JP2002222831A5 - - Google Patents
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- JP2002222831A5 JP2002222831A5 JP2001020002A JP2001020002A JP2002222831A5 JP 2002222831 A5 JP2002222831 A5 JP 2002222831A5 JP 2001020002 A JP2001020002 A JP 2001020002A JP 2001020002 A JP2001020002 A JP 2001020002A JP 2002222831 A5 JP2002222831 A5 JP 2002222831A5
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- JP
- Japan
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001020002A JP4568440B2 (ja) | 2001-01-29 | 2001-01-29 | フリップチップ型半導体素子および半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001020002A JP4568440B2 (ja) | 2001-01-29 | 2001-01-29 | フリップチップ型半導体素子および半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002222831A JP2002222831A (ja) | 2002-08-09 |
| JP2002222831A5 true JP2002222831A5 (enExample) | 2008-01-17 |
| JP4568440B2 JP4568440B2 (ja) | 2010-10-27 |
Family
ID=18885782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001020002A Expired - Fee Related JP4568440B2 (ja) | 2001-01-29 | 2001-01-29 | フリップチップ型半導体素子および半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4568440B2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5321270B2 (ja) * | 2009-06-17 | 2013-10-23 | 信越化学工業株式会社 | フリップチップ型半導体装置用シリコーンアンダーフィル材およびそれを使用するフリップチップ型半導体装置 |
| US20250385207A1 (en) * | 2022-07-13 | 2025-12-18 | Sony Semiconductor Solutions Corporation | Semiconductor device, mounting substrate, and electronic device |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6273731A (ja) * | 1985-09-27 | 1987-04-04 | Sumitomo Electric Ind Ltd | 半導体装置の封止方法 |
| JP2845022B2 (ja) * | 1992-04-06 | 1999-01-13 | 日本電気株式会社 | 半導体装置 |
| JPH05275489A (ja) * | 1992-03-26 | 1993-10-22 | Hitachi Ltd | 電極間の接続構造 |
| JPH10261735A (ja) * | 1997-03-18 | 1998-09-29 | Hitachi Ltd | 半導体装置およびその製造方法 |
| JP3714444B2 (ja) * | 1997-07-23 | 2005-11-09 | 新光電気工業株式会社 | 半導体装置とその製造方法 |
| US5969461A (en) * | 1998-04-08 | 1999-10-19 | Cts Corporation | Surface acoustic wave device package and method |
| JP2000031194A (ja) * | 1998-07-10 | 2000-01-28 | Fuji Electric Co Ltd | ボンディングワイヤおよび半導体装置 |
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2001
- 2001-01-29 JP JP2001020002A patent/JP4568440B2/ja not_active Expired - Fee Related