JP4397326B2 - ボンディング装置 - Google Patents

ボンディング装置 Download PDF

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Publication number
JP4397326B2
JP4397326B2 JP2004377541A JP2004377541A JP4397326B2 JP 4397326 B2 JP4397326 B2 JP 4397326B2 JP 2004377541 A JP2004377541 A JP 2004377541A JP 2004377541 A JP2004377541 A JP 2004377541A JP 4397326 B2 JP4397326 B2 JP 4397326B2
Authority
JP
Japan
Prior art keywords
circuit
capacitance
wire
bonding
target device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2004377541A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006186087A (ja
JP2006186087A5 (https=
Inventor
敏理 宮原
湧 杜
洋 川本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP2004377541A priority Critical patent/JP4397326B2/ja
Priority to TW094134911A priority patent/TW200633094A/zh
Priority to KR1020050105873A priority patent/KR100730046B1/ko
Priority to US11/317,276 priority patent/US7842897B2/en
Publication of JP2006186087A publication Critical patent/JP2006186087A/ja
Publication of JP2006186087A5 publication Critical patent/JP2006186087A5/ja
Application granted granted Critical
Publication of JP4397326B2 publication Critical patent/JP4397326B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
JP2004377541A 2004-12-27 2004-12-27 ボンディング装置 Expired - Lifetime JP4397326B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2004377541A JP4397326B2 (ja) 2004-12-27 2004-12-27 ボンディング装置
TW094134911A TW200633094A (en) 2004-12-27 2005-10-06 Bonding apparatus
KR1020050105873A KR100730046B1 (ko) 2004-12-27 2005-11-07 본딩 장치
US11/317,276 US7842897B2 (en) 2004-12-27 2005-12-23 Bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004377541A JP4397326B2 (ja) 2004-12-27 2004-12-27 ボンディング装置

Publications (3)

Publication Number Publication Date
JP2006186087A JP2006186087A (ja) 2006-07-13
JP2006186087A5 JP2006186087A5 (https=) 2007-04-05
JP4397326B2 true JP4397326B2 (ja) 2010-01-13

Family

ID=36738984

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004377541A Expired - Lifetime JP4397326B2 (ja) 2004-12-27 2004-12-27 ボンディング装置

Country Status (4)

Country Link
US (1) US7842897B2 (https=)
JP (1) JP4397326B2 (https=)
KR (1) KR100730046B1 (https=)
TW (1) TW200633094A (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100810508B1 (ko) * 2007-01-05 2008-03-07 삼성전자주식회사 시스템 에어컨 및 그 제어방법
US8919632B2 (en) * 2012-11-09 2014-12-30 Asm Technology Singapore Pte. Ltd. Method of detecting wire bonding failures
KR101672510B1 (ko) 2012-11-16 2016-11-03 가부시키가이샤 신가와 와이어 본딩 장치 및 와이어 본딩 방법
TWI562252B (en) * 2014-02-17 2016-12-11 Shinkawa Kk Detecting discharging device, wire bonding device and detecting discharging method
TWI585927B (zh) * 2014-02-21 2017-06-01 新川股份有限公司 半導體裝置的製造方法、半導體裝置以及打線裝置
TWI639202B (zh) * 2016-03-25 2018-10-21 日商新川股份有限公司 打線裝置、打線裝置用電路及半導體裝置之製造方法
JP7122740B2 (ja) * 2018-03-29 2022-08-22 株式会社新川 接続状態判定装置及び接続状態判定方法
KR102891276B1 (ko) 2021-05-25 2025-12-03 야마하 로보틱스 가부시키가이샤 와이어 본딩 시스템, 검사 장치, 와이어 본딩 방법, 및 기록 매체
US20250113441A1 (en) * 2023-09-29 2025-04-03 Biosense Webster (Israel) Ltd. System and method to control height between a joining tool and a connection pad
US20250170664A1 (en) * 2023-11-28 2025-05-29 Biosense Webster (Israel) Ltd. Automated control of an electrical connection joining process

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3283577A (en) * 1964-06-29 1966-11-08 Honeywell Inc Divided capacitance probe level gauge
US5037023A (en) * 1988-11-28 1991-08-06 Hitachi, Ltd. Method and apparatus for wire bonding
JP3041812B2 (ja) * 1993-09-21 2000-05-15 株式会社新川 ワイヤボンデイング装置
KR100193903B1 (ko) * 1995-12-30 1999-06-15 윤종용 본딩 와이어의 단선 불량을 감지할 수 있는 회로 기판 및 와이어 본딩 장치
JPH09213752A (ja) 1996-01-31 1997-08-15 Kaijo Corp ワイヤボンディング装置における不着検出回路
JP3025648B2 (ja) * 1996-08-30 2000-03-27 株式会社九州エレクトロニクスシステム 半導体のボンディング不良検出装置
JPH11176868A (ja) * 1997-12-16 1999-07-02 Kaijo Corp ワイヤボンディング装置
KR100275377B1 (en) * 1997-12-24 2001-01-15 Samsung Techwin Co Ltd Apparatus and method for detecting wire bonding
KR20020068858A (ko) * 2001-02-23 2002-08-28 삼성전자 주식회사 하면 접지부를 포함하는 비지에이용 비금속 리드 프레임
US6750734B2 (en) * 2002-05-29 2004-06-15 Ukom, Inc. Methods and apparatus for tuning an LC filter

Also Published As

Publication number Publication date
US7842897B2 (en) 2010-11-30
US20060186839A1 (en) 2006-08-24
KR100730046B1 (ko) 2007-06-20
KR20060074825A (ko) 2006-07-03
JP2006186087A (ja) 2006-07-13
TWI337385B (https=) 2011-02-11
TW200633094A (en) 2006-09-16

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