KR100646887B1 - 일체식 창을 갖는 성형된 연마 패드의 제조방법 - Google Patents

일체식 창을 갖는 성형된 연마 패드의 제조방법 Download PDF

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Publication number
KR100646887B1
KR100646887B1 KR1020027002004A KR20027002004A KR100646887B1 KR 100646887 B1 KR100646887 B1 KR 100646887B1 KR 1020027002004 A KR1020027002004 A KR 1020027002004A KR 20027002004 A KR20027002004 A KR 20027002004A KR 100646887 B1 KR100646887 B1 KR 100646887B1
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South Korea
Prior art keywords
delete delete
polymeric material
forming region
transparent
flowable polymeric
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KR20020020816A (ko
Inventor
로버츠존브이에이치
핀헤이로베리스콧
제임스데이비드비
Original Assignee
롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
KR1020027002004A 1999-08-17 2000-08-10 일체식 창을 갖는 성형된 연마 패드의 제조방법 Expired - Lifetime KR100646887B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/375,962 1999-08-17
US09/375,962 US6171181B1 (en) 1999-08-17 1999-08-17 Molded polishing pad having integral window

Publications (2)

Publication Number Publication Date
KR20020020816A KR20020020816A (ko) 2002-03-15
KR100646887B1 true KR100646887B1 (ko) 2006-11-17

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Application Number Title Priority Date Filing Date
KR1020027002004A Expired - Lifetime KR100646887B1 (ko) 1999-08-17 2000-08-10 일체식 창을 갖는 성형된 연마 패드의 제조방법

Country Status (6)

Country Link
US (2) US6171181B1 (enExample)
EP (1) EP1210209A4 (enExample)
JP (1) JP4519385B2 (enExample)
KR (1) KR100646887B1 (enExample)
TW (1) TW470688B (enExample)
WO (1) WO2001012387A1 (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101890331B1 (ko) 2017-10-16 2018-08-21 에스케이씨 주식회사 누수 방지된 연마패드 및 이의 제조방법
KR20190006703A (ko) 2017-07-11 2019-01-21 에스케이씨 주식회사 연마패드의 비파괴 누수 검사 방법
KR20190114264A (ko) 2018-03-29 2019-10-10 에스케이씨 주식회사 누수 방지된 연마패드 및 이의 제조방법
US11267098B2 (en) 2017-10-16 2022-03-08 Skc Solmics Co., Ltd. Leakage-proof polishing pad and process for preparing the same
US11571783B2 (en) 2017-08-07 2023-02-07 Skc Solmics Co., Ltd. Polishing pad having excellent airtightness

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US6716085B2 (en) 2001-12-28 2004-04-06 Applied Materials Inc. Polishing pad with transparent window
US6179709B1 (en) * 1999-02-04 2001-01-30 Applied Materials, Inc. In-situ monitoring of linear substrate polishing operations
US6524164B1 (en) * 1999-09-14 2003-02-25 Applied Materials, Inc. Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus
EP1257386A1 (en) 2000-02-25 2002-11-20 Rodel Holdings, Inc. Polishing pad with a transparent portion
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US6997777B2 (en) * 2003-06-17 2006-02-14 Cabot Microelectronics Corporation Ultrasonic welding method for the manufacture of a polishing pad comprising an optically transmissive region
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JP2005051237A (ja) * 2003-07-17 2005-02-24 Jsr Corp 化学機械研磨用パッドおよび化学機械研磨方法
US7183213B2 (en) * 2003-07-17 2007-02-27 Jsr Corporation Chemical mechanical polishing pad and chemical mechanical polishing method
JP4721016B2 (ja) * 2003-07-17 2011-07-13 Ｊｓｒ株式会社 化学機械研磨用パッドの製造方法
US7195539B2 (en) * 2003-09-19 2007-03-27 Cabot Microelectronics Coporation Polishing pad with recessed window
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Publication number Priority date Publication date Assignee Title
KR20190006703A (ko) 2017-07-11 2019-01-21 에스케이씨 주식회사 연마패드의 비파괴 누수 검사 방법
US11571783B2 (en) 2017-08-07 2023-02-07 Skc Solmics Co., Ltd. Polishing pad having excellent airtightness
KR101890331B1 (ko) 2017-10-16 2018-08-21 에스케이씨 주식회사 누수 방지된 연마패드 및 이의 제조방법
US11267098B2 (en) 2017-10-16 2022-03-08 Skc Solmics Co., Ltd. Leakage-proof polishing pad and process for preparing the same
KR20190114264A (ko) 2018-03-29 2019-10-10 에스케이씨 주식회사 누수 방지된 연마패드 및 이의 제조방법

Also Published As

Publication number Publication date
JP2003507199A (ja) 2003-02-25
KR20020020816A (ko) 2002-03-15
EP1210209A4 (en) 2004-06-30
JP4519385B2 (ja) 2010-08-04
EP1210209A1 (en) 2002-06-05
TW470688B (en) 2002-01-01
US6171181B1 (en) 2001-01-09
US6387312B1 (en) 2002-05-14
WO2001012387A1 (en) 2001-02-22

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