JP4508412B2 - 処理チャンバ - Google Patents

処理チャンバ Download PDF

Info

Publication number
JP4508412B2
JP4508412B2 JP2000502240A JP2000502240A JP4508412B2 JP 4508412 B2 JP4508412 B2 JP 4508412B2 JP 2000502240 A JP2000502240 A JP 2000502240A JP 2000502240 A JP2000502240 A JP 2000502240A JP 4508412 B2 JP4508412 B2 JP 4508412B2
Authority
JP
Japan
Prior art keywords
door panel
processing chamber
door
inner door
port
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2000502240A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001509640A (ja
JP2001509640A5 (enExample
Inventor
アレックス グランツ
Original Assignee
ブルックス オートメーション インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ブルックス オートメーション インコーポレイテッド filed Critical ブルックス オートメーション インコーポレイテッド
Publication of JP2001509640A publication Critical patent/JP2001509640A/ja
Publication of JP2001509640A5 publication Critical patent/JP2001509640A5/ja
Application granted granted Critical
Publication of JP4508412B2 publication Critical patent/JP4508412B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
  • Warehouses Or Storage Devices (AREA)
JP2000502240A 1997-07-11 1998-05-28 処理チャンバ Expired - Lifetime JP4508412B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/891,550 1997-07-11
US08/891,550 US5837059A (en) 1997-07-11 1997-07-11 Automatic positive pressure seal access door
PCT/US1998/010879 WO1999002751A1 (en) 1997-07-11 1998-05-28 Automatic positive pressure seal access door

Publications (3)

Publication Number Publication Date
JP2001509640A JP2001509640A (ja) 2001-07-24
JP2001509640A5 JP2001509640A5 (enExample) 2009-08-06
JP4508412B2 true JP4508412B2 (ja) 2010-07-21

Family

ID=25398394

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000502240A Expired - Lifetime JP4508412B2 (ja) 1997-07-11 1998-05-28 処理チャンバ

Country Status (7)

Country Link
US (1) US5837059A (enExample)
EP (1) EP1021587A1 (enExample)
JP (1) JP4508412B2 (enExample)
KR (1) KR100626275B1 (enExample)
AU (1) AU7700898A (enExample)
TW (1) TW371673B (enExample)
WO (1) WO1999002751A1 (enExample)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE59805566D1 (de) * 1997-04-11 2002-10-24 Leybold Systems Gmbh Verfahren und Vorrichtung zum Be- und Entladen einer evakuierbaren Behandlungskammer
US20020051699A1 (en) * 1997-05-05 2002-05-02 Gordon Nelson Door system for a process chamber
US6315512B1 (en) * 1997-11-28 2001-11-13 Mattson Technology, Inc. Systems and methods for robotic transfer of workpieces between a storage area and a processing chamber
US6106213A (en) * 1998-02-27 2000-08-22 Pri Automation, Inc. Automated door assembly for use in semiconductor wafer manufacturing
US6322312B1 (en) 1999-03-18 2001-11-27 Applied Materials, Inc. Mechanical gripper for wafer handling robots
JP2001118904A (ja) * 1999-10-19 2001-04-27 Canon Inc ロードロック室を備えた基板処理装置および被処理基板の搬送方法
US6379095B1 (en) * 2000-04-14 2002-04-30 Applied Materials, Inc. Robot for handling semiconductor wafers
US6582175B2 (en) 2000-04-14 2003-06-24 Applied Materials, Inc. Robot for handling semiconductor wafers
US6698439B2 (en) * 2000-07-03 2004-03-02 Tokyo Electron Limited Processing apparatus with sealing mechanism
US7000623B2 (en) * 2001-05-18 2006-02-21 Lam Research Corporation Apparatus and method for substrate preparation implementing a surface tension reducing process
JP2003031639A (ja) * 2001-07-17 2003-01-31 Canon Inc 基板処理装置、基板の搬送方法及び露光装置
JP2003045947A (ja) * 2001-07-27 2003-02-14 Canon Inc 基板処理装置及び露光装置
US6776848B2 (en) 2002-01-17 2004-08-17 Applied Materials, Inc. Motorized chamber lid
JP2005101584A (ja) * 2003-08-28 2005-04-14 Suss Microtec Test Systems Gmbh 基板を検査する装置
US7632078B2 (en) * 2003-10-30 2009-12-15 Deka Products Limited Partnership Pump cassette bank
KR20070048649A (ko) * 2004-09-04 2007-05-09 어플라이드 머티어리얼스, 인코포레이티드 높이가 감소된 기판 캐리어
TW200725784A (en) * 2005-11-21 2007-07-01 Applied Materials Inc Apparatus and methods for a substrate carrier having an inflatable seal
US20070141280A1 (en) * 2005-12-16 2007-06-21 Applied Materials, Inc. Substrate carrier having an interior lining
KR100841942B1 (ko) * 2007-06-05 2008-06-27 주식회사 케이피씨 기판 처리장치의 슬라이딩 도어
ES2752207T3 (es) * 2015-08-07 2020-04-03 Indag Pouch Partners Gmbh Máquina para el llenado aséptico de líquidos, procedimiento para abrir y procedimiento para cerrar una ventana de apertura en una máquina para el llenado aséptico de líquidos
CN107345293B (zh) * 2016-05-06 2019-07-05 北京北方华创微电子装备有限公司 反应腔室及半导体加工设备
CN106555158B (zh) * 2016-11-15 2018-11-13 浦江和平真空镀膜有限公司 一种真空镀膜箱设备
DE102019134546B4 (de) 2019-12-16 2025-03-27 VON ARDENNE Asset GmbH & Co. KG Verfahren, Steuervorrichtung und Vakuumanordnung
JP6952920B1 (ja) * 2021-04-20 2021-10-27 株式会社ブイテックス デュアルゲートバルブ
US11933416B2 (en) * 2021-07-16 2024-03-19 Changxin Memory Technologies, Inc. Gate valve device, cleaning method and mechanical apparatus

