JP4484413B2 - 力制御方式研磨のためのスピンドル組立体 - Google Patents

力制御方式研磨のためのスピンドル組立体 Download PDF

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Publication number
JP4484413B2
JP4484413B2 JP2001520259A JP2001520259A JP4484413B2 JP 4484413 B2 JP4484413 B2 JP 4484413B2 JP 2001520259 A JP2001520259 A JP 2001520259A JP 2001520259 A JP2001520259 A JP 2001520259A JP 4484413 B2 JP4484413 B2 JP 4484413B2
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JP
Japan
Prior art keywords
spindle
feedback loop
force
force generator
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2001520259A
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English (en)
Japanese (ja)
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JP2003508237A5 (enExample
JP2003508237A (ja
Inventor
ミグエル エイ サルダーナ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
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Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2003508237A publication Critical patent/JP2003508237A/ja
Publication of JP2003508237A5 publication Critical patent/JP2003508237A5/ja
Application granted granted Critical
Publication of JP4484413B2 publication Critical patent/JP4484413B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B24B41/044—Grinding spindles with magnetic or electromagnetic bearings; Features related thereto
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/19—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by positioning or contouring control systems, e.g. to control position from one programmed point to another or to control movement along a programmed continuous path
    • G05B19/39—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by positioning or contouring control systems, e.g. to control position from one programmed point to another or to control movement along a programmed continuous path using a combination of the means covered by at least two of the preceding groups G05B19/21, G05B19/27 and G05B19/33

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Human Computer Interaction (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2001520259A 1999-08-30 2000-08-11 力制御方式研磨のためのスピンドル組立体 Expired - Fee Related JP4484413B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/385,769 US6083082A (en) 1999-08-30 1999-08-30 Spindle assembly for force controlled polishing
US09/385,769 1999-08-30
PCT/US2000/021843 WO2001015862A1 (en) 1999-08-30 2000-08-11 Spindle assembly for force controlled polishing

Publications (3)

Publication Number Publication Date
JP2003508237A JP2003508237A (ja) 2003-03-04
JP2003508237A5 JP2003508237A5 (enExample) 2005-12-22
JP4484413B2 true JP4484413B2 (ja) 2010-06-16

Family

ID=23522802

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001520259A Expired - Fee Related JP4484413B2 (ja) 1999-08-30 2000-08-11 力制御方式研磨のためのスピンドル組立体

Country Status (7)

Country Link
US (1) US6083082A (enExample)
EP (1) EP1207981B1 (enExample)
JP (1) JP4484413B2 (enExample)
KR (1) KR100717477B1 (enExample)
DE (1) DE60007642T2 (enExample)
TW (1) TW480207B (enExample)
WO (1) WO2001015862A1 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6705930B2 (en) 2000-01-28 2004-03-16 Lam Research Corporation System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques
US6340326B1 (en) 2000-01-28 2002-01-22 Lam Research Corporation System and method for controlled polishing and planarization of semiconductor wafers
US6646364B1 (en) * 2000-07-11 2003-11-11 Honeywell International Inc. MEMS actuator with lower power consumption and lower cost simplified fabrication
US6755723B1 (en) 2000-09-29 2004-06-29 Lam Research Corporation Polishing head assembly
US6812583B2 (en) 2002-02-19 2004-11-02 Rockwell Scientific Licensing, Llc Electrical generator with ferrofluid bearings
US7288860B2 (en) * 2002-02-19 2007-10-30 Teledyne Licensing, Inc. Magnetic transducer with ferrofluid end bearings
US20030154923A1 (en) * 2002-02-19 2003-08-21 Innovative Technology Licensing, Llc Mechanical translator with ultra low friction ferrofluid bearings
US6812598B2 (en) * 2002-02-19 2004-11-02 Rockwell Scientific Licensing, Llc Multiple magnet transducer with differential magnetic strengths
US6768230B2 (en) * 2002-02-19 2004-07-27 Rockwell Scientific Licensing, Llc Multiple magnet transducer
US6766679B1 (en) * 2002-03-27 2004-07-27 Lam Research Corporation System and method for spindle drive downforce calibration
US6798090B2 (en) * 2002-04-18 2004-09-28 Rockwell Scientific Licensing, Llc Electrical power generation by coupled magnets
US6935938B1 (en) 2004-03-31 2005-08-30 Lam Research Corporation Multiple-conditioning member device for chemical mechanical planarization conditioning
US7040955B1 (en) * 2005-01-28 2006-05-09 Strasbaugh Chemical-mechanical planarization tool force calibration method and system
JP2008246628A (ja) * 2007-03-30 2008-10-16 Disco Abrasive Syst Ltd チャックテーブル機構
JP4327880B2 (ja) * 2008-01-04 2009-09-09 ファナック株式会社 ゲイン自動調整機能を備えたサーボモータ制御装置
JP5306065B2 (ja) * 2009-06-04 2013-10-02 株式会社荏原製作所 ドレッシング装置およびドレッシング方法
US8408082B2 (en) * 2009-11-18 2013-04-02 General Electric Company Apparatus to measure fluids in a conduit
JP5895154B2 (ja) * 2011-01-21 2016-03-30 パナソニックＩｐマネジメント株式会社 リニアアクチュエータの駆動方法
US8550876B2 (en) 2011-08-08 2013-10-08 Apple Inc. Force-controlled surface finishing through the use of a passive magnetic constant-force device
CN103586772B (zh) * 2012-08-16 2016-01-06 鸿富锦精密工业（深圳）有限公司 压力检测装置
SG11201407527PA (en) * 2013-01-30 2014-12-30 Akribis Systems Pte Ltd A planar positioning system and method of using the same
CN110315421B (zh) * 2019-08-20 2023-12-26 江苏集萃精凯高端装备技术有限公司 一种晶体材料均一化抛光装置及使用方法
JP7431589B2 (ja) * 2020-01-17 2024-02-15 株式会社ディスコ 加工装置

