JP2006186087A - ボンディング装置 - Google Patents
ボンディング装置 Download PDFInfo
- Publication number
- JP2006186087A JP2006186087A JP2004377541A JP2004377541A JP2006186087A JP 2006186087 A JP2006186087 A JP 2006186087A JP 2004377541 A JP2004377541 A JP 2004377541A JP 2004377541 A JP2004377541 A JP 2004377541A JP 2006186087 A JP2006186087 A JP 2006186087A
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- Prior art keywords
- circuit
- wire
- capacitance
- bonding
- bonding apparatus
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- 238000005259 measurement Methods 0.000 claims abstract description 90
- 238000000034 method Methods 0.000 claims description 55
- 238000005070 sampling Methods 0.000 claims description 33
- 238000012935 Averaging Methods 0.000 claims description 31
- 238000012545 processing Methods 0.000 claims description 21
- 238000006243 chemical reaction Methods 0.000 abstract description 10
- 230000007246 mechanism Effects 0.000 abstract description 4
- 230000003321 amplification Effects 0.000 abstract description 2
- 238000003199 nucleic acid amplification method Methods 0.000 abstract description 2
- 230000008569 process Effects 0.000 description 37
- 238000010586 diagram Methods 0.000 description 18
- 230000008859 change Effects 0.000 description 13
- 239000003990 capacitor Substances 0.000 description 11
- 239000004593 Epoxy Substances 0.000 description 9
- 239000011521 glass Substances 0.000 description 9
- 239000000758 substrate Substances 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 8
- 239000000919 ceramic Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 230000003071 parasitic effect Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
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- Wire Bonding (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
【解決手段】ワイヤボンディング装置10は、対象デバイス4にワイヤを接合するための機構部分である接合マシン部20と、対象デバイス4とワイヤとの間の接続状態を測定する測定部50と、装置全体の動作を制御する制御部40を含んで構成される。測定部50のAC−C測定回路60は、AC電源62、ボンディング前の接合マシン部20の容量成分と略等価な容量を作り出す等価容量回路64と、ボンディング後の接合マシン部20の容量と等価容量回路64の容量との差分をとる差動回路68、増幅回路70、整流回路72、A/D変換回路74、および接続状態を判定する判定部80、出力部90を含んで構成される。
【選択図】図1
Description
Claims (15)
- 対象デバイスを保持し接地に接続されるステージと、対象デバイスにワイヤを接合する接合マシン部と、対象デバイスとワイヤとの間の接続状態を測定する測定部と、を含むボンディング装置において、
測定部は、
ステージとの間に導通を有しない対象デバイスとワイヤとの間の接続状態を測定するため接合マシン部の容量成分を補償する等価回路であって、対象デバイスにワイヤが接触していないときの接合マシン部とステージとの間のマシン容量成分と略等価の容量を有する等価容量回路と、
等価容量回路と、接合マシン部とにそれぞれ交流信号を供給する交流信号源と、
対象デバイスにワイヤを接合したときの接合マシン部のインピーダンスと、等価容量回路のインピーダンスとを比較する容量比較回路と、
容量比較回路の出力に基づき、ワイヤと対象デバイスとの間の接続状態を判定する判定部と、
を備えることを特徴とするボンディング装置。 - 請求項1に記載のボンディング装置において、
等価容量回路は、
複数の容量素子と、
複数の容量素子を相互に接続し、接続の仕方によって互いに異なる複数の容量値を生成する複数のスイッチ素子と、
各スイッチ素子のオン・オフを制御し、マシン容量成分の略等価の容量値を生成するスイッチ切替回路と、
を有することを特徴とするボンディング装置。 - 請求項2に記載のボンディング装置において、
スイッチ切替回路は、
ワイヤが対象デバイスに接触していないときの容量比較回路の出力が最小となるように各スイッチ素子を切り替えることを特徴とするボンディング装置。 - 請求項2に記載のボンディング装置において、
各容量素子はそれぞれ、マシン容量成分の値の2%以上50%以下の容量値を有し、
各スイッチ素子はそれぞれ、最小の容量素子における容量値の2%以上50%以下の容量値を有することを特徴とするボンディング装置。 - 請求項1に記載のボンディング装置において、
判定部は、
容量比較回路の出力を任意のサンプリング期間で平均化して出力する平均化処理手段を有することを特徴とするボンディング装置。 - 請求項5に記載のボンディング装置において、
判定部は、
平均化出力に対し任意に設定した閾値を基準にしてワイヤと対象デバイスとの間の接触状態を判定する判定処理手段を有することを特徴とするボンディング装置。 - 請求項6に記載のボンディング装置において、
判定処理手段は、
ワイヤと対象デバイスとの間の接合作業の繰り返しに応じ、閾値を更新することを特徴とするボンディング装置。 - 請求項6に記載のボンディング装置において、
