KR20020020816A - 일체식 창을 갖는 성형된 연마 패드 - Google Patents
일체식 창을 갖는 성형된 연마 패드 Download PDFInfo
- Publication number
- KR20020020816A KR20020020816A KR1020027002004A KR20027002004A KR20020020816A KR 20020020816 A KR20020020816 A KR 20020020816A KR 1020027002004 A KR1020027002004 A KR 1020027002004A KR 20027002004 A KR20027002004 A KR 20027002004A KR 20020020816 A KR20020020816 A KR 20020020816A
- Authority
- KR
- South Korea
- Prior art keywords
- polymeric material
- polishing pad
- transparent
- region
- opaque
- Prior art date
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Abstract
Description
Claims (19)
- 중합체성 물질이 투명한 영역과 중합체성 물질이 불투명한 인접 영역을 포함하는, 중합체성 물질로 제조된 일체식 성형품을 포함하는 연마 패드.
- 제1항에 있어서, 중합체성 물질이 실질적으로 단일 열가소성 물질인 연마 패드.
- 제1항에 있어서, 중합체성 물질이 실질적으로 열가소성 물질들로 이루어진 블렌드인 연마 패드.
- 제1항에 있어서, 중합체성 물질이 반응성 열경화성 중합체인 연마 패드.
- 제1항에 있어서, 투명한 영역 중의 중합체성 물질이 무정형 상이고, 불투명한 영역 중의 중합체성 물질이 반결정성 상인 연마 패드.
- 제1항에 있어서, 투명한 영역 중의 중합체성 물질이 반결정성 상이고, 너무 작아서 빛을 산란시킬 수 없는 미결정 크기를 갖는 연마 패드.
- 제1항에 있어서, 투명한 영역과 불투명한 영역이 상 분리된 도메인 크기의차이에 의해 생성되는 연마 패드.
- 가공처리되어 제품에 투명한 영역과 불투명한 인접 영역을 제공하는, 균일한 조성을 갖는 유동가능한 중합체성 물질을 고화시킴으로써 형성된 제품을 포함하는 연마 패드.
- 제8항에 있어서, 중합체성 물질이 실질적으로 단일 열가소성 물질인 연마 패드.
- 제8항에 있어서, 중합체성 물질이 실질적으로 열가소성 물질들로 이루어진 블렌드인 연마 패드.
- 제8항에 있어서, 중합체성 물질이 반응성 열경화성 중합체인 연마 패드.
- 제8항에 있어서, 투명한 영역 중의 중합체성 물질이 무정형 상이고, 불투명한 영역 중의 중합체성 물질이 반결정성 상인 연마 패드.
- 제8항에 있어서, 투명한 영역 중의 중합체성 물질이 반결정성 상이고, 너무 작아서 빛을 산란시킬 수 없는 미결정 크기를 갖는 연마 패드.
- 제8항에 있어서, 투명한 영역과 불투명한 영역이 상 분리된 도메인 크기의 차이에 의해 생성되는 연마 패드.
- 금형 캐비티를 갖는 금형을 제공하는 단계;투명한 유동가능한 중합체성 물질을 금형 캐비티로 이동시키는 단계;금형 캐비티 영역에서 경화되고, 경화 후 투명하게 잔류하는 유동가능한 중합체성 물질을 당해 영역에서 비교적 빠른 속도로 냉각시키는 단계 및금형 캐비티의 인접 영역에서 경화되고, 상대적으로 불투명하게 되는 유동가능한 중합체성 물질을 당해 영역에서 비교적 느린 속도로 냉각시키는 단계를 포함하는, 연마 패드의 제조방법.
- 제15항에 있어서, 유동가능한 중합체성 물질이 실질적으로 단일 열가소성 물질인 방법.
- 제15항에 있어서, 유동가능한 중합체성 물질이 실질적으로 열가소성 물질들로 이루어진 블렌드인 방법.
- 제15항에 있어서, 유동가능한 중합체성 물질이 반응성 열경화성 중합체인 방법.
