JP4500173B2 - 静電気除去方法および基板処理装置 - Google Patents

静電気除去方法および基板処理装置 Download PDF

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Publication number
JP4500173B2
JP4500173B2 JP2005024853A JP2005024853A JP4500173B2 JP 4500173 B2 JP4500173 B2 JP 4500173B2 JP 2005024853 A JP2005024853 A JP 2005024853A JP 2005024853 A JP2005024853 A JP 2005024853A JP 4500173 B2 JP4500173 B2 JP 4500173B2
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substrate
mounting table
ionized gas
processing apparatus
substrate mounting
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Expired - Fee Related
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JP2005024853A
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Japanese (ja)
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JP2006216583A5 (enExample
JP2006216583A (ja
Inventor
三奈 小林
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Olympus Corp
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Olympus Corp
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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2005024853A 2005-02-01 2005-02-01 静電気除去方法および基板処理装置 Expired - Fee Related JP4500173B2 (ja)

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JP2005024853A JP4500173B2 (ja) 2005-02-01 2005-02-01 静電気除去方法および基板処理装置

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JP2005024853A JP4500173B2 (ja) 2005-02-01 2005-02-01 静電気除去方法および基板処理装置

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JP2006216583A JP2006216583A (ja) 2006-08-17
JP2006216583A5 JP2006216583A5 (enExample) 2008-03-21
JP4500173B2 true JP4500173B2 (ja) 2010-07-14

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Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8681472B2 (en) * 2008-06-20 2014-03-25 Varian Semiconductor Equipment Associates, Inc. Platen ground pin for connecting substrate to ground
JP2010199239A (ja) * 2009-02-24 2010-09-09 Tokyo Electron Ltd 被処理基板の除電方法及び基板処理装置
JP6322508B2 (ja) * 2014-07-22 2018-05-09 株式会社アルバック 真空処理装置
KR102308904B1 (ko) * 2014-09-18 2021-10-06 삼성디스플레이 주식회사 제전 장치 및 이를 이용한 기판 커팅 방법
CN104409389B (zh) * 2014-11-07 2017-10-27 合肥京东方光电科技有限公司 一种机台
JP6077023B2 (ja) * 2015-01-09 2017-02-08 株式会社伸興 静電気除去装置及び静電気除去方法
KR101730864B1 (ko) * 2015-10-13 2017-05-02 주식회사 야스 대전 처리에 의한 기판 척킹 방법 및 시스템
KR101895128B1 (ko) * 2016-12-19 2018-09-04 주식회사 야스 바이폴라 대전 처리에 의한 기판 척킹 방법 및 시스템
CN113035682B (zh) * 2019-12-25 2023-03-31 中微半导体设备(上海)股份有限公司 一种下电极组件及其等离子体处理装置
JP2025515702A (ja) * 2022-05-20 2025-05-20 ネクスティン，インク． 半導体工程システムの静電気調節装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3153372B2 (ja) * 1992-02-26 2001-04-09 東京エレクトロン株式会社 基板処理装置
JP2828027B2 (ja) * 1996-04-25 1998-11-25 日本電気株式会社 基板処理装置
JP2991110B2 (ja) * 1996-05-01 1999-12-20 日本電気株式会社 基板吸着保持装置

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