KR100730046B1 - 본딩 장치 - Google Patents

본딩 장치 Download PDF

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Publication number
KR100730046B1
KR100730046B1 KR1020050105873A KR20050105873A KR100730046B1 KR 100730046 B1 KR100730046 B1 KR 100730046B1 KR 1020050105873 A KR1020050105873 A KR 1020050105873A KR 20050105873 A KR20050105873 A KR 20050105873A KR 100730046 B1 KR100730046 B1 KR 100730046B1
Authority
KR
South Korea
Prior art keywords
circuit
wire
target device
capacitance
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1020050105873A
Other languages
English (en)
Korean (ko)
Other versions
KR20060074825A (ko
Inventor
도시미치 미야하라
유 도
요 가와모토
Original Assignee
가부시키가이샤 신가와
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 가부시키가이샤 신가와 filed Critical 가부시키가이샤 신가와
Publication of KR20060074825A publication Critical patent/KR20060074825A/ko
Application granted granted Critical
Publication of KR100730046B1 publication Critical patent/KR100730046B1/ko
Assigned to 야마하 로보틱스 가부시키가이샤 reassignment 야마하 로보틱스 가부시키가이샤 권리의 전부이전등록 Assignors: 가부시키가이샤 신가와
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
KR1020050105873A 2004-12-27 2005-11-07 본딩 장치 Expired - Lifetime KR100730046B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004377541A JP4397326B2 (ja) 2004-12-27 2004-12-27 ボンディング装置
JPJP-P-2004-00377541 2004-12-27

Publications (2)

Publication Number Publication Date
KR20060074825A KR20060074825A (ko) 2006-07-03
KR100730046B1 true KR100730046B1 (ko) 2007-06-20

Family

ID=36738984

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050105873A Expired - Lifetime KR100730046B1 (ko) 2004-12-27 2005-11-07 본딩 장치

Country Status (4)

Country Link
US (1) US7842897B2 (https=)
JP (1) JP4397326B2 (https=)
KR (1) KR100730046B1 (https=)
TW (1) TW200633094A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9457421B2 (en) 2012-11-16 2016-10-04 Shinkawa Ltd. Wire-bonding apparatus and method of wire bonding

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100810508B1 (ko) * 2007-01-05 2008-03-07 삼성전자주식회사 시스템 에어컨 및 그 제어방법
US8919632B2 (en) * 2012-11-09 2014-12-30 Asm Technology Singapore Pte. Ltd. Method of detecting wire bonding failures
TWI562252B (en) * 2014-02-17 2016-12-11 Shinkawa Kk Detecting discharging device, wire bonding device and detecting discharging method
TWI585927B (zh) * 2014-02-21 2017-06-01 新川股份有限公司 半導體裝置的製造方法、半導體裝置以及打線裝置
TWI639202B (zh) * 2016-03-25 2018-10-21 日商新川股份有限公司 打線裝置、打線裝置用電路及半導體裝置之製造方法
JP7122740B2 (ja) * 2018-03-29 2022-08-22 株式会社新川 接続状態判定装置及び接続状態判定方法
KR102891276B1 (ko) 2021-05-25 2025-12-03 야마하 로보틱스 가부시키가이샤 와이어 본딩 시스템, 검사 장치, 와이어 본딩 방법, 및 기록 매체
US20250113441A1 (en) * 2023-09-29 2025-04-03 Biosense Webster (Israel) Ltd. System and method to control height between a joining tool and a connection pad
US20250170664A1 (en) * 2023-11-28 2025-05-29 Biosense Webster (Israel) Ltd. Automated control of an electrical connection joining process

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100193903B1 (ko) * 1995-12-30 1999-06-15 윤종용 본딩 와이어의 단선 불량을 감지할 수 있는 회로 기판 및 와이어 본딩 장치
KR19990053822A (ko) * 1997-12-24 1999-07-15 유무성 와이어 본딩 검출 장치 및 방법
KR20020068858A (ko) * 2001-02-23 2002-08-28 삼성전자 주식회사 하면 접지부를 포함하는 비지에이용 비금속 리드 프레임

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3283577A (en) * 1964-06-29 1966-11-08 Honeywell Inc Divided capacitance probe level gauge
US5037023A (en) * 1988-11-28 1991-08-06 Hitachi, Ltd. Method and apparatus for wire bonding
JP3041812B2 (ja) * 1993-09-21 2000-05-15 株式会社新川 ワイヤボンデイング装置
JPH09213752A (ja) 1996-01-31 1997-08-15 Kaijo Corp ワイヤボンディング装置における不着検出回路
JP3025648B2 (ja) * 1996-08-30 2000-03-27 株式会社九州エレクトロニクスシステム 半導体のボンディング不良検出装置
JPH11176868A (ja) * 1997-12-16 1999-07-02 Kaijo Corp ワイヤボンディング装置
US6750734B2 (en) * 2002-05-29 2004-06-15 Ukom, Inc. Methods and apparatus for tuning an LC filter

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100193903B1 (ko) * 1995-12-30 1999-06-15 윤종용 본딩 와이어의 단선 불량을 감지할 수 있는 회로 기판 및 와이어 본딩 장치
KR19990053822A (ko) * 1997-12-24 1999-07-15 유무성 와이어 본딩 검출 장치 및 방법
KR20020068858A (ko) * 2001-02-23 2002-08-28 삼성전자 주식회사 하면 접지부를 포함하는 비지에이용 비금속 리드 프레임

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9457421B2 (en) 2012-11-16 2016-10-04 Shinkawa Ltd. Wire-bonding apparatus and method of wire bonding

Also Published As

Publication number Publication date
US7842897B2 (en) 2010-11-30
US20060186839A1 (en) 2006-08-24
JP4397326B2 (ja) 2010-01-13
KR20060074825A (ko) 2006-07-03
JP2006186087A (ja) 2006-07-13
TWI337385B (https=) 2011-02-11
TW200633094A (en) 2006-09-16

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