- 제15항에 있어서, 투명한 영역과 불투명한 영역이 상 분리된 도메인 크기의 차이에 의해 생성되는 방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/375,962 | 1999-08-17 | ||
US09/375,962 US6171181B1 (en) | 1999-08-17 | 1999-08-17 | Molded polishing pad having integral window |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20020020816A true KR20020020816A (ko) | 2002-03-15 |
KR100646887B1 KR100646887B1 (ko) | 2006-11-17 |
Family
ID=23483104
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020027002004A KR100646887B1 (ko) | 1999-08-17 | 2000-08-10 | 일체식 창을 갖는 성형된 연마 패드의 제조방법 |
Country Status (6)
Country | Link |
---|---|
US (2) | US6171181B1 (ko) |
EP (1) | EP1210209A4 (ko) |
JP (1) | JP4519385B2 (ko) |
KR (1) | KR100646887B1 (ko) |
TW (1) | TW470688B (ko) |
WO (1) | WO2001012387A1 (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100913282B1 (ko) * | 2003-06-17 | 2009-08-21 | 캐보트 마이크로일렉트로닉스 코포레이션 | 광학적으로 투과성인 영역을 포함하는 연마 패드의 제조를위한 초음파 융착 방법 |
CN101778701B (zh) * | 2007-08-16 | 2012-06-27 | 卡伯特微电子公司 | 抛光垫 |
Families Citing this family (93)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3431115B2 (ja) | 1995-03-28 | 2003-07-28 | アプライド マテリアルズ インコーポレイテッド | ケミカルメカニカルポリシングの操作をインシチュウでモニタするための装置及び方法 |
US6876454B1 (en) | 1995-03-28 | 2005-04-05 | Applied Materials, Inc. | Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations |
US5893796A (en) * | 1995-03-28 | 1999-04-13 | Applied Materials, Inc. | Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
US6716085B2 (en) | 2001-12-28 | 2004-04-06 | Applied Materials Inc. | Polishing pad with transparent window |
US6179709B1 (en) * | 1999-02-04 | 2001-01-30 | Applied Materials, Inc. | In-situ monitoring of linear substrate polishing operations |
US6524164B1 (en) * | 1999-09-14 | 2003-02-25 | Applied Materials, Inc. | Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus |
KR20020084150A (ko) | 2000-02-25 | 2002-11-04 | 로델 홀딩스 인코포레이티드 | 투명부를 갖는 연마 패드 |
US6860793B2 (en) * | 2000-03-15 | 2005-03-01 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Window portion with an adjusted rate of wear |
US8485862B2 (en) * | 2000-05-19 | 2013-07-16 | Applied Materials, Inc. | Polishing pad for endpoint detection and related methods |
US7374477B2 (en) * | 2002-02-06 | 2008-05-20 | Applied Materials, Inc. | Polishing pads useful for endpoint detection in chemical mechanical polishing |
JP2004511108A (ja) | 2000-10-06 | 2004-04-08 | キャボット マイクロエレクトロニクス コーポレイション | 充填材入り透光性領域を含む研磨パッド |
US6688956B1 (en) * | 2000-11-29 | 2004-02-10 | Psiloquest Inc. | Substrate polishing device and method |
US6840843B2 (en) | 2001-03-01 | 2005-01-11 | Cabot Microelectronics Corporation | Method for manufacturing a polishing pad having a compressed translucent region |
WO2002102547A1 (en) * | 2001-06-15 | 2002-12-27 | Rodel Holdings, Inc. | Polishing apparatus that provides a window |
JP4570286B2 (ja) * | 2001-07-03 | 2010-10-27 | ニッタ・ハース株式会社 | 研磨パッド |
JP2003048151A (ja) * | 2001-08-08 | 2003-02-18 | Rodel Nitta Co | 研磨パッド |
JP2003062748A (ja) * | 2001-08-24 | 2003-03-05 | Inoac Corp | 研磨用パッド |
US6884146B2 (en) | 2002-02-04 | 2005-04-26 | Kla-Tencor Technologies Corp. | Systems and methods for characterizing a polishing process |
US6875077B2 (en) * | 2002-03-18 | 2005-04-05 | Raytech Innovative Solutions, Inc. | Polishing pad for use in chemical/mechanical planarization of semiconductor wafers having a transparent window for end-point determination and method of making |
US20030194959A1 (en) * | 2002-04-15 | 2003-10-16 | Cabot Microelectronics Corporation | Sintered polishing pad with regions of contrasting density |
US20040171339A1 (en) * | 2002-10-28 | 2004-09-02 | Cabot Microelectronics Corporation | Microporous polishing pads |
US6913517B2 (en) * | 2002-05-23 | 2005-07-05 | Cabot Microelectronics Corporation | Microporous polishing pads |