判定処理手段は、
対象デバイスの種類によって異なる閾値を設定することを特徴とするボンディング装置。 - 請求項6に記載のボンディング装置において、
等価回路は、
複数の容量素子と、
複数の容量素子を相互に接続し、接続の仕方によって互いに異なる複数の容量値を生成する複数のスイッチ素子と、
各スイッチ素子のオン・オフを制御し、マシン容量成分の略等価の容量値を生成する回路であって、ワイヤが対象デバイスに接触していないときの容量比較回路の出力が最小となるように各スイッチ素子を切り替えるスイッチ切り替え回路と、
を有し、
判定処理手段は、
スイッチ切り替え回路によって最小にした容量比較回路の出力に対応する値を閾値に設定することを特徴とするボンディング装置。 - 請求項6に記載のボンディング装置において、
判定処理手段は、
対象デバイスの着不着の検出が可能であるか否かを判定することを特徴とするボンディング装置。 - 請求項6に記載のボンディング装置において、
判定処理手段は、
ワイヤと、対象デバイスとの間の着不着を判定することを特徴とするボンディング装置。 - 請求項6に記載のボンディング装置において、
判定処理手段は、
ワイヤのテール長さの適不適を判定することを特徴とするボンディング装置。 - 請求項1に記載のボンディング装置において、
測定部は、さらに、
ステージとの間に導通を有する対象デバイスとワイヤとの間の接続状態を測定するために接合マシン部に直流信号を供給する直流信号源と、
対象デバイスにワイヤを接合したときの接合マシン部の抵抗成分を測定する抵抗成分測定回路と、
を備え、電位測定回路の出力に基づき、ワイヤと対象デバイスとの間の接続状態を判定することを特徴とするボンディング装置。 - 請求項13に記載のボンディング装置において、
測定部は、
容量比較回路による接続状態測定と、抵抗成分測定回路による接続状態測定とを切り替える測定切替回路を備えることを特徴とするボンディング装置。 - 請求項1又は請求項13に記載のボンディング装置において、
接合マシン部は、ワイヤの先端を丸めるトーチを有し、
マシン容量成分には、トーチの容量成分を含み、さらに、
トーチとの接続先を、測定部又はトーチに接続される高圧電源に切り替えるトーチ切替回路を備えることを特徴とするボンディング装置。
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JP2004377541A JP4397326B2 (ja) | 2004-12-27 | 2004-12-27 | ボンディング装置 |
TW094134911A TW200633094A (en) | 2004-12-27 | 2005-10-06 | Bonding apparatus |
KR1020050105873A KR100730046B1 (ko) | 2004-12-27 | 2005-11-07 | 본딩 장치 |
US11/317,276 US7842897B2 (en) | 2004-12-27 | 2005-12-23 | Bonding apparatus |
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Cited By (3)
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WO2014077232A1 (ja) * | 2012-11-16 | 2014-05-22 | 株式会社新川 | ワイヤボンディング装置及びワイヤボンディング方法 |
JP7122740B2 (ja) | 2018-03-29 | 2022-08-22 | 株式会社新川 | 接続状態判定装置及び接続状態判定方法 |
WO2022249262A1 (ja) * | 2021-05-25 | 2022-12-01 | 株式会社新川 | ワイヤボンディングシステム、検査装置、ワイヤボンディング方法、および、プログラム |
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KR100810508B1 (ko) * | 2007-01-05 | 2008-03-07 | 삼성전자주식회사 | 시스템 에어컨 및 그 제어방법 |
US8919632B2 (en) * | 2012-11-09 | 2014-12-30 | Asm Technology Singapore Pte. Ltd. | Method of detecting wire bonding failures |
TWI562252B (en) * | 2014-02-17 | 2016-12-11 | Shinkawa Kk | Detecting discharging device, wire bonding device and detecting discharging method |
TWI585927B (zh) * | 2014-02-21 | 2017-06-01 | 新川股份有限公司 | 半導體裝置的製造方法、半導體裝置以及打線裝置 |
KR102069565B1 (ko) * | 2016-03-25 | 2020-01-23 | 야마하 모터 로보틱스 홀딩스 가부시키가이샤 | 와이어 본딩 장치, 와이어 본딩 장치용 회로 및 반도체 장치의 제조 방법 |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2014077232A1 (ja) * | 2012-11-16 | 2014-05-22 | 株式会社新川 | ワイヤボンディング装置及びワイヤボンディング方法 |
JP5827758B2 (ja) * | 2012-11-16 | 2015-12-02 | 株式会社新川 | ワイヤボンディング装置及びワイヤボンディング方法 |
US9457421B2 (en) | 2012-11-16 | 2016-10-04 | Shinkawa Ltd. | Wire-bonding apparatus and method of wire bonding |
JP7122740B2 (ja) | 2018-03-29 | 2022-08-22 | 株式会社新川 | 接続状態判定装置及び接続状態判定方法 |
WO2022249262A1 (ja) * | 2021-05-25 | 2022-12-01 | 株式会社新川 | ワイヤボンディングシステム、検査装置、ワイヤボンディング方法、および、プログラム |
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TW200633094A (en) | 2006-09-16 |
KR20060074825A (ko) | 2006-07-03 |
US7842897B2 (en) | 2010-11-30 |
US20060186839A1 (en) | 2006-08-24 |
KR100730046B1 (ko) | 2007-06-20 |
TWI337385B (ja) | 2011-02-11 |
JP4397326B2 (ja) | 2010-01-13 |
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