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3631634A (en) * 1970-01-26 1972-01-04 John L Weber Polishing machine
US3691694A (en) * 1970-11-02 1972-09-19 Ibm Wafer polishing machine
US3903653A (en) * 1973-04-11 1975-09-09 Harold J Imhoff Lapping machine
DE2451549A1 (de) * 1974-10-30 1976-08-12 Mueller Georg Kugellager Belade- und entladevorrichtung fuer plattenfoermige halbleitermaterialien
US4009539A (en) * 1975-06-16 1977-03-01 Spitfire Tool & Machine Co., Inc. Lapping machine with vacuum workholder
US4020600A (en) * 1976-08-13 1977-05-03 Spitfire Tool & Machine Co., Inc. Polishing fixture
US4141180A (en) * 1977-09-21 1979-02-27 Kayex Corporation Polishing apparatus
US4450652A (en) * 1981-09-04 1984-05-29 Monsanto Company Temperature control for wafer polishing
JPS59161262A (ja) * 1983-03-04 1984-09-12 Masanori Kunieda 磁気吸引式研摩方法
US4593495A (en) * 1983-11-25 1986-06-10 Toshiba Machine Co., Ltd. Polishing machine
DE3479936D1 (en) * 1983-12-12 1989-11-02 Unisys Corp Air bearing for moving webs
GB8402194D0 (en) * 1984-01-27 1984-02-29 Secr Defence Chemical polishing apparatus
US4680893A (en) * 1985-09-23 1987-07-21 Motorola, Inc. Apparatus for polishing semiconductor wafers
DK155299B (da) * 1986-04-18 1989-03-20 Struers As Apparat til slibning eller polering af emner
CH684321A5 (de) * 1988-04-07 1994-08-31 Arthur Werner Staehli Einrichtung an einer Zweischeibenläppmaschine.
JPH01310859A (ja) * 1988-06-09 1989-12-14 Toyoda Mach Works Ltd ポリシング加工機
US4934102A (en) * 1988-10-04 1990-06-19 International Business Machines Corporation System for mechanical planarization
JP2827540B2 (ja) * 1991-03-11 1998-11-25 松下電器産業株式会社 研磨スピンドル
FR2677292B1 (fr) * 1991-06-04 1995-12-08 Seva Machine de polissage a regulation pneumatique de l'effort de l'outil de la piece a polir.
FR2677291B1 (fr) * 1991-06-06 1995-12-15 Commissariat Energie Atomique Machine de polissage a controle de pression.
US5148632A (en) * 1991-06-14 1992-09-22 Corning Incorporated Cavity forming in plastic body
JP3227199B2 (ja) * 1992-05-18 2001-11-12 株式会社リコー 廃トナーの処理方法
US5658183A (en) * 1993-08-25 1997-08-19 Micron Technology, Inc. System for real-time control of semiconductor wafer polishing including optical monitoring
US5456627A (en) * 1993-12-20 1995-10-10 Westech Systems, Inc. Conditioner for a polishing pad and method therefor
US5643044A (en) * 1994-11-01 1997-07-01 Lund; Douglas E. Automatic chemical and mechanical polishing system for semiconductor wafers
US5618447A (en) * 1996-02-13 1997-04-08 Micron Technology, Inc. Polishing pad counter meter and method for real-time control of the polishing rate in chemical-mechanical polishing of semiconductor wafers
JPH1071560A (ja) * 1996-08-27 1998-03-17 Speedfam Co Ltd ウエハ加圧装置

Also Published As

Publication number Publication date
DE60007642D1 (de) 2004-02-12
EP1207981B1 (en) 2004-01-07
WO2001015862A1 (en) 2001-03-08
JP2003508237A (ja) 2003-03-04
TW480207B (en) 2002-03-21
KR100717477B1 (ko) 2007-05-14
KR20020027583A (ko) 2002-04-13
DE60007642T2 (de) 2004-10-07
US6083082A (en) 2000-07-04
EP1207981A1 (en) 2002-05-29

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