JP4501567B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
- Publication number
- JP4501567B2 JP4501567B2 JP2004206634A JP2004206634A JP4501567B2 JP 4501567 B2 JP4501567 B2 JP 4501567B2 JP 2004206634 A JP2004206634 A JP 2004206634A JP 2004206634 A JP2004206634 A JP 2004206634A JP 4501567 B2 JP4501567 B2 JP 4501567B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- resin
- circuit board
- liquid resin
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/921—Connecting a surface with connectors of different types
- H01L2224/9212—Sequential connecting processes
- H01L2224/92122—Sequential connecting processes the first connecting process involving a bump connector
- H01L2224/92125—Sequential connecting processes the first connecting process involving a bump connector the second connecting process involving a layer connector
Landscapes
- Wire Bonding (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
従来のフリップチップ実装方式では、先ず、図4(a)で示す様に、半導体チップ101の電極102に、AuやCu等を主成分とし、一般的にバンプと称される突起状電極103(以下、バンプと称する。)を形成する。
また、バンプの形成とは別に、図4(b)で示す様に、半導体チップを実装する回路基板104の端子105に接合材料であるはんだ106を搭載する。
この時、実装ノズルからは、はんだの溶融温度以上の熱が半導体チップに供給され、回路基板に搭載されたはんだが溶融し、半導体チップの電極に形成されたバンプの表面をはんだが這い上がり、はんだがバンプを包み込む現象が生じる。また、はんだとバンプの間で相互拡散が起こり、回路基板の端子と半導体チップの電極の間の金属結合により電気的に接続される。
なお、一般的に液状樹脂はエポキシ系を主成分とし、吸湿し易い性質を持っているために、ボイドや液状樹脂の未充填が半導体チップと回路基板の間に存在した場合には、例えばマザーボードへの実装の際のリフロー時の熱により膨張し、半導体装置内に亀裂が生じ、その亀裂が起点となり拡大成長することによって故障に至るという信頼性上大きな問題となる恐れがある。
図1は本発明を適用した半導体装置の製造方法の一例を説明するための模式図であり、本発明を適用した半導体装置の製造方法であるフリップチップ実装方式では、上記した従来のフリップチップ実装方式と同様に、半導体チップ1の電極2に、AuやCu等を主成分とするバンプ3を形成すると共に、バンプの形成とは別に、半導体チップを実装する回路基板4の端子5に接合材料であるはんだ6を搭載する(図1(a)、図1(b)参照。)。なお、本実施例では、バンプを半導体チップの周囲のみならず半導体チップの内側部にも形成している。
次に、図1(c)で示す様に、バンプが形成された半導体チップを反転して実装ノズル7で吸着固定を行い、半導体チップに形成されたバンプと回路基板の端子とを高精度に位置あわせし、バンプと端子に搭載されたはんだとを接触させる。なお、この時に実装ノズルからはんだの溶融温度以上の熱を半導体チップに供給し、回路基板に搭載されたはんだを溶融して、半導体チップの電極に形成されたバンプの表面をはんだに這い上がらせ、はんだにバンプを包み込ませることによって回路基板の端子と半導体チップの電極の間の金属結合により回路基板の端子と半導体チップとを電気的に接続する点は従来と同様である。
2 電極
3 バンプ
4 回路基板
5 端子
6 はんだ
7 実装ノズル
8 樹脂塗布ノズル
9 液状樹脂
10 加熱ステージ
11 振動素子
Claims (1)
- 突起状電極が設けられた半導体チップを、前記突起状電極を介して回路基板に接合する工程と、
樹脂材料を吐出する樹脂塗布ノズルを有する塗布装置を用いて、前記樹脂塗布ノズルで描画塗布を行うために同樹脂塗布ノズルを移動せしめるモータによって前記樹脂塗布ノズルを振動させながら樹脂材料を描画塗布することで、前記半導体チップと前記回路基板との間隙に樹脂材料を充填する工程とを備える
半導体装置の製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004206634A JP4501567B2 (ja) | 2004-07-14 | 2004-07-14 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004206634A JP4501567B2 (ja) | 2004-07-14 | 2004-07-14 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006032505A JP2006032505A (ja) | 2006-02-02 |
JP4501567B2 true JP4501567B2 (ja) | 2010-07-14 |
Family
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JP2004206634A Expired - Fee Related JP4501567B2 (ja) | 2004-07-14 | 2004-07-14 | 半導体装置の製造方法 |
Country Status (1)
Country | Link |
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JP (1) | JP4501567B2 (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05152359A (ja) * | 1991-11-26 | 1993-06-18 | Hitachi Ltd | ポツテイング装置 |
JPH1176897A (ja) * | 1997-09-09 | 1999-03-23 | Fujitsu Ltd | 粘性流体供給装置 |
JP2000124242A (ja) * | 1998-01-23 | 2000-04-28 | Apic Yamada Corp | 半導体装置の樹脂封止方法、樹脂封止装置および半導体装置 |
-
2004
- 2004-07-14 JP JP2004206634A patent/JP4501567B2/ja not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05152359A (ja) * | 1991-11-26 | 1993-06-18 | Hitachi Ltd | ポツテイング装置 |
JPH1176897A (ja) * | 1997-09-09 | 1999-03-23 | Fujitsu Ltd | 粘性流体供給装置 |
JP2000124242A (ja) * | 1998-01-23 | 2000-04-28 | Apic Yamada Corp | 半導体装置の樹脂封止方法、樹脂封止装置および半導体装置 |
Also Published As
Publication number | Publication date |
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JP2006032505A (ja) | 2006-02-02 |
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