JP4464260B2 - 半導体装置、放射線撮像装置、及びその製造方法 - Google Patents

半導体装置、放射線撮像装置、及びその製造方法 Download PDF

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Publication number
JP4464260B2
JP4464260B2 JP2004338929A JP2004338929A JP4464260B2 JP 4464260 B2 JP4464260 B2 JP 4464260B2 JP 2004338929 A JP2004338929 A JP 2004338929A JP 2004338929 A JP2004338929 A JP 2004338929A JP 4464260 B2 JP4464260 B2 JP 4464260B2
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JP
Japan
Prior art keywords
substrate
gap
electrical connection
electrical
imaging apparatus
Prior art date
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Expired - Fee Related
Application number
JP2004338929A
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English (en)
Japanese (ja)
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JP2006145469A5 (enExample
JP2006145469A (ja
Inventor
慎市 竹田
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Canon Inc
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Canon Inc
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Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2004338929A priority Critical patent/JP4464260B2/ja
Priority to US11/286,389 priority patent/US7564112B2/en
Publication of JP2006145469A publication Critical patent/JP2006145469A/ja
Publication of JP2006145469A5 publication Critical patent/JP2006145469A5/ja
Application granted granted Critical
Publication of JP4464260B2 publication Critical patent/JP4464260B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H10F39/189—X-ray, gamma-ray or corpuscular radiation imagers
    • H10F39/1898—Indirect radiation image sensors, e.g. using luminescent members
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measurement Of Radiation (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Light Receiving Elements (AREA)
  • Electroluminescent Light Sources (AREA)
JP2004338929A 2004-11-24 2004-11-24 半導体装置、放射線撮像装置、及びその製造方法 Expired - Fee Related JP4464260B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2004338929A JP4464260B2 (ja) 2004-11-24 2004-11-24 半導体装置、放射線撮像装置、及びその製造方法
US11/286,389 US7564112B2 (en) 2004-11-24 2005-11-25 Semiconductor device, radiographic imaging apparatus, and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004338929A JP4464260B2 (ja) 2004-11-24 2004-11-24 半導体装置、放射線撮像装置、及びその製造方法

Publications (3)

Publication Number Publication Date
JP2006145469A JP2006145469A (ja) 2006-06-08
JP2006145469A5 JP2006145469A5 (enExample) 2008-01-10
JP4464260B2 true JP4464260B2 (ja) 2010-05-19

Family

ID=36460193

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004338929A Expired - Fee Related JP4464260B2 (ja) 2004-11-24 2004-11-24 半導体装置、放射線撮像装置、及びその製造方法

Country Status (2)

Country Link
US (1) US7564112B2 (enExample)
JP (1) JP4464260B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10283555B2 (en) 2013-09-06 2019-05-07 Canon Kabushiki Kaisha Radiation detection apparatus, manufacturing method therefor, and radiation detection system

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE60144280D1 (en) * 2000-05-19 2011-05-05 Hamamatsu Photonics Kk Lung
US7396159B2 (en) * 2006-06-07 2008-07-08 General Electric Company X-ray detector panel methods and apparatus
DE102006038969B4 (de) * 2006-08-21 2013-02-28 Siemens Aktiengesellschaft Röntgenkonverterelement und Verfahren zu dessen Herstellung
JP5004848B2 (ja) * 2007-04-18 2012-08-22 キヤノン株式会社 放射線検出装置及び放射線検出システム
US7495227B2 (en) * 2007-07-10 2009-02-24 General Electric Company Digital x-ray detectors
US8399842B2 (en) * 2009-12-07 2013-03-19 Carestream Health, Inc. Digital radiographic detector with bonded phosphor layer
JP5178900B2 (ja) * 2010-11-08 2013-04-10 富士フイルム株式会社 放射線検出器
JP2012177624A (ja) * 2011-02-25 2012-09-13 Fujifilm Corp 放射線画像検出装置及び放射線画像検出装置の製造方法
JP5788738B2 (ja) * 2011-08-26 2015-10-07 富士フイルム株式会社 放射線検出器の製造方法
US9450200B2 (en) * 2012-11-20 2016-09-20 Samsung Display Co., Ltd. Organic light emitting diode
US10068679B2 (en) * 2013-07-04 2018-09-04 Konica Minolta, Inc. Scintillator panel and production method thereof
US11411041B2 (en) * 2016-05-16 2022-08-09 Carestream Health, Inc. Flexible substrate module and fabrication method
CN108012442A (zh) * 2017-12-29 2018-05-08 广东欧珀移动通信有限公司 一种支架
JP7181049B2 (ja) * 2018-10-18 2022-11-30 浜松ホトニクス株式会社 放射線撮像装置、放射線撮像装置の製造方法、及び放射線撮像装置の修復方法
JP7185481B2 (ja) * 2018-10-18 2022-12-07 浜松ホトニクス株式会社 放射線撮像装置
JP7181050B2 (ja) * 2018-10-18 2022-11-30 浜松ホトニクス株式会社 放射線撮像装置
JP7686365B2 (ja) * 2018-11-20 2025-06-02 キヤノン株式会社 電子部品および機器
JP7325295B2 (ja) * 2019-10-24 2023-08-14 浜松ホトニクス株式会社 シンチレータパネル、放射線検出器、シンチレータパネルの製造方法、及び、放射線検出器の製造方法
JP7468105B2 (ja) * 2020-04-16 2024-04-16 コニカミノルタ株式会社 放射線検出器
CN113263236B (zh) * 2021-04-29 2023-03-21 四川航天燎原科技有限公司 一种插针网格阵列封装元器件pga解焊工艺方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3486515B2 (ja) * 1996-12-13 2004-01-13 キヤノン株式会社 ガラス基板保持構造及び放射線撮影装置
JP4497663B2 (ja) * 2000-06-09 2010-07-07 キヤノン株式会社 放射線画像撮影装置
JP2002014168A (ja) * 2000-06-27 2002-01-18 Canon Inc Ｘ線撮像装置
FR2835651B1 (fr) * 2002-02-06 2005-04-15 St Microelectronics Sa Dispositif de montage d'un boitier semi-conducteur sur une plaque-support par l'intermediaire d'une embase

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10283555B2 (en) 2013-09-06 2019-05-07 Canon Kabushiki Kaisha Radiation detection apparatus, manufacturing method therefor, and radiation detection system

Also Published As

Publication number Publication date
US20060108683A1 (en) 2006-05-25
JP2006145469A (ja) 2006-06-08
US7564112B2 (en) 2009-07-21

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