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS546132A (en) * 1977-06-17 1979-01-18 Mitsubishi Heavy Ind Ltd Gate valve
JPS55139562A (en) * 1979-04-14 1980-10-31 Hitachi Ltd Valve device
US5013385A (en) * 1986-04-18 1991-05-07 General Signal Corporation Quad processor
JPS6323331A (ja) * 1986-10-21 1988-01-30 Tokyo Ohka Kogyo Co Ltd 蓋体の開閉機構
US5186594A (en) * 1990-04-19 1993-02-16 Applied Materials, Inc. Dual cassette load lock
EP0608620B1 (en) * 1993-01-28 1996-08-14 Applied Materials, Inc. Vacuum Processing apparatus having improved throughput
JP2761438B2 (ja) * 1993-04-16 1998-06-04 ブルックス オートメーション インコーポレイテッド 搬送装置
US5607276A (en) * 1995-07-06 1997-03-04 Brooks Automation, Inc. Batchloader for substrate carrier on load lock

Also Published As

Publication number Publication date
WO1999002751A1 (en) 1999-01-21
JP2001509640A (ja) 2001-07-24
US5837059A (en) 1998-11-17
KR20010021759A (ko) 2001-03-15
TW371673B (en) 1999-10-11
EP1021587A1 (en) 2000-07-26
KR100626275B1 (ko) 2006-09-20
AU7700898A (en) 1999-02-08

Similar Documents

Publication Publication Date Title
JP4508412B2 (ja) 処理チャンバ
TW486554B (en) Single shaft, dual blade vacuum slot valve and method for implementing the same
US6517048B2 (en) Isolation valves
CN1743254B (zh) 在微环境晶片传送盒和设备零件之间的真空接口
US5664925A (en) Batchloader for load lock
KR20010101757A (ko) 팽창성 슬릿/게이트 밸브
US7997851B2 (en) Apparatus and method for a multi-level load lock chamber, transfer chamber, and robot suitable for interfacing with same
US6340405B2 (en) Etching apparatus for manufacturing semiconductor devices
US4995430A (en) Sealable transportable container having improved latch mechanism
US5752796A (en) Vacuum integrated SMIF system
US6508259B1 (en) Inverted pressure vessel with horizontal through loading
US6048154A (en) High vacuum dual stage load lock and method for loading and unloading wafers using a high vacuum dual stage load lock
US5607276A (en) Batchloader for substrate carrier on load lock
US5609459A (en) Door drive mechanisms for substrate carrier and load lock
JPH10214871A (ja) ロードロック装置
JP2009540556A (ja) 基板を輸送し、貯蔵しかつ移送するための装置
JPS62181440A (ja) ウェーハ処理方法
JPH11150178A (ja) クリーンボックス、クリーン搬送方法及び装置
US20090320948A1 (en) Stacked load lock chamber and substrate processing apparatus including the same
JP4306798B2 (ja) 基板キャリアおよびロードロック用ドア駆動装置
JPH07283099A (ja) 半導体製造装置
WO2002005330A2 (en) Door assembly for sealing an opening of a chamber
JPH10298785A (ja) ゲートバルブ
US20020051699A1 (en) Door system for a process chamber
JPH05121519A (ja) 保管移動方法及びその装置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050512

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080401

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20080623

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20080630

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20081001

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20081209

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20090225

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20090304

A524 Written submission of copy of amendment under article 19 pct

Free format text: JAPANESE INTERMEDIATE CODE: A524

Effective date: 20090609

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090901

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20091124

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20091201

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100301

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20100330

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20100427

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130514

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term