JP4509174B2 - レーザ加工装置およびレーザ加工制御装置 - Google Patents

レーザ加工装置およびレーザ加工制御装置 Download PDF

Info

Publication number
JP4509174B2
JP4509174B2 JP2007338005A JP2007338005A JP4509174B2 JP 4509174 B2 JP4509174 B2 JP 4509174B2 JP 2007338005 A JP2007338005 A JP 2007338005A JP 2007338005 A JP2007338005 A JP 2007338005A JP 4509174 B2 JP4509174 B2 JP 4509174B2
Authority
JP
Japan
Prior art keywords
laser beam
laser
residual vibration
irradiation position
irradiation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2007338005A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009154198A (ja
Inventor
正史 成瀬
俊之 鉾館
繁朗 川野
悌史 ▲高▼橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2007338005A priority Critical patent/JP4509174B2/ja
Priority to KR1020080127252A priority patent/KR101066304B1/ko
Priority to TW097148881A priority patent/TWI364338B/zh
Priority to CN2008101894735A priority patent/CN101468424B/zh
Publication of JP2009154198A publication Critical patent/JP2009154198A/ja
Application granted granted Critical
Publication of JP4509174B2 publication Critical patent/JP4509174B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B15/00—Systems controlled by a computer
    • G05B15/02—Systems controlled by a computer electric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Laser Beam Processing (AREA)
JP2007338005A 2007-12-27 2007-12-27 レーザ加工装置およびレーザ加工制御装置 Active JP4509174B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007338005A JP4509174B2 (ja) 2007-12-27 2007-12-27 レーザ加工装置およびレーザ加工制御装置
KR1020080127252A KR101066304B1 (ko) 2007-12-27 2008-12-15 레이저 가공 장치 및 레이저 가공 제어 장치
TW097148881A TWI364338B (en) 2007-12-27 2008-12-16 Laser processing apparatus and control device for laser processing
CN2008101894735A CN101468424B (zh) 2007-12-27 2008-12-29 激光加工装置及激光加工控制装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007338005A JP4509174B2 (ja) 2007-12-27 2007-12-27 レーザ加工装置およびレーザ加工制御装置

Publications (2)

Publication Number Publication Date
JP2009154198A JP2009154198A (ja) 2009-07-16
JP4509174B2 true JP4509174B2 (ja) 2010-07-21

Family

ID=40826365

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007338005A Active JP4509174B2 (ja) 2007-12-27 2007-12-27 レーザ加工装置およびレーザ加工制御装置

Country Status (4)

Country Link
JP (1) JP4509174B2 (zh)
KR (1) KR101066304B1 (zh)
CN (1) CN101468424B (zh)
TW (1) TWI364338B (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5637526B2 (ja) 2010-04-28 2014-12-10 株式会社ブイ・テクノロジー レーザ加工装置
CN102510788B (zh) * 2010-06-14 2014-12-24 三菱电机株式会社 激光加工装置以及激光加工方法
TWI406732B (zh) * 2011-06-09 2013-09-01 Univ Nat Yunlin Sci & Tech Magnetic field assisted laser plasma device
CN102806421B (zh) * 2012-08-22 2014-12-03 温州泛波激光有限公司 光点补偿控制系统及其激光切割设备
KR101392986B1 (ko) * 2012-08-29 2014-05-12 레이저앤피직스 주식회사 스캐너 제어 장치 및 방법
KR101392982B1 (ko) * 2012-08-29 2014-05-12 레이저앤피직스 주식회사 스캐너 제어 장치 및 방법
KR101511483B1 (ko) * 2013-01-04 2015-04-10 미쓰비시덴키 가부시키가이샤 가공 제어 장치, 레이저 가공 장치 및 가공 제어 방법
KR20160100663A (ko) 2015-02-16 2016-08-24 엄태성 활성탄 숯 타일제조방법
JP6415357B2 (ja) * 2015-03-06 2018-10-31 住友重機械工業株式会社 レーザ加工装置
JP6781209B2 (ja) * 2018-08-03 2020-11-04 ファナック株式会社 レーザ加工装置の制御装置及びレーザ加工装置
JP6833153B1 (ja) * 2020-06-24 2021-02-24 三菱電機株式会社 面倒れ量検出装置、制御装置およびレーザ加工装置
CN112630983A (zh) * 2020-12-24 2021-04-09 中国工程物理研究院激光聚变研究中心 一种激光系统、激光诱导损伤测试系统及方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6445756U (zh) * 1987-09-10 1989-03-20
JPH11145581A (ja) * 1997-11-10 1999-05-28 Hitachi Seiko Ltd プリント基板の穴明け方法および装置
JP2000117475A (ja) * 1998-10-09 2000-04-25 Matsushita Electric Ind Co Ltd レーザ加工方法
JP2002006255A (ja) * 2000-06-23 2002-01-09 Hitachi Via Mechanics Ltd スキャナおよびレーザ加工機
JP2002239772A (ja) * 2001-02-16 2002-08-28 Matsushita Electric Ind Co Ltd レーザ加工方法およびその装置
JP2002296533A (ja) * 2001-03-29 2002-10-09 Mitsubishi Electric Corp 光学偏向装置およびこれを用いたレーザ加工装置
JP2005055610A (ja) * 2003-08-01 2005-03-03 Hitachi Via Mechanics Ltd スキャナ装置およびレーザ加工機

