JP2006216583A5 - - Google Patents

Download PDF

Info

Publication number
JP2006216583A5
JP2006216583A5 JP2005024853A JP2005024853A JP2006216583A5 JP 2006216583 A5 JP2006216583 A5 JP 2006216583A5 JP 2005024853 A JP2005024853 A JP 2005024853A JP 2005024853 A JP2005024853 A JP 2005024853A JP 2006216583 A5 JP2006216583 A5 JP 2006216583A5
Authority
JP
Japan
Prior art keywords
substrate
mounting table
ionized gas
elevating
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005024853A
Other languages
English (en)
Japanese (ja)
Other versions
JP4500173B2 (ja
JP2006216583A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005024853A priority Critical patent/JP4500173B2/ja
Priority claimed from JP2005024853A external-priority patent/JP4500173B2/ja
Publication of JP2006216583A publication Critical patent/JP2006216583A/ja
Publication of JP2006216583A5 publication Critical patent/JP2006216583A5/ja
Application granted granted Critical
Publication of JP4500173B2 publication Critical patent/JP4500173B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2005024853A 2005-02-01 2005-02-01 静電気除去方法および基板処理装置 Expired - Fee Related JP4500173B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005024853A JP4500173B2 (ja) 2005-02-01 2005-02-01 静電気除去方法および基板処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005024853A JP4500173B2 (ja) 2005-02-01 2005-02-01 静電気除去方法および基板処理装置

Publications (3)

Publication Number Publication Date
JP2006216583A JP2006216583A (ja) 2006-08-17
JP2006216583A5 true JP2006216583A5 (enExample) 2008-03-21
JP4500173B2 JP4500173B2 (ja) 2010-07-14

Family

ID=36979568

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005024853A Expired - Fee Related JP4500173B2 (ja) 2005-02-01 2005-02-01 静電気除去方法および基板処理装置

Country Status (1)

Country Link
JP (1) JP4500173B2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8681472B2 (en) * 2008-06-20 2014-03-25 Varian Semiconductor Equipment Associates, Inc. Platen ground pin for connecting substrate to ground
JP2010199239A (ja) * 2009-02-24 2010-09-09 Tokyo Electron Ltd 被処理基板の除電方法及び基板処理装置
JP6322508B2 (ja) * 2014-07-22 2018-05-09 株式会社アルバック 真空処理装置
KR102308904B1 (ko) * 2014-09-18 2021-10-06 삼성디스플레이 주식회사 제전 장치 및 이를 이용한 기판 커팅 방법
CN104409389B (zh) * 2014-11-07 2017-10-27 合肥京东方光电科技有限公司 一种机台
JP6077023B2 (ja) * 2015-01-09 2017-02-08 株式会社伸興 静電気除去装置及び静電気除去方法
KR101730864B1 (ko) * 2015-10-13 2017-05-02 주식회사 야스 대전 처리에 의한 기판 척킹 방법 및 시스템
KR101895128B1 (ko) * 2016-12-19 2018-09-04 주식회사 야스 바이폴라 대전 처리에 의한 기판 척킹 방법 및 시스템
CN113035682B (zh) * 2019-12-25 2023-03-31 中微半导体设备(上海)股份有限公司 一种下电极组件及其等离子体处理装置
JP2025515702A (ja) * 2022-05-20 2025-05-20 ネクスティン，インク． 半導体工程システムの静電気調節装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3153372B2 (ja) * 1992-02-26 2001-04-09 東京エレクトロン株式会社 基板処理装置
JP2828027B2 (ja) * 1996-04-25 1998-11-25 日本電気株式会社 基板処理装置
JP2991110B2 (ja) * 1996-05-01 1999-12-20 日本電気株式会社 基板吸着保持装置

Similar Documents

Publication Publication Date Title
TWI404574B (zh) 基板載置平台及基板的吸附‧剝離方法
JP2006216583A5 (enExample)
JP2010153680A5 (enExample)
TWI466225B (zh) Suspended air float working platform
JP2009532245A5 (enExample)
TW200625503A (en) Non-contact suction holding apparatus
TW200636847A (en) Substrate processing method, substrate processing apparatus and controlling program
JPWO2009119377A1 (ja) 非接触搬送装置
EP2019576A3 (en) Apparatus and method of mounting conductive ball
CN105529283B (zh) 晶圆的双面气相刻蚀装置
TW200943468A (en) Plasma processing device
CN107180778A (zh) 一种用于微孔加工的晶圆夹具
JP2009064950A (ja) 基板保持装置および基板リリース方法
KR20180002421A (ko) 레이저 가공용 워크 테이블 및 이를 이용한 레이저 가공 장치
TW200632995A (en) Single wafer dryer and drying methods
JP4500173B2 (ja) 静電気除去方法および基板処理装置
EP1873275A3 (en) Showerhead for a gas supply apparatus
JP6718581B2 (ja) 吸着保持装置
JP4889444B2 (ja) 洗浄方法、液処理装置およびコンピュータ読取可能な記憶媒体
JP2000277509A5 (enExample)
JP2007208054A (ja) 静電気除去装置及び静電気除去方法
JP2010267746A5 (enExample)
CN109262992A (zh) 透气镶件加工方法及透气镶件
JP2009206523A5 (enExample)
JPH1133997A (ja) パンチ型