AU2003261865A1 - Photoresist base material, method for purification thereof, and photoresist compositions - Google Patents

Photoresist base material, method for purification thereof, and photoresist compositions

Info

Publication number
AU2003261865A1
AU2003261865A1 AU2003261865A AU2003261865A AU2003261865A1 AU 2003261865 A1 AU2003261865 A1 AU 2003261865A1 AU 2003261865 A AU2003261865 A AU 2003261865A AU 2003261865 A AU2003261865 A AU 2003261865A AU 2003261865 A1 AU2003261865 A1 AU 2003261865A1
Authority
AU
Australia
Prior art keywords
photoresist
purification
base material
compositions
photoresist compositions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003261865A
Other languages
English (en)
Inventor
Hirotoshi Ishii
Mitsuru Ueda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Idemitsu Kosan Co Ltd
Original Assignee
Idemitsu Kosan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Idemitsu Kosan Co Ltd filed Critical Idemitsu Kosan Co Ltd
Publication of AU2003261865A1 publication Critical patent/AU2003261865A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C43/00—Ethers; Compounds having groups, groups or groups
    • C07C43/02—Ethers
    • C07C43/235—Ethers having an ether-oxygen atom bound to a carbon atom of a six-membered aromatic ring and to a carbon atom of a ring other than a six-membered aromatic ring
    • C07C43/253—Ethers having an ether-oxygen atom bound to a carbon atom of a six-membered aromatic ring and to a carbon atom of a ring other than a six-membered aromatic ring containing hydroxy or O-metal groups
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
    • C07C69/66—Esters of carboxylic acids having esterified carboxylic groups bound to acyclic carbon atoms and having any of the groups OH, O—metal, —CHO, keto, ether, acyloxy, groups, groups, or in the acid moiety
    • C07C69/67—Esters of carboxylic acids having esterified carboxylic groups bound to acyclic carbon atoms and having any of the groups OH, O—metal, —CHO, keto, ether, acyloxy, groups, groups, or in the acid moiety of saturated acids
    • C07C69/708—Ethers
    • C07C69/712—Ethers the hydroxy group of the ester being etherified with a hydroxy compound having the hydroxy group bound to a carbon atom of a six-membered aromatic ring
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
    • C07C69/66—Esters of carboxylic acids having esterified carboxylic groups bound to acyclic carbon atoms and having any of the groups OH, O—metal, —CHO, keto, ether, acyloxy, groups, groups, or in the acid moiety
    • C07C69/73—Esters of carboxylic acids having esterified carboxylic groups bound to acyclic carbon atoms and having any of the groups OH, O—metal, —CHO, keto, ether, acyloxy, groups, groups, or in the acid moiety of unsaturated acids
    • C07C69/734—Ethers
    • C07C69/736—Ethers the hydroxy group of the ester being etherified with a hydroxy compound having the hydroxy group bound to a carbon atom of a six-membered aromatic ring
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
    • C07C69/96—Esters of carbonic or haloformic acids
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D309/00—Heterocyclic compounds containing six-membered rings having one oxygen atom as the only ring hetero atom, not condensed with other rings
    • C07D309/02—Heterocyclic compounds containing six-membered rings having one oxygen atom as the only ring hetero atom, not condensed with other rings having no double bonds between ring members or between ring members and non-ring members
    • C07D309/04—Heterocyclic compounds containing six-membered rings having one oxygen atom as the only ring hetero atom, not condensed with other rings having no double bonds between ring members or between ring members and non-ring members with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached to ring carbon atoms
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C2603/00—Systems containing at least three condensed rings
    • C07C2603/56—Ring systems containing bridged rings
    • C07C2603/58—Ring systems containing bridged rings containing three rings
    • C07C2603/70—Ring systems containing bridged rings containing three rings containing only six-membered rings
    • C07C2603/74—Adamantanes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Materials For Photolithography (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
AU2003261865A 2002-10-15 2003-09-01 Photoresist base material, method for purification thereof, and photoresist compositions Abandoned AU2003261865A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2002300144 2002-10-15
JP2002/300144 2002-10-15
JP2003/112458 2003-04-17
JP2003112458A JP4429620B2 (ja) 2002-10-15 2003-04-17 感放射線性有機化合物
PCT/JP2003/011137 WO2004036315A1 (ja) 2002-10-15 2003-09-01 フォトレジスト基材及びその精製方法、並びにフォトレジスト組成物

