JP4487712B2 - 発光ダイオードの製造方法 - Google Patents

発光ダイオードの製造方法 Download PDF

Info

Publication number
JP4487712B2
JP4487712B2 JP2004283262A JP2004283262A JP4487712B2 JP 4487712 B2 JP4487712 B2 JP 4487712B2 JP 2004283262 A JP2004283262 A JP 2004283262A JP 2004283262 A JP2004283262 A JP 2004283262A JP 4487712 B2 JP4487712 B2 JP 4487712B2
Authority
JP
Japan
Prior art keywords
layer
emitting diode
electrode
gas
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004283262A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006100474A (ja
JP2006100474A5 (enrdf_load_stackoverflow
Inventor
瀧  哲也
浩司 奥野
和樹 西島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyoda Gosei Co Ltd
Original Assignee
Toyoda Gosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoda Gosei Co Ltd filed Critical Toyoda Gosei Co Ltd
Priority to JP2004283262A priority Critical patent/JP4487712B2/ja
Publication of JP2006100474A publication Critical patent/JP2006100474A/ja
Publication of JP2006100474A5 publication Critical patent/JP2006100474A5/ja
Application granted granted Critical
Publication of JP4487712B2 publication Critical patent/JP4487712B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Drying Of Semiconductors (AREA)
  • Led Devices (AREA)
JP2004283262A 2004-09-29 2004-09-29 発光ダイオードの製造方法 Expired - Fee Related JP4487712B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004283262A JP4487712B2 (ja) 2004-09-29 2004-09-29 発光ダイオードの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004283262A JP4487712B2 (ja) 2004-09-29 2004-09-29 発光ダイオードの製造方法

Publications (3)

Publication Number Publication Date
JP2006100474A JP2006100474A (ja) 2006-04-13
JP2006100474A5 JP2006100474A5 (enrdf_load_stackoverflow) 2007-03-15
JP4487712B2 true JP4487712B2 (ja) 2010-06-23

Family

ID=36240010

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004283262A Expired - Fee Related JP4487712B2 (ja) 2004-09-29 2004-09-29 発光ダイオードの製造方法

Country Status (1)

Country Link
JP (1) JP4487712B2 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI497754B (zh) * 2012-01-12 2015-08-21 Univ Nat Formosa Methods for improving the luminous efficiency of light emitting diodes

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008226866A (ja) * 2007-02-13 2008-09-25 Mitsubishi Chemicals Corp GaN系LED素子および発光装置
JP5318353B2 (ja) * 2007-02-14 2013-10-16 三菱化学株式会社 GaN系LED素子および発光装置
KR100926280B1 (ko) 2007-12-14 2009-11-12 고려대학교 산학협력단 발광 효율 향상을 위한 질화물 발광 소자 및 그 제조 방법
WO2010020072A1 (en) * 2008-08-19 2010-02-25 Lattice Power (Jiangxi) Corporation Semiconductor light-emitting device with silicone protective layer
US8088633B2 (en) 2009-12-02 2012-01-03 Ultratech, Inc. Optical alignment methods for forming LEDs having a rough surface
KR101091504B1 (ko) 2010-02-12 2011-12-08 엘지이노텍 주식회사 발광소자, 발광소자 패키지 및 발광소자 제조방법
CN103258930B (zh) * 2013-05-09 2016-03-02 大连理工大学 一种GaN LED外延片结构及制备方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI497754B (zh) * 2012-01-12 2015-08-21 Univ Nat Formosa Methods for improving the luminous efficiency of light emitting diodes

Also Published As

Publication number Publication date
JP2006100474A (ja) 2006-04-13

Similar Documents

Publication Publication Date Title
JP3567790B2 (ja) Iii族窒化物系化合物半導体発光素子
TWI447953B (zh) 半導體發光裝置及其製造方法
JP2005277374A (ja) Iii族窒化物系化合物半導体発光素子及びその製造方法
JP5246213B2 (ja) Iii族窒化物半導体発光素子の製造方法
CN100403566C (zh) Ⅲ族氮化物系化合物半导体发光元件及其制造方法
TWI381547B (zh) 三族氮化合物半導體發光二極體及其製造方法
KR100568298B1 (ko) 외부양자효율이 개선된 질화물 반도체 및 그 제조방법
JP2001160627A (ja) Iii族窒化物系化合物半導体発光素子
JP2006114886A (ja) n型III族窒化物半導体積層構造体
JP2011238971A (ja) 窒化物半導体発光素子の製造方法
JP6830098B2 (ja) 半導体ウェハ
JP4487712B2 (ja) 発光ダイオードの製造方法
JP4457609B2 (ja) 窒化ガリウム(GaN)の製造方法
JP4668225B2 (ja) 窒化物半導体発光素子の製造方法
JP4214859B2 (ja) 窒化ガリウム(GaN)基板の製造方法
US7795118B2 (en) Gallium nitride based compound semiconductor device including compliant substrate and method for manufacturing the same
JP2005085932A (ja) 発光ダイオード及びその製造方法
JP2006100475A (ja) 半導体発光素子
JP2005129923A (ja) 窒化物半導体、それを用いた発光素子、発光ダイオード、レーザー素子およびランプ並びにそれらの製造方法
JPH1126812A (ja) 3族窒化物半導体素子及びその製造方法
JP2004363401A (ja) 半導体素子の製造方法
JP4645225B2 (ja) 半導体素子の製造方法
JP2006210692A (ja) 3族窒化物系化合物半導体発光素子
JP4781028B2 (ja) Iii族窒化物半導体積層体及びiii族窒化物半導体発光素子の製造方法
JP2012004457A (ja) 半導体発光素子の製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070130

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070222

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20091106

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20091110

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20091222

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20100309

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20100322

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130409

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 4487712

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140409

Year of fee payment: 4

LAPS Cancellation because of no payment of annual fees