US20050276967A1 (en) * | 2002-05-23 | 2005-12-15 | Cabot Microelectronics Corporation | Surface textured microporous polishing pads |
KR100465649B1 (ko) * | 2002-09-17 | 2005-01-13 | 한국포리올 주식회사 | 일체형 연마 패드 및 그 제조 방법 |
US7579071B2 (en) * | 2002-09-17 | 2009-08-25 | Korea Polyol Co., Ltd. | Polishing pad containing embedded liquid microelements and method of manufacturing the same |
US7267607B2 (en) * | 2002-10-28 | 2007-09-11 | Cabot Microelectronics Corporation | Transparent microporous materials for CMP |
US7435165B2 (en) | 2002-10-28 | 2008-10-14 | Cabot Microelectronics Corporation | Transparent microporous materials for CMP |
US7311862B2 (en) * | 2002-10-28 | 2007-12-25 | Cabot Microelectronics Corporation | Method for manufacturing microporous CMP materials having controlled pore size |
US8845852B2 (en) * | 2002-11-27 | 2014-09-30 | Toyo Tire & Rubber Co., Ltd. | Polishing pad and method of producing semiconductor device |
US6676483B1 (en) | 2003-02-03 | 2004-01-13 | Rodel Holdings, Inc. | Anti-scattering layer for polishing pad windows |
US6832947B2 (en) * | 2003-02-10 | 2004-12-21 | Cabot Microelectronics Corporation | CMP pad with composite transparent window |
US6960120B2 (en) | 2003-02-10 | 2005-11-01 | Cabot Microelectronics Corporation | CMP pad with composite transparent window |
DE602004008880T2 (de) * | 2003-02-18 | 2008-06-26 | Parker-Hannifin Corp., Cleveland | Polierartikel für elektro-chemisches-mechanisches polieren |
US6991514B1 (en) | 2003-02-21 | 2006-01-31 | Verity Instruments, Inc. | Optical closed-loop control system for a CMP apparatus and method of manufacture thereof |
US7704125B2 (en) | 2003-03-24 | 2010-04-27 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
US9278424B2 (en) | 2003-03-25 | 2016-03-08 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
CA2519942A1 (en) | 2003-03-25 | 2004-10-14 | Neopad Technologies Corporation | Chip customized polish pads for chemical mechanical planarization (cmp) |
US8864859B2 (en) | 2003-03-25 | 2014-10-21 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
EP1466699A1 (en) * | 2003-04-09 | 2004-10-13 | JSR Corporation | Abrasive pad, method and metal mold for manufacturing the same, and semiconductor wafer polishing method |
US20040209066A1 (en) * | 2003-04-17 | 2004-10-21 | Swisher Robert G. | Polishing pad with window for planarization |
US7435161B2 (en) * | 2003-06-17 | 2008-10-14 | Cabot Microelectronics Corporation | Multi-layer polishing pad material for CMP |
US6884156B2 (en) * | 2003-06-17 | 2005-04-26 | Cabot Microelectronics Corporation | Multi-layer polishing pad material for CMP |
US7086932B2 (en) * | 2004-05-11 | 2006-08-08 | Freudenberg Nonwovens | Polishing pad |
KR100627202B1 (ko) * | 2003-07-17 | 2006-09-25 | 제이에스알 가부시끼가이샤 | 화학 기계 연마용 패드 및 화학 기계 연마 방법 |
JP4721016B2 (ja) * | 2003-07-17 | 2011-07-13 | Jsr株式会社 | 化学機械研磨用パッドの製造方法 |
JP2005051237A (ja) * | 2003-07-17 | 2005-02-24 | Jsr Corp | 化学機械研磨用パッドおよび化学機械研磨方法 |
US7195539B2 (en) * | 2003-09-19 | 2007-03-27 | Cabot Microelectronics Coporation | Polishing pad with recessed window |
US7258602B2 (en) * | 2003-10-22 | 2007-08-21 | Iv Technologies Co., Ltd. | Polishing pad having grooved window therein and method of forming the same |
US7442116B2 (en) * | 2003-11-04 | 2008-10-28 | Jsr Corporation | Chemical mechanical polishing pad |
US6984163B2 (en) * | 2003-11-25 | 2006-01-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad with high optical transmission window |
US7132033B2 (en) * | 2004-02-27 | 2006-11-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of forming a layered polishing pad |
US7204742B2 (en) * | 2004-03-25 | 2007-04-17 | Cabot Microelectronics Corporation | Polishing pad comprising hydrophobic region and endpoint detection port |
