JP4519385B2 - 一体化した窓を有する成形された研磨パッド - Google Patents

一体化した窓を有する成形された研磨パッド Download PDF

Info

Publication number
JP4519385B2
JP4519385B2 JP2001516715A JP2001516715A JP4519385B2 JP 4519385 B2 JP4519385 B2 JP 4519385B2 JP 2001516715 A JP2001516715 A JP 2001516715A JP 2001516715 A JP2001516715 A JP 2001516715A JP 4519385 B2 JP4519385 B2 JP 4519385B2
Authority
JP
Japan
Prior art keywords
polishing pad
region
polymer
phase
flowable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2001516715A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003507199A (ja
JP2003507199A5 (enExample
Inventor
ロバーツ，ジョン・ブイ・エイチ
ピンハイロ，バリー・スコット
ジェームズ，デービッド・ビー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials Holding Inc
Original Assignee
DuPont Electronic Materials Holding Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DuPont Electronic Materials Holding Inc filed Critical DuPont Electronic Materials Holding Inc
Publication of JP2003507199A publication Critical patent/JP2003507199A/ja
Publication of JP2003507199A5 publication Critical patent/JP2003507199A5/ja
Application granted granted Critical
Publication of JP4519385B2 publication Critical patent/JP4519385B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
JP2001516715A 1999-08-17 2000-08-10 一体化した窓を有する成形された研磨パッド Expired - Lifetime JP4519385B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/375,962 1999-08-17
US09/375,962 US6171181B1 (en) 1999-08-17 1999-08-17 Molded polishing pad having integral window
PCT/US2000/021776 WO2001012387A1 (en) 1999-08-17 2000-08-10 Molded polishing pad having integral window

Publications (3)

Publication Number Publication Date
JP2003507199A JP2003507199A (ja) 2003-02-25
JP2003507199A5 JP2003507199A5 (enExample) 2007-09-06
JP4519385B2 true JP4519385B2 (ja) 2010-08-04

Family

ID=23483104

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001516715A Expired - Lifetime JP4519385B2 (ja) 1999-08-17 2000-08-10 一体化した窓を有する成形された研磨パッド

Country Status (6)

Country Link
US (2) US6171181B1 (enExample)
EP (1) EP1210209A4 (enExample)
JP (1) JP4519385B2 (enExample)
KR (1) KR100646887B1 (enExample)
TW (1) TW470688B (enExample)
WO (1) WO2001012387A1 (enExample)

