JP4443208B2 - スキャナ装置 - Google Patents
スキャナ装置 Download PDFInfo
- Publication number
- JP4443208B2 JP4443208B2 JP2003415247A JP2003415247A JP4443208B2 JP 4443208 B2 JP4443208 B2 JP 4443208B2 JP 2003415247 A JP2003415247 A JP 2003415247A JP 2003415247 A JP2003415247 A JP 2003415247A JP 4443208 B2 JP4443208 B2 JP 4443208B2
- Authority
- JP
- Japan
- Prior art keywords
- value
- gain
- compensator
- tracking error
- mirror
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
- G02B26/105—Scanning systems with one or more pivoting mirrors or galvano-mirrors
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
- G02B26/12—Scanning systems using multifaceted mirrors
- G02B26/127—Adaptive control of the scanning light beam, e.g. using the feedback from one or more detectors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
- B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/18—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
- G02B7/182—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors for mirrors
- G02B7/1821—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors for mirrors for rotating or oscillating mirrors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Optical Scanning Systems (AREA)
- Control Of Position Or Direction (AREA)
- Laser Beam Processing (AREA)
- Feedback Control In General (AREA)
Description
器31の入力から角度センサ14の出力までの伝達特性(ゲイン特性)は、同図(b)に
実線で示す曲線になる。なお、同図(b)における波線は同図(a)に実線で示す曲線を
示している。同図(b)から明らかなように、高周波領域安定化補償器31を設けた場合
の伝達特性は、二つの共振ピークゲインが下がり、かつ両者の中間の周波数でもゲインが
下がる。
12 ミラー
13 回転軸
24 積分補償器
25 追従誤差比例補償器
27 検出値比例補償器
28 検出値微分補償器
Claims (4)
- サーボ制御装置を備え、ガルバノミラーを支持する回転軸の回転角度を検出し、検出された検出値の指令値に対する追従誤差を積分することにより前記検出値を前記指令値に追従させるスキャナ装置において、
前記追従誤差の積分値に前記追従誤差に比例する補正値を加算し、
前記サーボ制御装置を構成する補償手段のゲインを、予めガルバノミラーの移動角度に応じて複数定めておき、前記回転軸を回転させるのに先立ち、前記指令値によって決まる前記移動角度に応じて前記各補償手段のゲインを変更することを特徴とするスキャナ装置 - 前記回転軸のねじり共振ピークが存在する周波数領域においてフィードバック・ループの安定性を補償する安定化補償手段を設けることを特徴とする請求項1に記載のスキャナ装置。
- 前記安定化補償手段は、安定化しようとする複数の前記ねじり共振ピークに対応する直列したノッチフィルタと、隣接する前記ねじり共振ピークの中間の周波数区間に遮断特性を有するノッチフィルタと、を直列に接続したものであることを特徴とする請求項2に記載のスキャナ装置。
- 前記検出値に比例する補正値を演算する検出値比例補償手段を設け、
この検出値比例補償手段で得られた補正値を前記積分値から減算する場合には、前記ゲインを変更する際に
、前記検出値比例補償手段の出力から前記ゲインの変化量で前記検出値を係数倍した値を減算することを特徴とする請求項1に記載のスキャナ装置。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003415247A JP4443208B2 (ja) | 2003-12-12 | 2003-12-12 | スキャナ装置 |
TW093123064A TWI255923B (en) | 2003-12-12 | 2004-08-02 | Scanner |
CNB2004100569930A CN1318880C (zh) | 2003-12-12 | 2004-08-24 | 扫描装置 |
US10/927,082 US7432681B2 (en) | 2003-12-12 | 2004-08-27 | Scanner system |
KR1020040068683A KR100744733B1 (ko) | 2003-12-12 | 2004-08-30 | 스캐너 장치 |
DE102004064143.9A DE102004064143B3 (de) | 2003-12-12 | 2004-08-31 | Scanner-System |
DE102004042056A DE102004042056A1 (de) | 2003-12-12 | 2004-08-31 | Scanner-System |
HK05106979A HK1074885A1 (en) | 2003-12-12 | 2005-08-12 | Scanner system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003415247A JP4443208B2 (ja) | 2003-12-12 | 2003-12-12 | スキャナ装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005173377A JP2005173377A (ja) | 2005-06-30 |
JP2005173377A5 JP2005173377A5 (ja) | 2006-04-20 |
