TW200633094A - Bonding apparatus - Google Patents

Bonding apparatus

Info

Publication number
TW200633094A
TW200633094A TW094134911A TW94134911A TW200633094A TW 200633094 A TW200633094 A TW 200633094A TW 094134911 A TW094134911 A TW 094134911A TW 94134911 A TW94134911 A TW 94134911A TW 200633094 A TW200633094 A TW 200633094A
Authority
TW
Taiwan
Prior art keywords
circuit
capacitance
unit
wire
measurement
Prior art date
Application number
TW094134911A
Other languages
English (en)
Chinese (zh)
Other versions
TWI337385B (https=
Inventor
Toshimichi Miyahara
Yong Do
Hiroshi Kawamoto
Original Assignee
Shinkawa K K
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa K K filed Critical Shinkawa K K
Publication of TW200633094A publication Critical patent/TW200633094A/zh
Application granted granted Critical
Publication of TWI337385B publication Critical patent/TWI337385B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
TW094134911A 2004-12-27 2005-10-06 Bonding apparatus TW200633094A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004377541A JP4397326B2 (ja) 2004-12-27 2004-12-27 ボンディング装置

Publications (2)

Publication Number Publication Date
TW200633094A true TW200633094A (en) 2006-09-16
TWI337385B TWI337385B (https=) 2011-02-11

Family

ID=36738984

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094134911A TW200633094A (en) 2004-12-27 2005-10-06 Bonding apparatus

Country Status (4)

Country Link
US (1) US7842897B2 (https=)
JP (1) JP4397326B2 (https=)
KR (1) KR100730046B1 (https=)
TW (1) TW200633094A (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100810508B1 (ko) * 2007-01-05 2008-03-07 삼성전자주식회사 시스템 에어컨 및 그 제어방법
US8919632B2 (en) * 2012-11-09 2014-12-30 Asm Technology Singapore Pte. Ltd. Method of detecting wire bonding failures
KR101672510B1 (ko) 2012-11-16 2016-11-03 가부시키가이샤 신가와 와이어 본딩 장치 및 와이어 본딩 방법
TWI562252B (en) * 2014-02-17 2016-12-11 Shinkawa Kk Detecting discharging device, wire bonding device and detecting discharging method
TWI585927B (zh) * 2014-02-21 2017-06-01 新川股份有限公司 半導體裝置的製造方法、半導體裝置以及打線裝置
TWI639202B (zh) * 2016-03-25 2018-10-21 日商新川股份有限公司 打線裝置、打線裝置用電路及半導體裝置之製造方法
JP7122740B2 (ja) * 2018-03-29 2022-08-22 株式会社新川 接続状態判定装置及び接続状態判定方法
KR102891276B1 (ko) 2021-05-25 2025-12-03 야마하 로보틱스 가부시키가이샤 와이어 본딩 시스템, 검사 장치, 와이어 본딩 방법, 및 기록 매체
US20250113441A1 (en) * 2023-09-29 2025-04-03 Biosense Webster (Israel) Ltd. System and method to control height between a joining tool and a connection pad
US20250170664A1 (en) * 2023-11-28 2025-05-29 Biosense Webster (Israel) Ltd. Automated control of an electrical connection joining process

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3283577A (en) * 1964-06-29 1966-11-08 Honeywell Inc Divided capacitance probe level gauge
US5037023A (en) * 1988-11-28 1991-08-06 Hitachi, Ltd. Method and apparatus for wire bonding
JP3041812B2 (ja) * 1993-09-21 2000-05-15 株式会社新川 ワイヤボンデイング装置
KR100193903B1 (ko) * 1995-12-30 1999-06-15 윤종용 본딩 와이어의 단선 불량을 감지할 수 있는 회로 기판 및 와이어 본딩 장치
JPH09213752A (ja) 1996-01-31 1997-08-15 Kaijo Corp ワイヤボンディング装置における不着検出回路
JP3025648B2 (ja) * 1996-08-30 2000-03-27 株式会社九州エレクトロニクスシステム 半導体のボンディング不良検出装置
JPH11176868A (ja) * 1997-12-16 1999-07-02 Kaijo Corp ワイヤボンディング装置
KR100275377B1 (en) * 1997-12-24 2001-01-15 Samsung Techwin Co Ltd Apparatus and method for detecting wire bonding
KR20020068858A (ko) * 2001-02-23 2002-08-28 삼성전자 주식회사 하면 접지부를 포함하는 비지에이용 비금속 리드 프레임
US6750734B2 (en) * 2002-05-29 2004-06-15 Ukom, Inc. Methods and apparatus for tuning an LC filter

Also Published As

Publication number Publication date
US7842897B2 (en) 2010-11-30
US20060186839A1 (en) 2006-08-24
KR100730046B1 (ko) 2007-06-20
JP4397326B2 (ja) 2010-01-13
KR20060074825A (ko) 2006-07-03
JP2006186087A (ja) 2006-07-13
TWI337385B (https=) 2011-02-11

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Legal Events

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MK4A Expiration of patent term of an invention patent