Families Citing this family (98)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69632490T2 (de) * 1995-03-28 2005-05-12 Applied Materials, Inc., Santa Clara Verfahren und Vorrichtung zur In-Situ-Kontrolle und Bestimmung des Endes von chemisch-mechanischen Planiervorgängen
US6876454B1 (en) 1995-03-28 2005-04-05 Applied Materials, Inc. Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
US5893796A (en) * 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US6716085B2 (en) 2001-12-28 2004-04-06 Applied Materials Inc. Polishing pad with transparent window
US6179709B1 (en) * 1999-02-04 2001-01-30 Applied Materials, Inc. In-situ monitoring of linear substrate polishing operations
US6524164B1 (en) * 1999-09-14 2003-02-25 Applied Materials, Inc. Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus
EP1257386A1 (en) 2000-02-25 2002-11-20 Rodel Holdings, Inc. Polishing pad with a transparent portion
KR100789663B1 (ko) * 2000-03-15 2007-12-31 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 연마층에 투명 윈도우 부분을 갖는 연마 패드
US7374477B2 (en) * 2002-02-06 2008-05-20 Applied Materials, Inc. Polishing pads useful for endpoint detection in chemical mechanical polishing
US8485862B2 (en) * 2000-05-19 2013-07-16 Applied Materials, Inc. Polishing pad for endpoint detection and related methods
AU2001291143A1 (en) 2000-10-06 2002-04-22 Cabot Microelectronics Corporation Polishing pad comprising a filled translucent region
US6688956B1 (en) * 2000-11-29 2004-02-10 Psiloquest Inc. Substrate polishing device and method
WO2002070200A1 (en) * 2001-03-01 2002-09-12 Cabot Microelectronics Corporation Method for manufacturing a polishing pad having a compressed translucent region
US20020193058A1 (en) * 2001-06-15 2002-12-19 Carter Stephen P. Polishing apparatus that provides a window
JP4570286B2 (ja) * 2001-07-03 2010-10-27 ニッタ・ハース株式会社 研磨パッド
JP2003048151A (ja) * 2001-08-08 2003-02-18 Rodel Nitta Co 研磨パッド
JP2003062748A (ja) * 2001-08-24 2003-03-05 Inoac Corp 研磨用パッド
US7030018B2 (en) * 2002-02-04 2006-04-18 Kla-Tencor Technologies Corp. Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool
US6875077B2 (en) * 2002-03-18 2005-04-05 Raytech Innovative Solutions, Inc. Polishing pad for use in chemical/mechanical planarization of semiconductor wafers having a transparent window for end-point determination and method of making
US20030194959A1 (en) * 2002-04-15 2003-10-16 Cabot Microelectronics Corporation Sintered polishing pad with regions of contrasting density
USD469766S1 (en) 2002-04-25 2003-02-04 Intec, Inc. Game controller
US20050276967A1 (en) * 2002-05-23 2005-12-15 Cabot Microelectronics Corporation Surface textured microporous polishing pads
US20040171339A1 (en) * 2002-10-28 2004-09-02 Cabot Microelectronics Corporation Microporous polishing pads
US6913517B2 (en) * 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
US7579071B2 (en) * 2002-09-17 2009-08-25 Korea Polyol Co., Ltd. Polishing pad containing embedded liquid microelements and method of manufacturing the same
KR100465649B1 (ko) * 2002-09-17 2005-01-13 한국포리올 주식회사 일체형 연마 패드 및 그 제조 방법
US7267607B2 (en) * 2002-10-28 2007-09-11 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US7435165B2 (en) 2002-10-28 2008-10-14 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US7311862B2 (en) * 2002-10-28 2007-12-25 Cabot Microelectronics Corporation Method for manufacturing microporous CMP materials having controlled pore size
US8845852B2 (en) * 2002-11-27 2014-09-30 Toyo Tire & Rubber Co., Ltd. Polishing pad and method of producing semiconductor device
US6676483B1 (en) 2003-02-03 2004-01-13 Rodel Holdings, Inc. Anti-scattering layer for polishing pad windows
US6960120B2 (en) 2003-02-10 2005-11-01 Cabot Microelectronics Corporation CMP pad with composite transparent window
US6832947B2 (en) * 2003-02-10 2004-12-21 Cabot Microelectronics Corporation CMP pad with composite transparent window
EP1594656B1 (en) * 2003-02-18 2007-09-12 Parker-Hannifin Corporation Polishing article for electro-chemical mechanical polishing
US6991514B1 (en) 2003-02-21 2006-01-31 Verity Instruments, Inc. Optical closed-loop control system for a CMP apparatus and method of manufacture thereof
US7704125B2 (en) 2003-03-24 2010-04-27 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US9278424B2 (en) 2003-03-25 2016-03-08 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US8864859B2 (en) 2003-03-25 2014-10-21 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
SG185141A1 (en) 2003-03-25 2012-11-29 Neopad Technologies Corp Customized polish pads for chemical mechanical planarization
EP1466699A1 (en) * 2003-04-09 2004-10-13 JSR Corporation Abrasive pad, method and metal mold for manufacturing the same, and semiconductor wafer polishing method
US20040209066A1 (en) * 2003-04-17 2004-10-21 Swisher Robert G. Polishing pad with window for planarization
US6884156B2 (en) * 2003-06-17 2005-04-26 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
US7435161B2 (en) * 2003-06-17 2008-10-14 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
US6997777B2 (en) * 2003-06-17 2006-02-14 Cabot Microelectronics Corporation Ultrasonic welding method for the manufacture of a polishing pad comprising an optically transmissive region
US7086932B2 (en) * 2004-05-11 2006-08-08 Freudenberg Nonwovens Polishing pad
JP2005051237A (ja) * 2003-07-17 2005-02-24 Jsr Corp 化学機械研磨用パッドおよび化学機械研磨方法
US7183213B2 (en) * 2003-07-17 2007-02-27 Jsr Corporation Chemical mechanical polishing pad and chemical mechanical polishing method
JP4721016B2 (ja) * 2003-07-17 2011-07-13 Ｊｓｒ株式会社 化学機械研磨用パッドの製造方法
US7195539B2 (en) * 2003-09-19 2007-03-27 Cabot Microelectronics Coporation Polishing pad with recessed window
US7258602B2 (en) * 2003-10-22 2007-08-21 Iv Technologies Co., Ltd. Polishing pad having grooved window therein and method of forming the same
US7442116B2 (en) * 2003-11-04 2008-10-28 Jsr Corporation Chemical mechanical polishing pad
US6984163B2 (en) * 2003-11-25 2006-01-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with high optical transmission window
US7132033B2 (en) * 2004-02-27 2006-11-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming a layered polishing pad
USD559064S1 (en) 2004-03-17 2008-01-08 Jsr Corporation Polishing pad
USD559063S1 (en) 2004-03-17 2008-01-08 Jsr Corporation Polishing pad
US7204742B2 (en) * 2004-03-25 2007-04-17 Cabot Microelectronics Corporation Polishing pad comprising hydrophobic region and endpoint detection port
US20050245171A1 (en) * 2004-04-28 2005-11-03 Jsr Corporation Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method for semiconductor wafers
US8075372B2 (en) * 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
US20060089095A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US20060089094A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US20060089093A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
TWI385050B (zh) * 2005-02-18 2013-02-11 Nexplanar Corp 用於ｃｍｐ之特製拋光墊及其製造方法及其用途
KR101521414B1 (ko) * 2005-08-22 2015-05-19 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 폴리싱의 스펙트럼 기반 모니터링을 위한 장치 및 방법
US7764377B2 (en) 2005-08-22 2010-07-27 Applied Materials, Inc. Spectrum based endpointing for chemical mechanical polishing
JP2007118106A (ja) * 2005-10-26 2007-05-17 Toyo Tire & Rubber Co Ltd 研磨パッド及びその製造方法
KR100882045B1 (ko) * 2006-02-15 2009-02-09 어플라이드 머티어리얼스, 인코포레이티드 그루브형 서브패드를 구비한 폴리싱 장치
US20070212979A1 (en) * 2006-03-09 2007-09-13 Rimpad Tech Ltd. Composite polishing pad
JP4971028B2 (ja) * 2007-05-16 2012-07-11 東洋ゴム工業株式会社 研磨パッドの製造方法
US8562389B2 (en) * 2007-06-08 2013-10-22 Applied Materials, Inc. Thin polishing pad with window and molding process
TWI411495B (zh) * 2007-08-16 2013-10-11 Cabot Microelectronics Corp 拋光墊
JP2009148891A (ja) * 2009-04-02 2009-07-09 Nitta Haas Inc 研磨パッド
US8257544B2 (en) * 2009-06-10 2012-09-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having a low defect integral window
US8506355B1 (en) * 2010-01-04 2013-08-13 Applied Micro Circuits Corporation System and method for in-situ inspection during metallurgical cross-sectioning
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
JP5715770B2 (ja) * 2010-06-17 2015-05-13 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド 低欠陥の一体型窓を有する化学機械研磨パッド及び当該化学機械研磨パッドを用いて基体を化学機械研磨する方法
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
CN102310366B (zh) * 2010-07-08 2014-03-05 罗门哈斯电子材料Cmp控股股份有限公司 具有低缺陷整体窗的化学机械抛光垫
US8257545B2 (en) 2010-09-29 2012-09-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with light stable polymeric endpoint detection window and method of polishing therewith
WO2012068428A2 (en) * 2010-11-18 2012-05-24 Cabot Microelectronics Corporation Polishing pad comprising transmissive region
US11090778B2 (en) 2012-04-02 2021-08-17 Thomas West, Inc. Methods and systems for centrifugal casting of polymer polish pads and polishing pads made by the methods
US10722997B2 (en) 2012-04-02 2020-07-28 Thomas West, Inc. Multilayer polishing pads made by the methods for centrifugal casting of polymer polish pads
US10022842B2 (en) 2012-04-02 2018-07-17 Thomas West, Inc. Method and systems to control optical transmissivity of a polish pad material
US9156125B2 (en) * 2012-04-11 2015-10-13 Cabot Microelectronics Corporation Polishing pad with light-stable light-transmitting region
US20140256226A1 (en) * 2013-03-07 2014-09-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Broad spectrum, endpoint detection window chemical mechanical polishing pad and polishing method
US9186772B2 (en) 2013-03-07 2015-11-17 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with broad spectrum, endpoint detection window and method of polishing therewith
US9216489B2 (en) 2014-03-28 2015-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
US9064806B1 (en) 2014-03-28 2015-06-23 Rohm and Haas Electronics Materials CMP Holdings, Inc. Soft and conditionable chemical mechanical polishing pad with window
US9259820B2 (en) 2014-03-28 2016-02-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with polishing layer and window
US9333620B2 (en) 2014-04-29 2016-05-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with clear endpoint detection window
US9314897B2 (en) 2014-04-29 2016-04-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
US10213894B2 (en) 2016-02-26 2019-02-26 Applied Materials, Inc. Method of placing window in thin polishing pad
KR101904322B1 (ko) * 2017-01-23 2018-10-04 에스케이씨 주식회사 연마패드 및 이의 제조방법
KR20190006703A (ko) 2017-07-11 2019-01-21 에스케이씨 주식회사 연마패드의 비파괴 누수 검사 방법
KR101945878B1 (ko) * 2017-07-11 2019-02-11 에스케이씨 주식회사 연마층과 유사 경도를 갖는 윈도우를 포함하는 연마패드
KR101945869B1 (ko) 2017-08-07 2019-02-11 에스케이씨 주식회사 우수한 기밀성을 갖는 연마패드
KR102080840B1 (ko) 2018-03-29 2020-02-24 에스케이씨 주식회사 누수 방지된 연마패드 및 이의 제조방법
CN109202693B (zh) 2017-10-16 2021-10-12 Skc索密思株式会社 防泄漏抛光垫及其制造方法
KR101890331B1 (ko) 2017-10-16 2018-08-21 에스케이씨 주식회사 누수 방지된 연마패드 및 이의 제조방법

