JP4429620B2 - 感放射線性有機化合物 - Google Patents
感放射線性有機化合物 Download PDFInfo
- Publication number
- JP4429620B2 JP4429620B2 JP2003112458A JP2003112458A JP4429620B2 JP 4429620 B2 JP4429620 B2 JP 4429620B2 JP 2003112458 A JP2003112458 A JP 2003112458A JP 2003112458 A JP2003112458 A JP 2003112458A JP 4429620 B2 JP4429620 B2 JP 4429620B2
- Authority
- JP
- Japan
- Prior art keywords
- group
- photoresist
- tert
- radiation
- organic compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C43/00—Ethers; Compounds having groups, groups or groups
- C07C43/02—Ethers
- C07C43/235—Ethers having an ether-oxygen atom bound to a carbon atom of a six-membered aromatic ring and to a carbon atom of a ring other than a six-membered aromatic ring
- C07C43/253—Ethers having an ether-oxygen atom bound to a carbon atom of a six-membered aromatic ring and to a carbon atom of a ring other than a six-membered aromatic ring containing hydroxy or O-metal groups
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
- C07C69/66—Esters of carboxylic acids having esterified carboxylic groups bound to acyclic carbon atoms and having any of the groups OH, O—metal, —CHO, keto, ether, acyloxy, groups, groups, or in the acid moiety
- C07C69/67—Esters of carboxylic acids having esterified carboxylic groups bound to acyclic carbon atoms and having any of the groups OH, O—metal, —CHO, keto, ether, acyloxy, groups, groups, or in the acid moiety of saturated acids
- C07C69/708—Ethers
- C07C69/712—Ethers the hydroxy group of the ester being etherified with a hydroxy compound having the hydroxy group bound to a carbon atom of a six-membered aromatic ring
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
- C07C69/66—Esters of carboxylic acids having esterified carboxylic groups bound to acyclic carbon atoms and having any of the groups OH, O—metal, —CHO, keto, ether, acyloxy, groups, groups, or in the acid moiety
- C07C69/73—Esters of carboxylic acids having esterified carboxylic groups bound to acyclic carbon atoms and having any of the groups OH, O—metal, —CHO, keto, ether, acyloxy, groups, groups, or in the acid moiety of unsaturated acids
- C07C69/734—Ethers
- C07C69/736—Ethers the hydroxy group of the ester being etherified with a hydroxy compound having the hydroxy group bound to a carbon atom of a six-membered aromatic ring
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
- C07C69/96—Esters of carbonic or haloformic acids
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D309/00—Heterocyclic compounds containing six-membered rings having one oxygen atom as the only ring hetero atom, not condensed with other rings
- C07D309/02—Heterocyclic compounds containing six-membered rings having one oxygen atom as the only ring hetero atom, not condensed with other rings having no double bonds between ring members or between ring members and non-ring members
- C07D309/04—Heterocyclic compounds containing six-membered rings having one oxygen atom as the only ring hetero atom, not condensed with other rings having no double bonds between ring members or between ring members and non-ring members with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached to ring carbon atoms
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C2603/00—Systems containing at least three condensed rings
- C07C2603/56—Ring systems containing bridged rings
- C07C2603/58—Ring systems containing bridged rings containing three rings
- C07C2603/70—Ring systems containing bridged rings containing three rings containing only six-membered rings
- C07C2603/74—Adamantanes
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003112458A JP4429620B2 (ja) | 2002-10-15 | 2003-04-17 | 感放射線性有機化合物 |
| AU2003261865A AU2003261865A1 (en) | 2002-10-15 | 2003-09-01 | Photoresist base material, method for purification thereof, and photoresist compositions |
| US10/531,208 US20050271971A1 (en) | 2002-10-15 | 2003-09-01 | Photoresist base material, method for purification thereof, and photoresist compositions |
| PCT/JP2003/011137 WO2004036315A1 (ja) | 2002-10-15 | 2003-09-01 | フォトレジスト基材及びその精製方法、並びにフォトレジスト組成物 |
| KR1020057006474A KR20050061538A (ko) | 2002-10-15 | 2003-09-01 | 포토레지스트 기재, 이것의 정제 방법 및 포토레지스트조성물 |
| EP03808872A EP1553451A4 (en) | 2002-10-15 | 2003-09-01 | PHOTOSENSITIVE MEDIUM, PURIFICATION METHOD THEREFOR, AND PHOTOSENSITIVE COMPOSITIONS |
| TW092124659A TWI282037B (en) | 2002-10-15 | 2003-09-05 | Photoresist base material, method for purification thereof, and photoresist compositions |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002300144 | 2002-10-15 | ||
| JP2003112458A JP4429620B2 (ja) | 2002-10-15 | 2003-04-17 | 感放射線性有機化合物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004191913A JP2004191913A (ja) | 2004-07-08 |
| JP2004191913A5 JP2004191913A5 (enExample) | 2006-03-23 |
| JP4429620B2 true JP4429620B2 (ja) | 2010-03-10 |
Family
ID=32109447
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003112458A Expired - Fee Related JP4429620B2 (ja) | 2002-10-15 | 2003-04-17 | 感放射線性有機化合物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20050271971A1 (enExample) |
| EP (1) | EP1553451A4 (enExample) |
| JP (1) | JP4429620B2 (enExample) |
| KR (1) | KR20050061538A (enExample) |
| AU (1) | AU2003261865A1 (enExample) |
| TW (1) | TWI282037B (enExample) |
| WO (1) | WO2004036315A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011062198A1 (ja) | 2009-11-20 | 2011-05-26 | 富士フイルム株式会社 | 分散組成物及び感光性樹脂組成物、並びに固体撮像素子 |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7001708B1 (en) * | 2001-11-28 | 2006-02-21 | University Of Central Florida Research Foundation, Inc. | Photosensitive polymeric material for worm optical data storage with two-photon fluorescent readout |
| KR100900173B1 (ko) | 2004-02-20 | 2009-06-02 | 도오꾜오까고오교 가부시끼가이샤 | 패턴 형성 재료용 기재, 포지티브형 레지스트 조성물 및 레지스트 패턴 형성 방법 |
| US20070190451A1 (en) * | 2004-04-05 | 2007-08-16 | Idemitsu Kosan Co., Ltd. | Calixresorcinarene compounds, photoresist base materials, and compositions thereof |
| JP3946715B2 (ja) | 2004-07-28 | 2007-07-18 | 東京応化工業株式会社 | ポジ型レジスト組成物およびレジストパターン形成方法 |
| JP4468119B2 (ja) | 2004-09-08 | 2010-05-26 | 東京応化工業株式会社 | レジスト組成物およびレジストパターン形成方法 |
| JP4837323B2 (ja) | 2004-10-29 | 2011-12-14 | 東京応化工業株式会社 | レジスト組成物、レジストパターン形成方法および化合物 |
| TWI494697B (zh) | 2004-12-24 | 2015-08-01 | Mitsubishi Gas Chemical Co | 光阻用化合物 |
| JP4618715B2 (ja) * | 2005-01-27 | 2011-01-26 | 日東電工株式会社 | 液晶化合物 |
| US7981588B2 (en) | 2005-02-02 | 2011-07-19 | Tokyo Ohka Kogyo Co., Ltd. | Negative resist composition and method of forming resist pattern |
| JP5138157B2 (ja) | 2005-05-17 | 2013-02-06 | 東京応化工業株式会社 | ポジ型レジスト組成物およびレジストパターン形成方法 |
| KR20080028863A (ko) * | 2005-06-01 | 2008-04-02 | 이데미쓰 고산 가부시키가이샤 | 칼릭스레졸시나렌 화합물, 그리고, 그것으로 이루어지는포토레지스트 기재 및 그 조성물 |
| JP4813103B2 (ja) | 2005-06-17 | 2011-11-09 | 東京応化工業株式会社 | 化合物、ポジ型レジスト組成物およびレジストパターン形成方法 |
| JP4732038B2 (ja) | 2005-07-05 | 2011-07-27 | 東京応化工業株式会社 | 化合物、ポジ型レジスト組成物およびレジストパターン形成方法 |
| JP2009527019A (ja) * | 2006-02-16 | 2009-07-23 | コーネル・リサーチ・ファンデーション・インコーポレイテッド | 200nm未満リソグラフィー用アダマンタン系分子性ガラスフォトレジスト |
| TW200905398A (en) * | 2007-04-27 | 2009-02-01 | Idemitsu Kosan Co | Photoresist base material and photoresist composition containing the same |
| JP5396738B2 (ja) * | 2007-05-09 | 2014-01-22 | 三菱瓦斯化学株式会社 | 感放射線性組成物、化合物、化合物の製造方法およびレジストパターン形成方法 |
| WO2008153154A1 (ja) * | 2007-06-15 | 2008-12-18 | Idemitsu Kosan Co., Ltd. | 環状化合物、フォトレジスト基材及びフォトレジスト組成物 |
