JP4568440B2 - フリップチップ型半導体素子および半導体装置 - Google Patents

フリップチップ型半導体素子および半導体装置 Download PDF

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Publication number
JP4568440B2
JP4568440B2 JP2001020002A JP2001020002A JP4568440B2 JP 4568440 B2 JP4568440 B2 JP 4568440B2 JP 2001020002 A JP2001020002 A JP 2001020002A JP 2001020002 A JP2001020002 A JP 2001020002A JP 4568440 B2 JP4568440 B2 JP 4568440B2
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semiconductor device
substrate
chip type
type semiconductor
conductor
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Japanese (ja)
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JP2002222831A5 (enExample
JP2002222831A (ja
Inventor
実 一色
君男 山川
淳二 中西
智子 加藤
勝利 峰
恒雄 花田
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DuPont Toray Specialty Materials KK
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Dow Corning Toray Co Ltd
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Priority to JP2001020002A priority Critical patent/JP4568440B2/ja
Publication of JP2002222831A publication Critical patent/JP2002222831A/ja
Publication of JP2002222831A5 publication Critical patent/JP2002222831A5/ja
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Publication of JP4568440B2 publication Critical patent/JP4568440B2/ja
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    • H10W72/072—
    • H10W72/07251—
    • H10W72/20—
    • H10W72/234—
    • H10W72/241—
    • H10W72/251—
    • H10W90/724—

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JP2001020002A 2001-01-29 2001-01-29 フリップチップ型半導体素子および半導体装置 Expired - Fee Related JP4568440B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001020002A JP4568440B2 (ja) 2001-01-29 2001-01-29 フリップチップ型半導体素子および半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001020002A JP4568440B2 (ja) 2001-01-29 2001-01-29 フリップチップ型半導体素子および半導体装置

Publications (3)

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JP2002222831A JP2002222831A (ja) 2002-08-09
JP2002222831A5 JP2002222831A5 (enExample) 2008-01-17
JP4568440B2 true JP4568440B2 (ja) 2010-10-27

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JP2001020002A Expired - Fee Related JP4568440B2 (ja) 2001-01-29 2001-01-29 フリップチップ型半導体素子および半導体装置

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5321270B2 (ja) * 2009-06-17 2013-10-23 信越化学工業株式会社 フリップチップ型半導体装置用シリコーンアンダーフィル材およびそれを使用するフリップチップ型半導体装置
US20250385207A1 (en) * 2022-07-13 2025-12-18 Sony Semiconductor Solutions Corporation Semiconductor device, mounting substrate, and electronic device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6273731A (ja) * 1985-09-27 1987-04-04 Sumitomo Electric Ind Ltd 半導体装置の封止方法
JP2845022B2 (ja) * 1992-04-06 1999-01-13 日本電気株式会社 半導体装置
JPH05275489A (ja) * 1992-03-26 1993-10-22 Hitachi Ltd 電極間の接続構造
JPH10261735A (ja) * 1997-03-18 1998-09-29 Hitachi Ltd 半導体装置およびその製造方法
JP3714444B2 (ja) * 1997-07-23 2005-11-09 新光電気工業株式会社 半導体装置とその製造方法
US5969461A (en) * 1998-04-08 1999-10-19 Cts Corporation Surface acoustic wave device package and method
JP2000031194A (ja) * 1998-07-10 2000-01-28 Fuji Electric Co Ltd ボンディングワイヤおよび半導体装置

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JP2002222831A (ja) 2002-08-09

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