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4179488A (en) * 1976-03-31 1979-12-18 Yoshino Kogyosho Co., Ltd. Method of making a frosted bottle of saturated polyester
US4564497A (en) * 1982-07-28 1986-01-14 Yoshino Kogyosho Co., Ltd. Method of producing bottles of saturated polyester
US4728559A (en) * 1987-07-16 1988-03-01 Eastman Kodak Company Thermoformed plastic containers with transparent windows and method of making same
US5182070A (en) * 1991-04-08 1993-01-26 The Torrington Company Process for molding polymer bearing cage with amorphous case
US5413941A (en) 1994-01-06 1995-05-09 Micron Technology, Inc. Optical end point detection methods in semiconductor planarizing polishing processes
US5893796A (en) 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
JP2796077B2 (ja) * 1995-06-08 1998-09-10 松下電器産業株式会社 基板の研磨装置及び基板の研磨方法
US5605760A (en) 1995-08-21 1997-02-25 Rodel, Inc. Polishing pads
US6074287A (en) * 1996-04-12 2000-06-13 Nikon Corporation Semiconductor wafer polishing apparatus
JPH09277162A (ja) * 1996-04-12 1997-10-28 Nikon Corp 半導体研磨装置
CA2494248A1 (en) * 1997-04-16 1998-10-22 Husky Injection Molding Systems Ltd. Partial crystallization method and apparatus of amorphous plastic articles