JP4443208B2 true JP4443208B2 (ja) | 2010-03-31 |
Family
ID=34650569
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003415247A Expired - Fee Related JP4443208B2 (ja) | 2003-12-12 | 2003-12-12 | スキャナ装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7432681B2 (ja) |
JP (1) | JP4443208B2 (ja) |
KR (1) | KR100744733B1 (ja) |
CN (1) | CN1318880C (ja) |
DE (2) | DE102004064143B3 (ja) |
HK (1) | HK1074885A1 (ja) |
TW (1) | TWI255923B (ja) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005047218B4 (de) * | 2005-10-01 | 2021-10-07 | Carl Zeiss Microscopy Gmbh | Verfahren zur Steuerung eines optischen Scanners, optischer Scanner und Laser-Scanning-Mikroskop |
DE102005047217A1 (de) * | 2005-10-01 | 2007-04-05 | Carl Zeiss Jena Gmbh | Verfahren zur Steuerung eines optischen Scanners und Steuereinrichtung für einen optischen Scanner |
JP4630853B2 (ja) * | 2006-03-30 | 2011-02-09 | 日立ビアメカニクス株式会社 | 移動体の位置決め制御装置及びレーザ加工装置 |
WO2007136828A2 (en) * | 2006-05-19 | 2007-11-29 | Siemens Energy & Automation, Inc. | Automating tuning of a closed loop controller |
EP2076354B1 (en) * | 2006-08-22 | 2011-11-02 | GSI Group Corporation | System for employing scanners in an x-y high speed drilling system |
US8426768B2 (en) * | 2008-02-20 | 2013-04-23 | Aerotech, Inc. | Position-based laser triggering for scanner |
JP5020880B2 (ja) * | 2008-04-22 | 2012-09-05 | キヤノン株式会社 | ガルバノモータ及びガルバノモータシステム |
JP5393598B2 (ja) * | 2010-06-03 | 2014-01-22 | キヤノン株式会社 | ガルバノ装置及びレーザ加工装置 |
JP5943627B2 (ja) * | 2012-02-14 | 2016-07-05 | 住友重機械工業株式会社 | レーザ加工装置及びレーザ加工方法 |
US9486877B2 (en) * | 2013-01-11 | 2016-11-08 | Electro Scientific Industries, Inc. | Laser pulse energy control systems and methods |
TWI632013B (zh) | 2013-03-15 | 2018-08-11 | 美商伊雷克托科學工業股份有限公司 | 用以處理工件上或之內的特徵的雷射處理設備和用於雷射處理工件的方法 |
KR102245812B1 (ko) | 2013-03-15 | 2021-04-30 | 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 | Aod 이동 저감을 위한 aod 툴 정착을 위한 레이저 시스템 및 방법 |
JP6167307B2 (ja) * | 2014-06-05 | 2017-07-26 | パナソニックIpマネジメント株式会社 | レーザ加工装置 |
JP6310358B2 (ja) * | 2014-08-01 | 2018-04-11 | 株式会社キーエンス | レーザ加工装置 |
JP6673632B2 (ja) | 2014-09-08 | 2020-03-25 | ファナック株式会社 | レーザ光を高速で走査可能なガルバノスキャナを含む光造形加工機 |
US10507544B2 (en) | 2015-02-27 | 2019-12-17 | Electro Scientific Industries, Inc | Fast beam manipulation for cross-axis miromaching |
JP6383309B2 (ja) * | 2015-03-17 | 2018-08-29 | アズビル株式会社 | 制御装置および制御方法 |
CN106052592A (zh) * | 2016-06-28 | 2016-10-26 | 西安励德微系统科技有限公司 | 一种扫描式结构光投影系统及其控制方法 |
CN211935467U (zh) | 2017-03-02 | 2020-11-17 | 贝姆15有限责任公司 | 用于动态重建或模拟竞赛情境的光学设备 |
US11264929B2 (en) * | 2019-09-18 | 2022-03-01 | Rockwell Automation Technologies, Inc. | Systems and methods for non-rigid load vibration control |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
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US4432083A (en) * | 1982-02-17 | 1984-02-14 | Burroughs Corporation | Optical memory system having track following |
US4435798A (en) * | 1982-03-24 | 1984-03-06 | Stanley Taub | Method and apparatus for cleaning disks containing encoded information |
