉体の製造方法、銀含有粉体及びその分散液 Download PDF

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JP4573138B2
JP4573138B2 JP2008167262A JP2008167262A JP4573138B2 JP 4573138 B2 JP4573138 B2 JP 4573138B2 JP 2008167262 A JP2008167262 A JP 2008167262A JP 2008167262 A JP2008167262 A JP 2008167262A JP 4573138 B2 JP4573138 B2 JP 4573138B2
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Japan
Prior art keywords
silver
compound
containing powder
dispersion
epoxy resin
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JP2008167262A
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Japanese (ja)
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JP2010007124A (ja
JP2010007124A5 (enrdf_load_stackoverflow
Inventor
暁雄 高橋
承澤 李
仁華 金
光一郎 松木
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DIC Corp
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DIC Corp
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Priority to JP2008167262A priority Critical patent/JP4573138B2/ja
Application filed by DIC Corp filed Critical DIC Corp
Priority to US12/737,220 priority patent/US20110180764A1/en
Priority to PCT/JP2009/060587 priority patent/WO2009157309A1/ja
Priority to KR1020107020662A priority patent/KR101239816B1/ko
Priority to CN200980123935.6A priority patent/CN102066024B/zh
Priority to EP09770019.9A priority patent/EP2305402B1/en
Publication of JP2010007124A publication Critical patent/JP2010007124A/ja
Publication of JP2010007124A5 publication Critical patent/JP2010007124A5/ja
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Publication of JP4573138B2 publication Critical patent/JP4573138B2/ja
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  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Powder Metallurgy (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
JP2008167262A 2008-06-26 2008-06-26 銀含有粉体の製造方法、銀含有粉体及びその分散液 Active JP4573138B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2008167262A JP4573138B2 (ja) 2008-06-26 2008-06-26 銀含有粉体の製造方法、銀含有粉体及びその分散液
PCT/JP2009/060587 WO2009157309A1 (ja) 2008-06-26 2009-06-10 銀含有粉体とその製法、これを用いる導電性ペーストとプラスチック基板
KR1020107020662A KR101239816B1 (ko) 2008-06-26 2009-06-10 은 함유 분체의 제조 방법, 은 함유 분체, 도전성 페이스트 및 플라스틱 기판
CN200980123935.6A CN102066024B (zh) 2008-06-26 2009-06-10 含银粉末及其制法、使用其的导电性糊剂和塑料基板
US12/737,220 US20110180764A1 (en) 2008-06-26 2009-06-10 Silver-containing powder, method for producing the same, conductive paste using the same, and plastic substrate
EP09770019.9A EP2305402B1 (en) 2008-06-26 2009-06-10 Method for producing silver-containing powder and conductive paste using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008167262A JP4573138B2 (ja) 2008-06-26 2008-06-26 銀含有粉体の製造方法、銀含有粉体及びその分散液

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JP2010007124A JP2010007124A (ja) 2010-01-14
JP2010007124A5 JP2010007124A5 (enrdf_load_stackoverflow) 2010-03-25
JP4573138B2 true JP4573138B2 (ja) 2010-11-04

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JP2008167262A Active JP4573138B2 (ja) 2008-06-26 2008-06-26 銀含有粉体の製造方法、銀含有粉体及びその分散液

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JP (1) JP4573138B2 (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020040120A1 (ja) 2018-08-23 2020-02-27 Dic株式会社 積層体、成形品、導電性パターン及び電子回路
WO2021070591A1 (ja) 2019-10-10 2021-04-15 Dic株式会社 積層体、成形品、プリント配線板及び電磁波シールド

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MD4075C1 (ro) * 2009-12-31 2011-07-31 Анатолий ЭФКАРПИДИС Procedeu de obţinere a argintului coloidal de înaltă dispersie
JP6015224B2 (ja) * 2012-08-09 2016-10-26 Dic株式会社 金属酸化物ナノ構造体の製造方法
JP6327442B2 (ja) * 2013-03-07 2018-05-23 Dic株式会社 導電性材料の製造方法及び導電性材料
JP6327443B2 (ja) * 2013-03-19 2018-05-23 Dic株式会社 導電性材料の製造方法及び導電性材料
JP6090664B2 (ja) * 2013-03-28 2017-03-08 三菱マテリアル株式会社 貴金属焼結体用の粘土状組成物
US20180009038A1 (en) * 2015-02-23 2018-01-11 Furuya Metal Co., Ltd. Method for nanoparticle purification
WO2017195621A1 (ja) * 2016-05-09 2017-11-16 Dic株式会社 フレキソ印刷用金属ナノ粒子インク及びそれを用いた積層体の製造方法
WO2017199833A1 (ja) * 2016-05-17 2017-11-23 Dic株式会社 無電解ニッケルめっき方法
JP2019014188A (ja) * 2017-07-10 2019-01-31 Dic株式会社 積層体、それを用いたプリント配線板、フレキシブルプリント配線板及び成形品
CN110014168A (zh) * 2019-05-23 2019-07-16 深圳先进技术研究院 一种纳米银颗粒及其制备方法
FR3096685B1 (fr) * 2019-05-28 2022-09-02 Univ Bordeaux Matériau coloré à base de nanoparticules métalliques
WO2021131565A1 (ja) * 2019-12-24 2021-07-01 Dic株式会社 積層体、プリント配線板、フレキシブルプリント配線板、電磁波シールド及び成形品
JP7498585B2 (ja) * 2020-03-30 2024-06-12 株式会社ノリタケカンパニーリミテド 金属樹脂接合体およびその製造方法
JP7498583B2 (ja) * 2020-03-30 2024-06-12 株式会社ノリタケカンパニーリミテド 金属樹脂接合体およびその製造方法
JP7498584B2 (ja) * 2020-03-30 2024-06-12 株式会社ノリタケカンパニーリミテド 金属樹脂接合体およびその製造方法
CN113263183B (zh) * 2021-04-09 2022-11-08 宁夏中色新材料有限公司 一种纳米银脂类分散液及其制备方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4644390B2 (ja) * 2001-06-28 2011-03-02 宇部日東化成株式会社 シリカ被覆金属系複合粉体の製造方法
JP2003103158A (ja) * 2001-09-28 2003-04-08 Nippon Paint Co Ltd 高濃度金属コロイド粒子溶液、その製造方法及び金属性被膜の形成方法
JP2006097097A (ja) * 2004-09-30 2006-04-13 Aica Kogyo Co Ltd フェライト被覆金属磁性微粒子の製造方法
KR100769352B1 (ko) * 2006-05-18 2007-10-24 주식회사 랜코 금속성 분말 재생방법
JP4026662B1 (ja) * 2006-08-01 2007-12-26 大日本インキ化学工業株式会社 金属ナノ粒子分散体とその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020040120A1 (ja) 2018-08-23 2020-02-27 Dic株式会社 積層体、成形品、導電性パターン及び電子回路
WO2021070591A1 (ja) 2019-10-10 2021-04-15 Dic株式会社 積層体、成形品、プリント配線板及び電磁波シールド

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