Also Published As

Publication number Publication date
JP2003507199A (ja) 2003-02-25
KR20020020816A (ko) 2002-03-15
KR100646887B1 (ko) 2006-11-17
EP1210209A4 (en) 2004-06-30
EP1210209A1 (en) 2002-06-05
TW470688B (en) 2002-01-01
US6171181B1 (en) 2001-01-09
US6387312B1 (en) 2002-05-14
WO2001012387A1 (en) 2001-02-22

Similar Documents

Publication Publication Date Title
JP4519385B2 (ja) 一体化した窓を有する成形された研磨パッド
CN101166604B (zh) 包括用于抛光衬底的单次流延或模制而成的单一式抛光垫的制品
US6648733B2 (en) Polishing pads and methods relating thereto
TWI385050B (zh) 用於ｃｍｐ之特製拋光墊及其製造方法及其用途
US6869350B2 (en) Polishing pads and methods relating thereto
CN101489721B (zh) 抛光垫
TW200906926A (en) Method of manufacturing polishing pad
TW201404532A (zh) 包含具有透明基準層上的隙縫或開孔之拋光表面層之拋光墊
JP2003048151A (ja) 研磨パッド
TWI647066B (zh) Method and system for controlling light transmittance of polishing pad (polishing pad) material
KR102100654B1 (ko) 폴리머 연마패드의 원심주조를 위한 방법 및 시스템 및 상기 방법으로 만들어진 연마패드
US11219982B2 (en) Method and systems to control optical transmissivity of a polish pad material
CN109693176A (zh) 抛光层、抛光垫及制备方法
JP7220130B2 (ja) 研磨パッド及び研磨パッドの製造方法
JP2000061818A (ja) 研磨パッド
JPH0593087A (ja) 透明樹脂成形品，プラスチツクレンズおよびその製造方法
JP7737476B2 (ja) 研磨パッド用ウィンドウの製造方法及びこの方法で製造された研磨パッド用ウィンドウ
KR102625874B1 (ko) 연마패드 및 이의 제조방법
KR100564910B1 (ko) 마이크로 몰드를 이용한 씨엠피(화학기계적) 연마패드 및이의 제조방법
JP2024063401A (ja) 研磨パッドの製造方法
CN120572457A (zh) 一种终点检测窗口及其制备方法和应用
KR20070021930A (ko) 연마 패드 및 제조방법

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070713

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070713

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100112

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100406

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20100427

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20100519

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130528

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 4519385

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130528

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140528

Year of fee payment: 4

EXPY Cancellation because of completion of term