Publications (1)

Publication Number Publication Date
AU2003261865A1 true AU2003261865A1 (en) 2004-05-04

Family

ID=32109447

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003261865A Abandoned AU2003261865A1 (en) 2002-10-15 2003-09-01 Photoresist base material, method for purification thereof, and photoresist compositions

Country Status (7)

Country Link
US (1) US20050271971A1 (enExample)
EP (1) EP1553451A4 (enExample)
JP (1) JP4429620B2 (enExample)
KR (1) KR20050061538A (enExample)
AU (1) AU2003261865A1 (enExample)
TW (1) TWI282037B (enExample)
WO (1) WO2004036315A1 (enExample)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7001708B1 (en) * 2001-11-28 2006-02-21 University Of Central Florida Research Foundation, Inc. Photosensitive polymeric material for worm optical data storage with two-photon fluorescent readout
KR100881307B1 (ko) 2004-02-20 2009-02-03 도오꾜오까고오교 가부시끼가이샤 패턴 형성 재료용 기재, 포지티브형 레지스트 조성물 및레지스트 패턴 형성 방법
KR20070003980A (ko) * 2004-04-05 2007-01-05 이데미쓰 고산 가부시키가이샤 칼릭스레졸시나렌 화합물, 포토 레지스트 기재 및 그조성물
JP3946715B2 (ja) 2004-07-28 2007-07-18 東京応化工業株式会社 ポジ型レジスト組成物およびレジストパターン形成方法
JP4468119B2 (ja) 2004-09-08 2010-05-26 東京応化工業株式会社 レジスト組成物およびレジストパターン形成方法
JP4837323B2 (ja) 2004-10-29 2011-12-14 東京応化工業株式会社 レジスト組成物、レジストパターン形成方法および化合物
TWI400568B (zh) 2004-12-24 2013-07-01 Mitsubishi Gas Chemical Co 感放射線性組成物、非晶質膜及形成光阻圖案的方法
JP4618715B2 (ja) * 2005-01-27 2011-01-26 日東電工株式会社 液晶化合物
US7981588B2 (en) 2005-02-02 2011-07-19 Tokyo Ohka Kogyo Co., Ltd. Negative resist composition and method of forming resist pattern
JP5138157B2 (ja) 2005-05-17 2013-02-06 東京応化工業株式会社 ポジ型レジスト組成物およびレジストパターン形成方法
CN101218202A (zh) * 2005-06-01 2008-07-09 木下博雄 杯间苯二酚芳烃化合物以及由其构成的光致抗蚀剂基材及其组合物
JP4813103B2 (ja) 2005-06-17 2011-11-09 東京応化工業株式会社 化合物、ポジ型レジスト組成物およびレジストパターン形成方法
JP4732038B2 (ja) 2005-07-05 2011-07-27 東京応化工業株式会社 化合物、ポジ型レジスト組成物およびレジストパターン形成方法
CN101390015A (zh) * 2006-02-16 2009-03-18 康奈尔研究基金会 用于低于200nm的平版印刷的基于金刚烷的分子玻璃光致抗蚀剂
JPWO2008136372A1 (ja) * 2007-04-27 2010-07-29 出光興産株式会社 フォトレジスト基材、及びそれを含んでなるフォトレジスト組成物
JP5396738B2 (ja) * 2007-05-09 2014-01-22 三菱瓦斯化学株式会社 感放射線性組成物、化合物、化合物の製造方法およびレジストパターン形成方法
WO2008153154A1 (ja) * 2007-06-15 2008-12-18 Idemitsu Kosan Co., Ltd. 環状化合物、フォトレジスト基材及びフォトレジスト組成物
TW200914417A (en) * 2007-06-28 2009-04-01 Idemitsu Kosan Co Method for production of cyclic compound having substituent introduced therein, and photoresist substrate
JP5354420B2 (ja) * 2007-12-11 2013-11-27 出光興産株式会社 環状化合物、フォトレジスト基材、フォトレジスト組成物、微細加工方法及び半導体装置
JP5435995B2 (ja) * 2009-01-30 2014-03-05 出光興産株式会社 環状化合物の製造方法
JP5701576B2 (ja) 2009-11-20 2015-04-15 富士フイルム株式会社 分散組成物及び感光性樹脂組成物、並びに固体撮像素子
JP2013067612A (ja) 2011-09-23 2013-04-18 Rohm & Haas Electronic Materials Llc カリックスアレーン化合物およびこれを含むフォトレジスト組成物
JP2013079230A (ja) 2011-09-23 2013-05-02 Rohm & Haas Electronic Materials Llc カリックスアレーンおよびこれを含むフォトレジスト組成物
KR101935293B1 (ko) * 2016-10-28 2019-01-04 한양대학교 에리카산학협력단 새로운 레졸신아렌 기반의 양친매성 화합물 및 이의 활용

