JP4564454B2 - 塗布方法及び塗布装置及び塗布処理プログラム - Google Patents

塗布方法及び塗布装置及び塗布処理プログラム Download PDF

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JP4564454B2
JP4564454B2 JP2006010762A JP2006010762A JP4564454B2 JP 4564454 B2 JP4564454 B2 JP 4564454B2 JP 2006010762 A JP2006010762 A JP 2006010762A JP 2006010762 A JP2006010762 A JP 2006010762A JP 4564454 B2 JP4564454 B2 JP 4564454B2
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substrate
nozzle
coating
scanning
distance interval
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JP2007190483A (ja
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直紀 藤田
庸元 緒方
幸浩 若元
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2006010762A priority Critical patent/JP4564454B2/ja
Priority to TW096101501A priority patent/TWI313193B/zh
Priority to KR1020070005581A priority patent/KR101346887B1/ko
Priority to CN2007100040225A priority patent/CN101003041B/zh
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JP2006010762A 2006-01-19 2006-01-19 塗布方法及び塗布装置及び塗布処理プログラム Active JP4564454B2 (ja)

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Application Number Priority Date Filing Date Title
JP2006010762A JP4564454B2 (ja) 2006-01-19 2006-01-19 塗布方法及び塗布装置及び塗布処理プログラム
TW096101501A TWI313193B (en) 2006-01-19 2007-01-15 Coating method, coating apparatus and memory medium
KR1020070005581A KR101346887B1 (ko) 2006-01-19 2007-01-18 도포 방법, 도포 장치 및 기억 매체
CN2007100040225A CN101003041B (zh) 2006-01-19 2007-01-19 涂敷方法、涂敷装置以及涂敷处理程序

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JP2006010762A JP4564454B2 (ja) 2006-01-19 2006-01-19 塗布方法及び塗布装置及び塗布処理プログラム

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JP2007190483A JP2007190483A (ja) 2007-08-02
JP4564454B2 true JP4564454B2 (ja) 2010-10-20

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JP (1) JP4564454B2 (zh)
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Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101007685B1 (ko) * 2008-11-18 2011-01-13 세메스 주식회사 평판 디스플레이 소자 제조용 코팅 물질 도포 장치
KR101020681B1 (ko) * 2008-11-18 2011-03-11 세메스 주식회사 평판 디스플레이 소자 제조용 코팅 물질 도포 장치
KR101214698B1 (ko) * 2009-06-23 2012-12-21 시바우라 메카트로닉스 가부시키가이샤 페이스트 도포 장치 및 페이스트 도포 방법
JP5469992B2 (ja) * 2009-10-19 2014-04-16 東京応化工業株式会社 塗布方法、及び塗布装置
JP2012071244A (ja) * 2010-09-28 2012-04-12 Dainippon Screen Mfg Co Ltd パターン形成方法およびパターン形成装置
JP5739778B2 (ja) * 2011-09-21 2015-06-24 株式会社日立製作所 ペースト塗布方法
JP5546516B2 (ja) * 2011-09-22 2014-07-09 富士フイルム株式会社 塗布装置及び塗布方法
JP5858247B2 (ja) * 2013-09-30 2016-02-10 株式会社村田製作所 塗工装置
JP6136909B2 (ja) * 2013-12-17 2017-05-31 旭硝子株式会社 樹脂層付き支持基板の製造方法、ガラス積層体の製造方法、電子デバイスの製造方法
JP6310741B2 (ja) 2014-03-20 2018-04-11 株式会社Ｓｃｒｅｅｎホールディングス 間欠塗工方法および間欠塗工装置
JP2018008216A (ja) * 2016-07-13 2018-01-18 株式会社テクノスマート 塗工装置
CN106681105A (zh) * 2017-02-09 2017-05-17 深圳市华星光电技术有限公司 光阻涂布装置检测机构及光阻涂布机
US10675654B2 (en) * 2017-03-01 2020-06-09 Nordson Corporation Multi-layer slot die system and method
CN106862010A (zh) * 2017-03-24 2017-06-20 苏州威格尔纳米科技有限公司 一种旋转式狭缝涂布模头及方法
CN111032360A (zh) * 2017-09-28 2020-04-17 日本电产株式会社 液剂涂敷装置
JP7038524B2 (ja) * 2017-11-14 2022-03-18 東京エレクトロン株式会社 基板処理装置の洗浄装置および洗浄方法
JP6931849B2 (ja) * 2018-02-01 2021-09-08 パナソニックＩｐマネジメント株式会社 塗工方法および塗工装置
CN108816641B (zh) * 2018-06-30 2024-05-14 浙江浙能科技环保集团股份有限公司 一种钙钛矿太阳能电池中钙钛矿吸光层的涂布工艺及装置
CN109277265B (zh) * 2018-08-29 2022-05-20 广州倬粤动力新能源有限公司 双极板涂膏设备厚度调节方法
EP3789123B1 (en) * 2019-06-26 2023-04-26 ABB Schweiz AG Coating machine and coating method
CN111187008B (zh) * 2020-03-12 2022-04-26 Tcl华星光电技术有限公司 玻璃基板涂布方法及玻璃基板涂布装置
CN113198656B (zh) * 2021-04-26 2022-03-15 东风延锋汽车饰件系统有限公司 喷胶设备的自动清洗装置及方法
CN114074063A (zh) * 2021-11-22 2022-02-22 深圳市深赛尔股份有限公司 一种用多组分水性组合物涂覆金属表面的方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002113411A (ja) * 2000-10-10 2002-04-16 Tokyo Ohka Kogyo Co Ltd 塗布方法
JP2002153795A (ja) * 2000-11-16 2002-05-28 Advanced Color Tec Kk 枚葉基板の製造方法および塗布装置
JP2005244155A (ja) * 2004-01-30 2005-09-08 Tokyo Electron Ltd 浮上式基板搬送処理装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69814710T2 (de) * 1997-03-03 2004-03-18 Tokyo Electron Ltd. Beschichtungs-Vorrichtung und Verfahren
JP3874547B2 (ja) * 1998-08-20 2007-01-31 松下電器産業株式会社 バンプ付きｉｃ封止剤塗布方法及びバンプ付きｉｃ封止剤塗布装置
JP4398786B2 (ja) * 2003-07-23 2010-01-13 東京エレクトロン株式会社 塗布方法及び塗布装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002113411A (ja) * 2000-10-10 2002-04-16 Tokyo Ohka Kogyo Co Ltd 塗布方法
JP2002153795A (ja) * 2000-11-16 2002-05-28 Advanced Color Tec Kk 枚葉基板の製造方法および塗布装置
JP2005244155A (ja) * 2004-01-30 2005-09-08 Tokyo Electron Ltd 浮上式基板搬送処理装置

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CN101003041A (zh) 2007-07-25
CN101003041B (zh) 2010-05-19

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