JP4550369B2 - 通気孔を設けた空洞の気密はんだ封止法 - Google Patents

通気孔を設けた空洞の気密はんだ封止法 Download PDF

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Publication number
JP4550369B2
JP4550369B2 JP2003107373A JP2003107373A JP4550369B2 JP 4550369 B2 JP4550369 B2 JP 4550369B2 JP 2003107373 A JP2003107373 A JP 2003107373A JP 2003107373 A JP2003107373 A JP 2003107373A JP 4550369 B2 JP4550369 B2 JP 4550369B2
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Japan
Prior art keywords
bonding material
assembly
solder
cavity
pressure
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Expired - Fee Related
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JP2003107373A
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English (en)
Japanese (ja)
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JP2003311400A5 (enExample
JP2003311400A (ja
Inventor
ジャイルズ・ハンプストン
好克 市村
ナンシー・エム・マー
ダニエル・ジェイ・ミラー
マイケル・ジェイ・ナイストロム
ゲイリー・アール・トロット
Original Assignee
アバゴ・テクノロジーズ・ファイバー・アイピー（シンガポール）プライベート・リミテッド
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Publication of JP2003311400A publication Critical patent/JP2003311400A/ja
Publication of JP2003311400A5 publication Critical patent/JP2003311400A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Products (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2003107373A 2002-04-16 2003-04-11 通気孔を設けた空洞の気密はんだ封止法 Expired - Fee Related JP4550369B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/124,174 US6732905B2 (en) 2002-04-16 2002-04-16 Vented cavity, hermetic solder seal
US10/124174 2002-04-16

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010135812A Division JP2010228006A (ja) 2002-04-16 2010-06-15 通気孔を設けた空洞の気密はんだ封止法

Publications (3)

Publication Number Publication Date
JP2003311400A JP2003311400A (ja) 2003-11-05
JP2003311400A5 JP2003311400A5 (enExample) 2006-05-25
JP4550369B2 true JP4550369B2 (ja) 2010-09-22

Family

ID=22413248

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2003107373A Expired - Fee Related JP4550369B2 (ja) 2002-04-16 2003-04-11 通気孔を設けた空洞の気密はんだ封止法
JP2010135812A Withdrawn JP2010228006A (ja) 2002-04-16 2010-06-15 通気孔を設けた空洞の気密はんだ封止法

Family Applications After (1)

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JP2010135812A Withdrawn JP2010228006A (ja) 2002-04-16 2010-06-15 通気孔を設けた空洞の気密はんだ封止法

Country Status (3)

Country Link
US (1) US6732905B2 (enExample)
JP (2) JP4550369B2 (enExample)
GB (1) GB2387562B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100831793B1 (ko) * 2002-02-04 2008-05-28 엘지전자 주식회사 쿨러
DE102007005345B4 (de) * 2007-02-02 2014-06-18 Seho Systemtechnik Gmbh Verfahren zum Reflow-Löten sowie Vorrichtung zur Durchführung des Verfahrens
CN101702952B (zh) * 2007-12-28 2011-09-14 欧南芭株式会社 端子板电路
EP3422826A1 (en) 2017-06-26 2019-01-02 Koninklijke Philips N.V. An apparatus and a method of manufacturing an apparatus
CN113369823B (zh) * 2021-06-30 2023-01-03 西安远航真空钎焊技术有限公司 基于真空钎焊的镶嵌式叠片制备方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5123759A (en) * 1974-08-22 1976-02-25 Asahi Glass Co Ltd Ekishohyojisoshino fushihoho
JPS5145980A (en) * 1974-10-17 1976-04-19 Matsushita Electronics Corp Handotaisochino seizohoho
JPS5376372A (en) * 1976-12-17 1978-07-06 Matsushita Electric Industrial Co Ltd Device for attaching chip circuit parts
JPS5743830A (en) * 1980-08-29 1982-03-12 Kasai Kogyo Co Ltd Pasting method of skin for pasted molding
US4413766A (en) * 1981-04-03 1983-11-08 General Electric Company Method of forming a conductor pattern including fine conductor runs on a ceramic substrate
DE3562581D1 (en) 1984-04-09 1988-06-16 Michelin & Cie Method to adhere two rubber elements by vulcanisation of a binding layer and products suited for such a method
DE3442537A1 (de) * 1984-11-22 1986-05-22 BBC Aktiengesellschaft Brown, Boveri & Cie., Baden, Aargau Verfahren zum blasenfreien verbinden eines grossflaechigen halbleiter-bauelements mit einem als substrat dienenden bauteil mittels loeten
JPS6377730A (ja) * 1986-09-22 1988-04-07 Hitachi Ltd 多層基板
JPH0698478B2 (ja) * 1991-03-22 1994-12-07 住友軽金属工業株式会社 アルミニウムハニカムパネルの製造方法
JPH05100236A (ja) * 1991-10-09 1993-04-23 Canon Inc 液晶表示素子の製造方法
JPH05259014A (ja) * 1992-03-12 1993-10-08 Fujitsu Ltd 半導体装置の製造方法
JPH0737768A (ja) * 1992-11-26 1995-02-07 Sumitomo Electric Ind Ltd 半導体ウェハの補強方法及び補強された半導体ウェハ
JP2962385B2 (ja) * 1993-01-07 1999-10-12 松下電子工業株式会社 半導体装置の製造方法
JP4077888B2 (ja) * 1995-07-21 2008-04-23 株式会社東芝 セラミックス回路基板
JPH09148481A (ja) 1995-11-24 1997-06-06 Hitachi Ltd 半導体装置およびその製造方法
JPH10261661A (ja) * 1997-03-19 1998-09-29 Toshiba Corp アンダーフィル充填方法及びプリント配線板構造
US6195478B1 (en) 1998-02-04 2001-02-27 Agilent Technologies, Inc. Planar lightwave circuit-based optical switches using micromirrors in trenches
US6055344A (en) 1998-02-18 2000-04-25 Hewlett-Packard Company Fabrication of a total internal reflection optical switch with vertical fluid fill-holes
US6338985B1 (en) * 2000-02-04 2002-01-15 Amkor Technology, Inc. Making chip size semiconductor packages
JP4493219B2 (ja) * 2001-01-31 2010-06-30 京セラ株式会社 弾性波装置の製造方法

Also Published As

Publication number Publication date
US20030192942A1 (en) 2003-10-16
US6732905B2 (en) 2004-05-11
JP2010228006A (ja) 2010-10-14
JP2003311400A (ja) 2003-11-05
GB2387562A (en) 2003-10-22
GB0304511D0 (en) 2003-04-02
GB2387562B (en) 2005-06-15

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