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6469729B1 (en) * 1999-10-15 2002-10-22 Videojet Technologies Inc. Laser marking device and method for marking arcuate surfaces
JP3774138B2 (ja) * 2000-11-13 2006-05-10 住友重機械工業株式会社 加工計画方法、装置、及び、加工方法、装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6445756U (zh) * 1987-09-10 1989-03-20
JPH11145581A (ja) * 1997-11-10 1999-05-28 Hitachi Seiko Ltd プリント基板の穴明け方法および装置
JP2000117475A (ja) * 1998-10-09 2000-04-25 Matsushita Electric Ind Co Ltd レーザ加工方法
JP2002006255A (ja) * 2000-06-23 2002-01-09 Hitachi Via Mechanics Ltd スキャナおよびレーザ加工機
JP2002239772A (ja) * 2001-02-16 2002-08-28 Matsushita Electric Ind Co Ltd レーザ加工方法およびその装置
JP2002296533A (ja) * 2001-03-29 2002-10-09 Mitsubishi Electric Corp 光学偏向装置およびこれを用いたレーザ加工装置
JP2005055610A (ja) * 2003-08-01 2005-03-03 Hitachi Via Mechanics Ltd スキャナ装置およびレーザ加工機

Also Published As

Publication number Publication date
TWI364338B (en) 2012-05-21
CN101468424B (zh) 2012-06-06
KR20090071390A (ko) 2009-07-01
CN101468424A (zh) 2009-07-01
KR101066304B1 (ko) 2011-09-20
TW200936285A (en) 2009-09-01
JP2009154198A (ja) 2009-07-16

Similar Documents

Publication Publication Date Title
JP4509174B2 (ja) レーザ加工装置およびレーザ加工制御装置
JP6325646B1 (ja) ロボットを用いてレーザ加工を行うレーザ加工ロボットシステム及びレーザ加工ロボットの制御方法
JP5570459B2 (ja) レーザ加工装置およびレーザ加工方法
WO2012140797A1 (ja) レーザ加工装置及びレーザ加工システム
JP2018176245A (ja) 測定機能を有するレーザ加工システム
JP2008194729A (ja) 小型デバイスの製造方法、レーザ加工方法及びレーザ加工装置
JP2018024011A (ja) レーザ加工ロボットシステム及びレーザ加工方法
JP5223321B2 (ja) レーザレーダ装置
WO2013183435A1 (ja) ガルバノスキャナおよびレーザ加工機
JP2010125510A (ja) レーザ加工装置
JP4533640B2 (ja) ガルバノスキャナの制御方法およびガルバノスキャナ
JP2003053561A (ja) レーザ加工装置
JP6587603B2 (ja) ガルバノスキャナ及びレーザ加工装置
JP2004020956A (ja) ビームスキャナ
JP2005103614A (ja) レーザマーキング装置及びレーザマーキング装置のワークディスタンス調整方法
JP2004177502A (ja) レーザ走査装置
JP2007273539A (ja) レーザ照射装置
JP2004074166A (ja) 光学スキャナおよびレーザ加工装置
JP5714196B1 (ja) ガルバノスキャナおよびレーザ加工装置
JP2002090682A (ja) ガルバノメータ、ガルバノメータの位置補正方法、ガルバノメータを用いたレーザ加工装置、及びガルバノメータを用いたレーザ加工方法
US10870172B2 (en) Laser processing head and laser processing system including the same
JP2005313204A (ja) レーザ孔形成装置、レーザ加工装置及びレーザ孔形成方法
JP2023050541A (ja) レーザ加工装置
TWI796692B (zh) 面歪斜量檢測裝置、控制裝置及雷射加工裝置
JP2004004276A (ja) ２次元光走査装置

Legal Events

Date Code Title Description
A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20091109

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20091117

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100115

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20100330

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20100427

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130514

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 4509174

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140514

Year of fee payment: 4

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250