JP4519385B2 - 一体化した窓を有する成形された研磨パッド - Google Patents

一体化した窓を有する成形された研磨パッド Download PDF

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Publication number
JP4519385B2
JP4519385B2 JP2001516715A JP2001516715A JP4519385B2 JP 4519385 B2 JP4519385 B2 JP 4519385B2 JP 2001516715 A JP2001516715 A JP 2001516715A JP 2001516715 A JP2001516715 A JP 2001516715A JP 4519385 B2 JP4519385 B2 JP 4519385B2
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JP
Japan
Prior art keywords
polishing pad
region
polymer
phase
flowable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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JP2001516715A
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English (en)
Japanese (ja)
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JP2003507199A5 (enExample
JP2003507199A (ja
Inventor
ロバーツ，ジョン・ブイ・エイチ
ピンハイロ，バリー・スコット
ジェームズ，デービッド・ビー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials Holding Inc
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DuPont Electronic Materials Holding Inc
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Application filed by DuPont Electronic Materials Holding Inc filed Critical DuPont Electronic Materials Holding Inc
Publication of JP2003507199A publication Critical patent/JP2003507199A/ja
Publication of JP2003507199A5 publication Critical patent/JP2003507199A5/ja
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Publication of JP4519385B2 publication Critical patent/JP4519385B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
JP2001516715A 1999-08-17 2000-08-10 一体化した窓を有する成形された研磨パッド Expired - Lifetime JP4519385B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/375,962 US6171181B1 (en) 1999-08-17 1999-08-17 Molded polishing pad having integral window
US09/375,962 1999-08-17
PCT/US2000/021776 WO2001012387A1 (en) 1999-08-17 2000-08-10 Molded polishing pad having integral window

Publications (3)

Publication Number Publication Date
JP2003507199A JP2003507199A (ja) 2003-02-25
JP2003507199A5 JP2003507199A5 (enExample) 2007-09-06
JP4519385B2 true JP4519385B2 (ja) 2010-08-04

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ID=23483104

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001516715A Expired - Lifetime JP4519385B2 (ja) 1999-08-17 2000-08-10 一体化した窓を有する成形された研磨パッド

Country Status (6)

Country Link
US (2) US6171181B1 (enExample)
EP (1) EP1210209A4 (enExample)
JP (1) JP4519385B2 (enExample)
KR (1) KR100646887B1 (enExample)
TW (1) TW470688B (enExample)
WO (1) WO2001012387A1 (enExample)

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* Cited by examiner, † Cited by third party
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JP4570286B2 (ja) * 2001-07-03 2010-10-27 ニッタ・ハース株式会社 研磨パッド
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US7267607B2 (en) * 2002-10-28 2007-09-11 Cabot Microelectronics Corporation Transparent microporous materials for CMP
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JP4721016B2 (ja) * 2003-07-17 2011-07-13 Ｊｓｒ株式会社 化学機械研磨用パッドの製造方法
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CN102626895B (zh) * 2005-08-22 2016-05-25 应用材料公司 基于光谱的监测化学机械研磨的装置及方法
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KR20190006703A (ko) 2017-07-11 2019-01-21 에스케이씨 주식회사 연마패드의 비파괴 누수 검사 방법
KR101945878B1 (ko) * 2017-07-11 2019-02-11 에스케이씨 주식회사 연마층과 유사 경도를 갖는 윈도우를 포함하는 연마패드
KR101945869B1 (ko) 2017-08-07 2019-02-11 에스케이씨 주식회사 우수한 기밀성을 갖는 연마패드
CN109202693B (zh) 2017-10-16 2021-10-12 Skc索密思株式会社 防泄漏抛光垫及其制造方法
KR101890331B1 (ko) 2017-10-16 2018-08-21 에스케이씨 주식회사 누수 방지된 연마패드 및 이의 제조방법
KR102080840B1 (ko) 2018-03-29 2020-02-24 에스케이씨 주식회사 누수 방지된 연마패드 및 이의 제조방법
WO2025027801A1 (ja) 2023-08-01 2025-02-06 任天堂株式会社 ゲームコントローラ

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Also Published As

Publication number Publication date
KR20020020816A (ko) 2002-03-15
TW470688B (en) 2002-01-01
EP1210209A1 (en) 2002-06-05
US6387312B1 (en) 2002-05-14
KR100646887B1 (ko) 2006-11-17
US6171181B1 (en) 2001-01-09
EP1210209A4 (en) 2004-06-30
JP2003507199A (ja) 2003-02-25
WO2001012387A1 (en) 2001-02-22

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