DE602005000252T2 (de) * | 2004-04-28 | 2007-06-06 | Jsr Corp. | Kissen zum chemisch-mechanischen Polieren, Herstellungsverfahren dafür und chemisch-mechanisches Polierverfahren für Halbleiterwafer |
US8075372B2 (en) * | 2004-09-01 | 2011-12-13 | Cabot Microelectronics Corporation | Polishing pad with microporous regions |
US20060089094A1 (en) * | 2004-10-27 | 2006-04-27 | Swisher Robert G | Polyurethane urea polishing pad |
US20060089093A1 (en) * | 2004-10-27 | 2006-04-27 | Swisher Robert G | Polyurethane urea polishing pad |
US20060089095A1 (en) * | 2004-10-27 | 2006-04-27 | Swisher Robert G | Polyurethane urea polishing pad |
TWI385050B (zh) * | 2005-02-18 | 2013-02-11 | Nexplanar Corp | 用於cmp之特製拋光墊及其製造方法及其用途 |
US7764377B2 (en) | 2005-08-22 | 2010-07-27 | Applied Materials, Inc. | Spectrum based endpointing for chemical mechanical polishing |
KR101593927B1 (ko) * | 2005-08-22 | 2016-02-15 | 어플라이드 머티어리얼스, 인코포레이티드 | 화학적 기계적 폴리싱의 스펙트럼 기반 모니터링을 위한 장치 및 방법 |
JP2007118106A (ja) * | 2005-10-26 | 2007-05-17 | Toyo Tire & Rubber Co Ltd | 研磨パッド及びその製造方法 |
US20070197145A1 (en) * | 2006-02-15 | 2007-08-23 | Applied Materials, Inc. | Polishing article with window stripe |
WO2007104063A1 (en) * | 2006-03-09 | 2007-09-13 | Rimpad Tech Ltd. | Composite polishing pad |
JP4971028B2 (ja) * | 2007-05-16 | 2012-07-11 | 東洋ゴム工業株式会社 | 研磨パッドの製造方法 |
JP5363470B2 (ja) * | 2007-06-08 | 2013-12-11 | アプライド マテリアルズ インコーポレイテッド | 窓付きの薄い研磨パッド及び成形プロセス |
JP2009148891A (ja) * | 2009-04-02 | 2009-07-09 | Nitta Haas Inc | 研磨パッド |
US8257544B2 (en) * | 2009-06-10 | 2012-09-04 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad having a low defect integral window |
US8506355B1 (en) * | 2010-01-04 | 2013-08-13 | Applied Micro Circuits Corporation | System and method for in-situ inspection during metallurgical cross-sectioning |
US9017140B2 (en) | 2010-01-13 | 2015-04-28 | Nexplanar Corporation | CMP pad with local area transparency |
JP5715770B2 (ja) * | 2010-06-17 | 2015-05-13 | ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド | 低欠陥の一体型窓を有する化学機械研磨パッド及び当該化学機械研磨パッドを用いて基体を化学機械研磨する方法 |
CN102310366B (zh) * | 2010-07-08 | 2014-03-05 | 罗门哈斯电子材料Cmp控股股份有限公司 | 具有低缺陷整体窗的化学机械抛光垫 |
US9156124B2 (en) | 2010-07-08 | 2015-10-13 | Nexplanar Corporation | Soft polishing pad for polishing a semiconductor substrate |
US8257545B2 (en) | 2010-09-29 | 2012-09-04 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with light stable polymeric endpoint detection window and method of polishing therewith |
KR101602544B1 (ko) * | 2010-11-18 | 2016-03-10 | 캐보트 마이크로일렉트로닉스 코포레이션 | 투과성 영역을 포함하는 연마 패드 |
US10022842B2 (en) | 2012-04-02 | 2018-07-17 | Thomas West, Inc. | Method and systems to control optical transmissivity of a polish pad material |
SG10201608125WA (en) | 2012-04-02 | 2016-11-29 | Thomas West Inc | Methods and systems for centrifugal casting of polymer polish pads and polishing pads made by the methods |
US10722997B2 (en) | 2012-04-02 | 2020-07-28 | Thomas West, Inc. | Multilayer polishing pads made by the methods for centrifugal casting of polymer polish pads |
US9156125B2 (en) * | 2012-04-11 | 2015-10-13 | Cabot Microelectronics Corporation | Polishing pad with light-stable light-transmitting region |
US9186772B2 (en) | 2013-03-07 | 2015-11-17 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with broad spectrum, endpoint detection window and method of polishing therewith |
US20140256226A1 (en) * | 2013-03-07 | 2014-09-11 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Broad spectrum, endpoint detection window chemical mechanical polishing pad and polishing method |
US9216489B2 (en) | 2014-03-28 | 2015-12-22 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with endpoint detection window |
US9259820B2 (en) | 2014-03-28 | 2016-02-16 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with polishing layer and window |
US9064806B1 (en) | 2014-03-28 | 2015-06-23 | Rohm and Haas Electronics Materials CMP Holdings, Inc. | Soft and conditionable chemical mechanical polishing pad with window |
US9314897B2 (en) | 2014-04-29 | 2016-04-19 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with endpoint detection window |
US9333620B2 (en) | 2014-04-29 | 2016-05-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with clear endpoint detection window |
US10213894B2 (en) * | 2016-02-26 | 2019-02-26 | Applied Materials, Inc. | Method of placing window in thin polishing pad |
KR101904322B1 (ko) * | 2017-01-23 | 2018-10-04 | 에스케이씨 주식회사 | 연마패드 및 이의 제조방법 |
KR101945878B1 (ko) | 2017-07-11 | 2019-02-11 | 에스케이씨 주식회사 | 연마층과 유사 경도를 갖는 윈도우를 포함하는 연마패드 |
KR20190006703A (ko) | 2017-07-11 | 2019-01-21 | 에스케이씨 주식회사 | 연마패드의 비파괴 누수 검사 방법 |
KR101945869B1 (ko) | 2017-08-07 | 2019-02-11 | 에스케이씨 주식회사 | 우수한 기밀성을 갖는 연마패드 |
KR101890331B1 (ko) | 2017-10-16 | 2018-08-21 | 에스케이씨 주식회사 | 누수 방지된 연마패드 및 이의 제조방법 |
KR102080840B1 (ko) | 2018-03-29 | 2020-02-24 | 에스케이씨 주식회사 | 누수 방지된 연마패드 및 이의 제조방법 |
CN109202693B (zh) | 2017-10-16 | 2021-10-12 | Skc索密思株式会社 | 防泄漏抛光垫及其制造方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4179488A (en) * | 1976-03-31 | 1979-12-18 | Yoshino Kogyosho Co., Ltd. | Method of making a frosted bottle of saturated polyester |
US4564497A (en) * | 1982-07-28 | 1986-01-14 | Yoshino Kogyosho Co., Ltd. | Method of producing bottles of saturated polyester |
US4728559A (en) * | 1987-07-16 | 1988-03-01 | Eastman Kodak Company | Thermoformed plastic containers with transparent windows and method of making same |
US5182070A (en) * | 1991-04-08 | 1993-01-26 | The Torrington Company | Process for molding polymer bearing cage with amorphous case |
US5413941A (en) | 1994-01-06 | 1995-05-09 | Micron Technology, Inc. | Optical end point detection methods in semiconductor planarizing polishing processes |
US5893796A (en) | 1995-03-28 | 1999-04-13 | Applied Materials, Inc. | Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
JP2796077B2 (ja) * | 1995-06-08 | 1998-09-10 | 松下電器産業株式会社 | 基板の研磨装置及び基板の研磨方法 |
US5605760A (en) | 1995-08-21 | 1997-02-25 | Rodel, Inc. | Polishing pads |
JPH09277162A (ja) * | 1996-04-12 | 1997-10-28 | Nikon Corp | 半導体研磨装置 |
US6074287A (en) * | 1996-04-12 | 2000-06-13 | Nikon Corporation | Semiconductor wafer polishing apparatus |
CN101402250A (zh) * | 1997-04-16 | 2009-04-08 | 哈斯基注模系统有限公司 | 非晶体塑料制品的局部结晶方法和装置 |
-
1999
- 1999-08-17 US US09/375,962 patent/US6171181B1/en not_active Expired - Lifetime
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2000
- 2000-08-10 EP EP00952699A patent/EP1210209A4/en not_active Withdrawn
- 2000-08-10 TW TW089116116A patent/TW470688B/zh not_active IP Right Cessation
- 2000-08-10 WO PCT/US2000/021776 patent/WO2001012387A1/en not_active Application Discontinuation
- 2000-08-10 JP JP2001516715A patent/JP4519385B2/ja not_active Expired - Lifetime
- 2000-08-10 KR KR1020027002004A patent/KR100646887B1/ko active IP Right Grant
- 2000-09-20 US US09/666,418 patent/US6387312B1/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100913282B1 (ko) * | 2003-06-17 | 2009-08-21 | 캐보트 마이크로일렉트로닉스 코포레이션 | 광학적으로 투과성인 영역을 포함하는 연마 패드의 제조를위한 초음파 융착 방법 |
CN101778701B (zh) * | 2007-08-16 | 2012-06-27 | 卡伯特微电子公司 | 抛光垫 |
Also Published As
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EP1210209A4 (en) | 2004-06-30 |
US6387312B1 (en) | 2002-05-14 |
JP2003507199A (ja) | 2003-02-25 |
TW470688B (en) | 2002-01-01 |
US6171181B1 (en) | 2001-01-09 |
KR100646887B1 (ko) | 2006-11-17 |
EP1210209A1 (en) | 2002-06-05 |
WO2001012387A1 (en) | 2001-02-22 |
JP4519385B2 (ja) | 2010-08-04 |
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