KR101066304B1 - 레이저 가공 장치 및 레이저 가공 제어 장치 - Google Patents

레이저 가공 장치 및 레이저 가공 제어 장치 Download PDF

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Publication number
KR101066304B1
KR101066304B1 KR1020080127252A KR20080127252A KR101066304B1 KR 101066304 B1 KR101066304 B1 KR 101066304B1 KR 1020080127252 A KR1020080127252 A KR 1020080127252A KR 20080127252 A KR20080127252 A KR 20080127252A KR 101066304 B1 KR101066304 B1 KR 101066304B1
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KR
South Korea
Prior art keywords
laser light
laser
irradiation position
residual vibration
irradiation
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Application number
KR1020080127252A
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English (en)
Korean (ko)
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KR20090071390A (ko
Inventor
마사시 나루세
도시유키 호코다테
시게오 가와노
데이지 다카하시
Original Assignee
미쓰비시덴키 가부시키가이샤
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Publication of KR20090071390A publication Critical patent/KR20090071390A/ko
Application granted granted Critical
Publication of KR101066304B1 publication Critical patent/KR101066304B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B15/00—Systems controlled by a computer
    • G05B15/02—Systems controlled by a computer electric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Laser Beam Processing (AREA)
KR1020080127252A 2007-12-27 2008-12-15 레이저 가공 장치 및 레이저 가공 제어 장치 KR101066304B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007338005A JP4509174B2 (ja) 2007-12-27 2007-12-27 レーザ加工装置およびレーザ加工制御装置
JPJP-P-2007-338005 2007-12-27

Publications (2)

Publication Number Publication Date
KR20090071390A KR20090071390A (ko) 2009-07-01
KR101066304B1 true KR101066304B1 (ko) 2011-09-20

Family

ID=40826365

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080127252A KR101066304B1 (ko) 2007-12-27 2008-12-15 레이저 가공 장치 및 레이저 가공 제어 장치

Country Status (4)

Country Link
JP (1) JP4509174B2 (zh)
KR (1) KR101066304B1 (zh)
CN (1) CN101468424B (zh)
TW (1) TWI364338B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160100663A (ko) 2015-02-16 2016-08-24 엄태성 활성탄 숯 타일제조방법

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5637526B2 (ja) 2010-04-28 2014-12-10 株式会社ブイ・テクノロジー レーザ加工装置
CN102510788B (zh) * 2010-06-14 2014-12-24 三菱电机株式会社 激光加工装置以及激光加工方法
TWI406732B (zh) * 2011-06-09 2013-09-01 Univ Nat Yunlin Sci & Tech Magnetic field assisted laser plasma device
CN102806421B (zh) * 2012-08-22 2014-12-03 温州泛波激光有限公司 光点补偿控制系统及其激光切割设备
KR101392986B1 (ko) * 2012-08-29 2014-05-12 레이저앤피직스 주식회사 스캐너 제어 장치 및 방법
KR101392982B1 (ko) * 2012-08-29 2014-05-12 레이저앤피직스 주식회사 스캐너 제어 장치 및 방법
CN104203482B (zh) * 2013-01-04 2015-07-22 三菱电机株式会社 加工控制装置、激光加工装置以及加工控制方法
JP6415357B2 (ja) * 2015-03-06 2018-10-31 住友重機械工業株式会社 レーザ加工装置
JP6781209B2 (ja) * 2018-08-03 2020-11-04 ファナック株式会社 レーザ加工装置の制御装置及びレーザ加工装置
JP6833153B1 (ja) * 2020-06-24 2021-02-24 三菱電機株式会社 面倒れ量検出装置、制御装置およびレーザ加工装置
CN112630983A (zh) * 2020-12-24 2021-04-09 中国工程物理研究院激光聚变研究中心 一种激光系统、激光诱导损伤测试系统及方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000117475A (ja) 1998-10-09 2000-04-25 Matsushita Electric Ind Co Ltd レーザ加工方法
JP2002239772A (ja) 2001-02-16 2002-08-28 Matsushita Electric Ind Co Ltd レーザ加工方法およびその装置
JP2002296533A (ja) 2001-03-29 2002-10-09 Mitsubishi Electric Corp 光学偏向装置およびこれを用いたレーザ加工装置
JP2005055610A (ja) 2003-08-01 2005-03-03 Hitachi Via Mechanics Ltd スキャナ装置およびレーザ加工機

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6445756U (zh) * 1987-09-10 1989-03-20
JPH11145581A (ja) * 1997-11-10 1999-05-28 Hitachi Seiko Ltd プリント基板の穴明け方法および装置
US6469729B1 (en) * 1999-10-15 2002-10-22 Videojet Technologies Inc. Laser marking device and method for marking arcuate surfaces
JP2002006255A (ja) * 2000-06-23 2002-01-09 Hitachi Via Mechanics Ltd スキャナおよびレーザ加工機
JP3774138B2 (ja) * 2000-11-13 2006-05-10 住友重機械工業株式会社 加工計画方法、装置、及び、加工方法、装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000117475A (ja) 1998-10-09 2000-04-25 Matsushita Electric Ind Co Ltd レーザ加工方法
JP2002239772A (ja) 2001-02-16 2002-08-28 Matsushita Electric Ind Co Ltd レーザ加工方法およびその装置
JP2002296533A (ja) 2001-03-29 2002-10-09 Mitsubishi Electric Corp 光学偏向装置およびこれを用いたレーザ加工装置
JP2005055610A (ja) 2003-08-01 2005-03-03 Hitachi Via Mechanics Ltd スキャナ装置およびレーザ加工機

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160100663A (ko) 2015-02-16 2016-08-24 엄태성 활성탄 숯 타일제조방법

Also Published As

Publication number Publication date
CN101468424A (zh) 2009-07-01
JP4509174B2 (ja) 2010-07-21
TWI364338B (en) 2012-05-21
TW200936285A (en) 2009-09-01
CN101468424B (zh) 2012-06-06
JP2009154198A (ja) 2009-07-16
KR20090071390A (ko) 2009-07-01

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