JP4510745B2 - セラミックス基材と電力供給用コネクタの接合構造 - Google Patents
セラミックス基材と電力供給用コネクタの接合構造 Download PDFInfo
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- JP4510745B2 JP4510745B2 JP2005314603A JP2005314603A JP4510745B2 JP 4510745 B2 JP4510745 B2 JP 4510745B2 JP 2005314603 A JP2005314603 A JP 2005314603A JP 2005314603 A JP2005314603 A JP 2005314603A JP 4510745 B2 JP4510745 B2 JP 4510745B2
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- Japan
- Prior art keywords
- stress relaxation
- insert member
- power supply
- protrusion
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Products (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Connection Of Plates (AREA)
Description
始めに、図1を参照して本発明の実施形態となる高周波発生用電極装置の構成について説明する。
次に、図3を参照して上記高周波発生用電極装置1の製造方法について説明する。
2:セラミックス基材
3:RF電極
4:ザグリ穴
5:応力緩和用インサート部材
5a:突起部
6:ロウ材
7:雰囲気保護管
8:給電棒
Claims (5)
- 金属部材が埋設されているセラミックス基材と前記金属部材に電力を供給する電力供給用コネクタの接合構造であって、
前記金属部材の少なくとも一部が露出するように前記セラミックス基材に形成されたザグリ穴と、
前記ザグリ穴の小径部の形状と適合する形状の突起部を有し、当該突起部が小径部に挿入された状態でザグリ穴に配設された応力緩和用インサート部材と、
前記電力供給用コネクタと前記応力緩和用インサート部材を接合すると共に、前記ザグリ穴と応力緩和用インサート部材間の隙間をシールして、応力緩和用インサート部材全体を覆うロウ材と
を備えることを特徴とする接合構造。 - 請求項1に記載の接合構造であって、
前記応力緩和用インサート部材は、コバール又はパーマロイにより形成されていることを特徴とする接合構造。 - 請求項1又は請求項2に記載の接合構造であって、
前記ロウ材は、少なくとも金又はアルミニウムを含む金属により形成されていることを特徴とする接合構造。 - 請求項1乃至請求項3のうち、いずれか1項に記載の接合構造であって、
前記ロウ材と前記金属部材の間にはTi,Zr,Hfからなる群から選ばれる少なくとも一つの金属材料により形成された活性金属箔が配設されていることを特徴とする接合構造。 - 請求項1乃至請求項4のうち、いずれか1項に記載の接合構造であって、
前記応力緩和用インサート部材の前記突起部が形成されている平面の水平方向長さをa、突起部の水平方向長さをb、突起部の高さをcとすると、b/aの値は0.3〜0.8の範囲内、且つ、c/bの値は0.05〜2.0の範囲内にあり、突起部と前記ザグリ穴の側面クリアランスは片側0.2mm以内であることを特徴とする接合構造。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005314603A JP4510745B2 (ja) | 2005-10-28 | 2005-10-28 | セラミックス基材と電力供給用コネクタの接合構造 |
TW095138999A TWI308373B (en) | 2005-10-28 | 2006-10-23 | Joining structure between ceramic substrate and power supply connector |
KR1020060104520A KR100775884B1 (ko) | 2005-10-28 | 2006-10-26 | 세라믹스 기재와 전력 공급용 커넥터의 접합 구조 |
US11/553,216 US7407391B2 (en) | 2005-10-28 | 2006-10-26 | Joining structure between ceramic substrate and power supply connector |
EP06255533A EP1780787B1 (en) | 2005-10-28 | 2006-10-27 | Joining structure between ceramic substrate and power supply connector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005314603A JP4510745B2 (ja) | 2005-10-28 | 2005-10-28 | セラミックス基材と電力供給用コネクタの接合構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007123601A JP2007123601A (ja) | 2007-05-17 |
JP4510745B2 true JP4510745B2 (ja) | 2010-07-28 |
Family
ID=37491701
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005314603A Active JP4510745B2 (ja) | 2005-10-28 | 2005-10-28 | セラミックス基材と電力供給用コネクタの接合構造 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7407391B2 (ja) |
EP (1) | EP1780787B1 (ja) |
JP (1) | JP4510745B2 (ja) |
KR (1) | KR100775884B1 (ja) |
TW (1) | TWI308373B (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4858319B2 (ja) * | 2007-06-07 | 2012-01-18 | 住友電気工業株式会社 | ウェハ保持体の電極接続構造 |
JP5174582B2 (ja) * | 2007-08-30 | 2013-04-03 | 日本碍子株式会社 | 接合構造体 |