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0295211B1 (de) * 1987-06-12 1994-03-16 Ciba-Geigy Ag Photoresistzusammensetzungen
JP3039048B2 (ja) * 1991-11-01 2000-05-08 住友化学工業株式会社 ポジ型感放射線性レジスト組成物
JP2655384B2 (ja) * 1991-11-08 1997-09-17 富士写真フイルム株式会社 ポジ型レジスト組成物
JP3340864B2 (ja) * 1994-10-26 2002-11-05 富士写真フイルム株式会社 ポジ型化学増幅レジスト組成物
JPH10310545A (ja) * 1997-05-09 1998-11-24 Jsr Corp フェノール系デンドリマー化合物およびそれを含む感放射線性組成物
TW383416B (en) * 1997-06-26 2000-03-01 Matsushita Electric Industrial Co Ltd Pattern forming method
JPH11322656A (ja) * 1998-05-11 1999-11-24 Jsr Corp 新規なカリックスアレーン誘導体およびカリックスレゾルシナレーン誘導体、ならびに感光性組成物
US6093517A (en) * 1998-07-31 2000-07-25 International Business Machines Corporation Calixarenes for use as dissolution inhibitors in lithographic photoresist compositions
JP3850596B2 (ja) * 1999-02-25 2006-11-29 本州化学工業株式会社 新規な部分保護トリスフェノール類とその製造方法
JP4135277B2 (ja) * 1999-10-12 2008-08-20 Ｊｓｒ株式会社 感放射線性樹脂組成物
JP4141625B2 (ja) * 2000-08-09 2008-08-27 東京応化工業株式会社 ポジ型レジスト組成物およびそのレジスト層を設けた基材
JP2002182392A (ja) * 2000-12-11 2002-06-26 Fuji Photo Film Co Ltd 電子線又はｘ線用ポジ型レジスト組成物
JP2002229193A (ja) * 2001-02-06 2002-08-14 Fuji Photo Film Co Ltd 電子線又はｘ線用ポジ型レジスト組成物
US7534547B2 (en) * 2001-03-29 2009-05-19 Osaka Gas Company Limited Optically active compound and photosensitive resin composition
JP3988580B2 (ja) * 2001-08-23 2007-10-10 Ｊｓｒ株式会社 スルホニルオキシム化合物、それを使用する感放射線性酸発生剤、ポジ型感放射線性樹脂組成物、及びネガ型感放射線性樹脂組成物
JP4004820B2 (ja) * 2001-10-01 2007-11-07 富士フイルム株式会社 ポジ型電子線、ｘ線又はｅｕｖ用レジスト組成物
US7013965B2 (en) * 2003-04-29 2006-03-21 General Electric Company Organic matrices containing nanomaterials to enhance bulk thermal conductivity

Also Published As

Publication number Publication date
TW200405957A (en) 2004-04-16
EP1553451A4 (en) 2009-12-16
KR20050061538A (ko) 2005-06-22
US20050271971A1 (en) 2005-12-08
WO2004036315B1 (ja) 2004-06-03
JP2004191913A (ja) 2004-07-08
TWI282037B (en) 2007-06-01
JP4429620B2 (ja) 2010-03-10
EP1553451A1 (en) 2005-07-13
WO2004036315A1 (ja) 2004-04-29

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase