JP4515177B2 - 配線形成方法 - Google Patents

配線形成方法 Download PDF

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Publication number
JP4515177B2
JP4515177B2 JP2004205799A JP2004205799A JP4515177B2 JP 4515177 B2 JP4515177 B2 JP 4515177B2 JP 2004205799 A JP2004205799 A JP 2004205799A JP 2004205799 A JP2004205799 A JP 2004205799A JP 4515177 B2 JP4515177 B2 JP 4515177B2
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JP
Japan
Prior art keywords
layer
wiring
protective metal
via post
polishing
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Expired - Fee Related
Application number
JP2004205799A
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English (en)
Japanese (ja)
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JP2006032462A5 (enExample
JP2006032462A (ja
Inventor
正宏 経塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Priority to JP2004205799A priority Critical patent/JP4515177B2/ja
Publication of JP2006032462A publication Critical patent/JP2006032462A/ja
Publication of JP2006032462A5 publication Critical patent/JP2006032462A5/ja
Application granted granted Critical
Publication of JP4515177B2 publication Critical patent/JP4515177B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2004205799A 2004-07-13 2004-07-13 配線形成方法 Expired - Fee Related JP4515177B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004205799A JP4515177B2 (ja) 2004-07-13 2004-07-13 配線形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004205799A JP4515177B2 (ja) 2004-07-13 2004-07-13 配線形成方法

Publications (3)

Publication Number Publication Date
JP2006032462A JP2006032462A (ja) 2006-02-02
JP2006032462A5 JP2006032462A5 (enExample) 2007-07-05
JP4515177B2 true JP4515177B2 (ja) 2010-07-28

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ID=35898474

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004205799A Expired - Fee Related JP4515177B2 (ja) 2004-07-13 2004-07-13 配線形成方法

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JP (1) JP4515177B2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5154963B2 (ja) * 2008-02-04 2013-02-27 新光電気工業株式会社 配線基板の製造方法
JP5411829B2 (ja) * 2009-10-30 2014-02-12 パナソニック株式会社 多層回路基板の製造方法及び該製造方法により製造された多層回路基板
TWI412308B (zh) * 2009-11-06 2013-10-11 威盛電子股份有限公司 線路基板及其製程
JP5680589B2 (ja) * 2012-06-25 2015-03-04 新光電気工業株式会社 配線基板
JP6932475B2 (ja) * 2015-03-26 2021-09-08 住友ベークライト株式会社 有機樹脂基板の製造方法、有機樹脂基板および半導体装置
JP6779087B2 (ja) * 2016-10-05 2020-11-04 株式会社ディスコ 配線基板の製造方法
JP6779088B2 (ja) * 2016-10-05 2020-11-04 株式会社ディスコ 配線基板の製造方法
JP6783614B2 (ja) * 2016-10-11 2020-11-11 株式会社ディスコ 配線基板の製造方法
JP2019204974A (ja) * 2019-08-21 2019-11-28 住友ベークライト株式会社 有機樹脂基板の製造方法、有機樹脂基板および半導体装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2777020B2 (ja) * 1992-07-29 1998-07-16 沖電気工業株式会社 配線層の平坦化方法
JP3361556B2 (ja) * 1992-09-25 2003-01-07 日本メクトロン株式会社 回路配線パタ−ンの形成法
JPH06112199A (ja) * 1992-09-30 1994-04-22 Hitachi Ltd 配線基板の製造方法
JPH06260772A (ja) * 1993-03-03 1994-09-16 Hitachi Ltd 機械研磨傷の低減方法
JPH1098268A (ja) * 1996-09-24 1998-04-14 Oki Electric Ind Co Ltd 柱状導体のめっき方法及びそれにより得られる多層プリント配線板
JPH11238970A (ja) * 1998-02-19 1999-08-31 Mitsubishi Electric Corp 多層プリント基板および多層プリント基板の製造方法
JPH11298141A (ja) * 1998-04-08 1999-10-29 Hitachi Ltd 電子装置の製造方法
JP4057146B2 (ja) * 1998-06-05 2008-03-05 沖電気工業株式会社 電子部品一体型多層基板の製造方法
JP3137186B2 (ja) * 1999-02-05 2001-02-19 インターナショナル・ビジネス・マシーンズ・コーポレ−ション 層間接続構造体、多層配線基板およびそれらの形成方法
JP3760857B2 (ja) * 2001-12-17 2006-03-29 松下電器産業株式会社 プリント配線板の製造方法

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