KR100995250B1 (ko) * | 2008-09-09 | 2010-11-18 | 주식회사 코미코 | 열 응력 감소를 위한 버퍼층을 포함하는 정전 척 |
JP5214414B2 (ja) * | 2008-11-21 | 2013-06-19 | 日本特殊陶業株式会社 | 半導体製造装置用接続部及び半導体製造装置用接続部の形成方法 |
JP5642722B2 (ja) * | 2012-02-06 | 2014-12-17 | 日本特殊陶業株式会社 | 半導体製造装置用接続部及び半導体製造装置用接続部の形成方法 |
JP6234076B2 (ja) * | 2013-06-17 | 2017-11-22 | 株式会社Maruwa | 接合構造体及びこれを用いた半導体製造装置 |
JP6228031B2 (ja) * | 2014-02-25 | 2017-11-08 | 京セラ株式会社 | 試料保持具およびこれを用いたプラズマエッチング装置 |
US10186437B2 (en) * | 2015-10-05 | 2019-01-22 | Lam Research Corporation | Substrate holder having integrated temperature measurement electrical devices |
JP6591911B2 (ja) * | 2016-02-25 | 2019-10-16 | 京セラ株式会社 | 半導体製造装置用部品 |
US11532497B2 (en) * | 2016-06-07 | 2022-12-20 | Applied Materials, Inc. | High power electrostatic chuck design with radio frequency coupling |
KR102619089B1 (ko) | 2022-10-31 | 2023-12-29 | 주식회사 미코세라믹스 | 세라믹 서셉터 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09172055A (ja) * | 1995-12-19 | 1997-06-30 | Fujitsu Ltd | 静電チャック及びウエハの吸着方法 |
JPH1174336A (ja) * | 1997-08-29 | 1999-03-16 | Kyocera Corp | ウエハ支持部材 |
JP2004253786A (ja) * | 2003-01-29 | 2004-09-09 | Ngk Insulators Ltd | セラミックスの接合構造 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3813654B2 (ja) * | 1995-02-09 | 2006-08-23 | 日本碍子株式会社 | セラミックスの接合構造およびその製造方法 |
JP3681824B2 (ja) | 1995-07-14 | 2005-08-10 | 日本碍子株式会社 | セラミックスの接合体およびセラミックスの接合方法 |
DE69619898T2 (de) | 1995-07-14 | 2002-11-07 | Ngk Insulators Ltd | Verfahren zum Verbinden von Keramik |
JP3790000B2 (ja) | 1997-01-27 | 2006-06-28 | 日本碍子株式会社 | セラミックス部材と電力供給用コネクターとの接合構造 |
JP3746594B2 (ja) | 1997-06-20 | 2006-02-15 | 日本碍子株式会社 | セラミックスの接合構造およびその製造方法 |
JP4005268B2 (ja) * | 1999-06-01 | 2007-11-07 | 日本碍子株式会社 | セラミックスと金属との接合構造およびこれに使用する中間挿入材 |
JP4548928B2 (ja) | 2000-10-31 | 2010-09-22 | 京セラ株式会社 | 電極内蔵体及びこれを用いたウエハ支持部材 |
JP3949459B2 (ja) * | 2002-01-25 | 2007-07-25 | 日本碍子株式会社 | 異種材料の接合体及びその製造方法 |
-
2005
- 2005-10-28 JP JP2005314603A patent/JP4510745B2/ja active Active
-
2006
- 2006-10-23 TW TW095138999A patent/TWI308373B/zh active
- 2006-10-26 US US11/553,216 patent/US7407391B2/en active Active
- 2006-10-26 KR KR1020060104520A patent/KR100775884B1/ko active IP Right Grant
- 2006-10-27 EP EP06255533A patent/EP1780787B1/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09172055A (ja) * | 1995-12-19 | 1997-06-30 | Fujitsu Ltd | 静電チャック及びウエハの吸着方法 |
JPH1174336A (ja) * | 1997-08-29 | 1999-03-16 | Kyocera Corp | ウエハ支持部材 |
JP2004253786A (ja) * | 2003-01-29 | 2004-09-09 | Ngk Insulators Ltd | セラミックスの接合構造 |
Also Published As
Publication number | Publication date |
---|---|
KR100775884B1 (ko) | 2007-11-15 |
EP1780787A3 (en) | 2009-10-07 |
TW200805555A (en) | 2008-01-16 |
JP2007123601A (ja) | 2007-05-17 |
US20070097603A1 (en) | 2007-05-03 |
US7407391B2 (en) | 2008-08-05 |
EP1780787A2 (en) | 2007-05-02 |
TWI308373B (en) | 2009-04-01 |
EP1780787B1 (en) | 2013-01-16 |
KR20070045961A (ko) | 2007-05-02 |
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