US4669074A (en) * | 1982-05-19 | 1987-05-26 | Burroughs Corporation | Focusing control circuitry for an optical memory system |
US4674076A (en) * | 1982-05-19 | 1987-06-16 | Burroughs Corporation | Optical memory system having improved positioning and focusing control circuitry |
US5059359A (en) * | 1988-04-18 | 1991-10-22 | 3 D Systems, Inc. | Methods and apparatus for production of three-dimensional objects by stereolithography |
US5293042A (en) * | 1991-05-10 | 1994-03-08 | Olympus Optical Co., Ltd. | Servo circuit of scanning probe microscope |
DE19619271C2 (de) | 1996-05-13 | 2001-02-08 | Lutz Langhans | Regeleinrichtung mit adaptiver Parameterkorrektur |
JPH1010449A (ja) * | 1996-06-24 | 1998-01-16 | Olympus Optical Co Ltd | スキャナ駆動装置 |
JP3519278B2 (ja) * | 1998-07-08 | 2004-04-12 | 三菱電機株式会社 | レーザ加工方法、レーザ加工装置およびその方法を実行させるためのプログラムを記録したコンピュータ読み取り可能な記録媒体 |
US6218803B1 (en) * | 1999-06-04 | 2001-04-17 | Genetic Microsystems, Inc. | Position sensing with variable capacitance transducers |
US6198246B1 (en) * | 1999-08-19 | 2001-03-06 | Siemens Energy & Automation, Inc. | Method and apparatus for tuning control system parameters |
JP4233202B2 (ja) * | 2000-07-31 | 2009-03-04 | 日立ビアメカニクス株式会社 | 光学スキャナ装置の制御装置 |
US6768100B1 (en) * | 2000-10-27 | 2004-07-27 | Gsi Lumonics Corporation | Continuous position calibration for servo controlled rotary system |
JP2002196274A (ja) * | 2000-12-26 | 2002-07-12 | Sumitomo Heavy Ind Ltd | ガルバノスキャナの制御方法及び装置 |
KR100379780B1 (ko) | 2001-06-28 | 2003-04-10 | 오아이에스 주식회사 | 레이저 스캐너의 자동 튜닝 장치 및 방법 |
EP1316831B1 (en) * | 2001-11-28 | 2005-05-11 | HITACHI VIA MECHANICS, Ltd. | Method and device for controlling an optical scanner |
JP2003228422A (ja) | 2002-02-04 | 2003-08-15 | Canon Inc | ステージ制御装置及び露光装置並びにデバイスの製造方法 |
US7437201B2 (en) * | 2003-01-14 | 2008-10-14 | Cullen Christopher P | Electric motor controller |
US7035694B2 (en) * | 2003-05-13 | 2006-04-25 | National Instruments Corporation | Automatic tuning of motion controllers using search techniques |
-
2003
- 2003-12-12 JP JP2003415247A patent/JP4443208B2/ja not_active Expired - Fee Related
-
2004
- 2004-08-02 TW TW093123064A patent/TWI255923B/zh not_active IP Right Cessation
- 2004-08-24 CN CNB2004100569930A patent/CN1318880C/zh not_active Expired - Fee Related
- 2004-08-27 US US10/927,082 patent/US7432681B2/en active Active
- 2004-08-30 KR KR1020040068683A patent/KR100744733B1/ko active IP Right Grant
- 2004-08-31 DE DE102004064143.9A patent/DE102004064143B3/de not_active Expired - Fee Related
- 2004-08-31 DE DE102004042056A patent/DE102004042056A1/de not_active Ceased
-
2005
- 2005-08-12 HK HK05106979A patent/HK1074885A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US7432681B2 (en) | 2008-10-07 |
DE102004042056A1 (de) | 2005-07-14 |
KR100744733B1 (ko) | 2007-08-01 |
KR20050059401A (ko) | 2005-06-20 |
US20050128553A1 (en) | 2005-06-16 |
DE102004064143B3 (de) | 2022-02-24 |
CN1318880C (zh) | 2007-05-30 |
HK1074885A1 (en) | 2005-11-25 |
CN1627121A (zh) | 2005-06-15 |
JP2005173377A (ja) | 2005-06-30 |
TWI255923B (en) | 2006-06-01 |
TW200519404A (en) | 2005-06-16 |
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