| TW200914417A (en) * | 2007-06-28 | 2009-04-01 | Idemitsu Kosan Co | Method for production of cyclic compound having substituent introduced therein, and photoresist substrate |
| JP5354420B2 (ja) * | 2007-12-11 | 2013-11-27 | 出光興産株式会社 | 環状化合物、フォトレジスト基材、フォトレジスト組成物、微細加工方法及び半導体装置 |
| JP5435995B2 (ja) * | 2009-01-30 | 2014-03-05 | 出光興産株式会社 | 環状化合物の製造方法 |
| JP2013079230A (ja) | 2011-09-23 | 2013-05-02 | Rohm & Haas Electronic Materials Llc | カリックスアレーンおよびこれを含むフォトレジスト組成物 |
| JP2013067612A (ja) | 2011-09-23 | 2013-04-18 | Rohm & Haas Electronic Materials Llc | カリックスアレーン化合物およびこれを含むフォトレジスト組成物 |
| KR101935293B1 (ko) | 2016-10-28 | 2019-01-04 | 한양대학교 에리카산학협력단 | 새로운 레졸신아렌 기반의 양친매성 화합물 및 이의 활용 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3888400D1 (de) * | 1987-06-12 | 1994-04-21 | Ciba Geigy | Photoresistzusammensetzungen. |
| JP3039048B2 (ja) * | 1991-11-01 | 2000-05-08 | 住友化学工業株式会社 | ポジ型感放射線性レジスト組成物 |
| JP2655384B2 (ja) * | 1991-11-08 | 1997-09-17 | 富士写真フイルム株式会社 | ポジ型レジスト組成物 |
| JP3340864B2 (ja) * | 1994-10-26 | 2002-11-05 | 富士写真フイルム株式会社 | ポジ型化学増幅レジスト組成物 |
| JPH10310545A (ja) * | 1997-05-09 | 1998-11-24 | Jsr Corp | フェノール系デンドリマー化合物およびそれを含む感放射線性組成物 |
| TW383416B (en) * | 1997-06-26 | 2000-03-01 | Matsushita Electric Industrial Co Ltd | Pattern forming method |
| JPH11322656A (ja) * | 1998-05-11 | 1999-11-24 | Jsr Corp | 新規なカリックスアレーン誘導体およびカリックスレゾルシナレーン誘導体、ならびに感光性組成物 |
| US6093517A (en) * | 1998-07-31 | 2000-07-25 | International Business Machines Corporation | Calixarenes for use as dissolution inhibitors in lithographic photoresist compositions |
| JP3850596B2 (ja) * | 1999-02-25 | 2006-11-29 | 本州化学工業株式会社 | 新規な部分保護トリスフェノール類とその製造方法 |
| JP4135277B2 (ja) * | 1999-10-12 | 2008-08-20 | Jsr株式会社 | 感放射線性樹脂組成物 |
| JP4141625B2 (ja) * | 2000-08-09 | 2008-08-27 | 東京応化工業株式会社 | ポジ型レジスト組成物およびそのレジスト層を設けた基材 |
| JP2002182392A (ja) * | 2000-12-11 | 2002-06-26 | Fuji Photo Film Co Ltd | 電子線又はx線用ポジ型レジスト組成物 |
| JP2002229193A (ja) * | 2001-02-06 | 2002-08-14 | Fuji Photo Film Co Ltd | 電子線又はx線用ポジ型レジスト組成物 |
| US7534547B2 (en) * | 2001-03-29 | 2009-05-19 | Osaka Gas Company Limited | Optically active compound and photosensitive resin composition |
| JP3988580B2 (ja) * | 2001-08-23 | 2007-10-10 | Jsr株式会社 | スルホニルオキシム化合物、それを使用する感放射線性酸発生剤、ポジ型感放射線性樹脂組成物、及びネガ型感放射線性樹脂組成物 |
| JP4004820B2 (ja) * | 2001-10-01 | 2007-11-07 | 富士フイルム株式会社 | ポジ型電子線、x線又はeuv用レジスト組成物 |
| US7013965B2 (en) * | 2003-04-29 | 2006-03-21 | General Electric Company | Organic matrices containing nanomaterials to enhance bulk thermal conductivity |
-
2003
- 2003-04-17 JP JP2003112458A patent/JP4429620B2/ja not_active Expired - Fee Related
- 2003-09-01 US US10/531,208 patent/US20050271971A1/en not_active Abandoned
- 2003-09-01 EP EP03808872A patent/EP1553451A4/en not_active Withdrawn
- 2003-09-01 AU AU2003261865A patent/AU2003261865A1/en not_active Abandoned
- 2003-09-01 WO PCT/JP2003/011137 patent/WO2004036315A1/ja not_active Ceased
- 2003-09-01 KR KR1020057006474A patent/KR20050061538A/ko not_active Ceased
- 2003-09-05 TW TW092124659A patent/TWI282037B/zh not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011062198A1 (ja) | 2009-11-20 | 2011-05-26 | 富士フイルム株式会社 | 分散組成物及び感光性樹脂組成物、並びに固体撮像素子 |
Also Published As
| Publication number | Publication date |
|---|---|
| AU2003261865A1 (en) | 2004-05-04 |
| TWI282037B (en) | 2007-06-01 |
| WO2004036315B1 (ja) | 2004-06-03 |
| US20050271971A1 (en) | 2005-12-08 |
| EP1553451A4 (en) | 2009-12-16 |
| JP2004191913A (ja) | 2004-07-08 |
| TW200405957A (en) | 2004-04-16 |
| EP1553451A1 (en) | 2005-07-13 |
| KR20050061538A (ko) | 2005-06-22 |
| WO2004036315A1 (ja) | 2004-04-29 |
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