JP4393303B2 - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法 Download PDF

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Publication number
JP4393303B2
JP4393303B2 JP2004230803A JP2004230803A JP4393303B2 JP 4393303 B2 JP4393303 B2 JP 4393303B2 JP 2004230803 A JP2004230803 A JP 2004230803A JP 2004230803 A JP2004230803 A JP 2004230803A JP 4393303 B2 JP4393303 B2 JP 4393303B2
Authority
JP
Japan
Prior art keywords
inner lead
flexible film
semiconductor element
film wiring
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004230803A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005101546A (ja
JP2005101546A5 (https=
Inventor
利浩 森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2004230803A priority Critical patent/JP4393303B2/ja
Priority to US10/928,162 priority patent/US7115975B2/en
Publication of JP2005101546A publication Critical patent/JP2005101546A/ja
Publication of JP2005101546A5 publication Critical patent/JP2005101546A5/ja
Application granted granted Critical
Publication of JP4393303B2 publication Critical patent/JP4393303B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/077—Connecting of TAB connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Ink Jet (AREA)
JP2004230803A 2003-09-05 2004-08-06 半導体装置の製造方法 Expired - Fee Related JP4393303B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2004230803A JP4393303B2 (ja) 2003-09-05 2004-08-06 半導体装置の製造方法
US10/928,162 US7115975B2 (en) 2003-09-05 2004-08-30 Semiconductor device, process of producing semiconductor device, and ink jet recording head

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003313735 2003-09-05
JP2004230803A JP4393303B2 (ja) 2003-09-05 2004-08-06 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2005101546A JP2005101546A (ja) 2005-04-14
JP2005101546A5 JP2005101546A5 (https=) 2007-08-16
JP4393303B2 true JP4393303B2 (ja) 2010-01-06

Family

ID=34467666

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004230803A Expired - Fee Related JP4393303B2 (ja) 2003-09-05 2004-08-06 半導体装置の製造方法

Country Status (2)

Country Link
US (1) US7115975B2 (https=)
JP (1) JP4393303B2 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4290154B2 (ja) * 2004-12-08 2009-07-01 キヤノン株式会社 液体吐出記録ヘッドおよびインクジェット記録装置
KR100702970B1 (ko) * 2005-07-06 2007-04-03 삼성전자주식회사 이원 접속 방식을 가지는 반도체 패키지 및 그 제조 방법
US8438729B2 (en) * 2006-03-09 2013-05-14 Canon Kabushiki Kaisha Method of producing liquid discharge head
US20090016036A1 (en) * 2007-07-13 2009-01-15 Wong Shaw Fong Conductor reinforcement for circuit boards
KR101358751B1 (ko) * 2007-10-16 2014-02-07 삼성전자주식회사 반도체 패키지
JP2009239256A (ja) * 2008-03-03 2009-10-15 Panasonic Corp 半導体装置及びその製造方法
JP2010023491A (ja) * 2008-06-16 2010-02-04 Canon Inc 液体吐出記録ヘッド
JP2009298118A (ja) 2008-06-17 2009-12-24 Canon Inc 記録ヘッド及び記録ヘッドの製造方法
JP5173624B2 (ja) 2008-06-20 2013-04-03 キヤノン株式会社 記録ヘッド及び記録ヘッドの製造方法
US8426974B2 (en) * 2010-09-29 2013-04-23 Sunpower Corporation Interconnect for an optoelectronic device
JP5632795B2 (ja) * 2011-05-10 2014-11-26 パナソニック株式会社 電極接合構造体、および電極接合構造体の製造方法
US8803185B2 (en) * 2012-02-21 2014-08-12 Peiching Ling Light emitting diode package and method of fabricating the same
US10596815B2 (en) 2017-04-21 2020-03-24 Canon Kabushiki Kaisha Liquid ejection head and inkjet printing apparatus
JP6953175B2 (ja) 2017-05-16 2021-10-27 キヤノン株式会社 インクジェット記録ヘッドおよびインクジェット記録装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2299724A1 (fr) * 1975-01-29 1976-08-27 Honeywell Bull Soc Ind Perfectionnements aux supports de conditionnement de micro-plaquettes de circuits integres
US4331740A (en) * 1980-04-14 1982-05-25 National Semiconductor Corporation Gang bonding interconnect tape process and structure for semiconductor device automatic assembly
US4987474A (en) * 1987-09-18 1991-01-22 Hitachi, Ltd. Semiconductor device and method of manufacturing the same
US5081474A (en) 1988-07-04 1992-01-14 Canon Kabushiki Kaisha Recording head having multi-layer matrix wiring
JP2967603B2 (ja) * 1991-04-30 1999-10-25 日本電気株式会社 テープオートメイテッドボンディング半導体装置
US5250839A (en) * 1990-09-26 1993-10-05 Dai Nippon Printing Co., Ltd. Multi-layer leadframes, electrically conductive plates used therefor and production of such conductive plates
EP0490668B1 (en) 1990-12-12 1996-10-16 Canon Kabushiki Kaisha Ink jet recording
US6056391A (en) 1994-03-29 2000-05-02 Canon Kabushiki Kaisha Substrate having layered electrode structure for use in ink jet head, ink jet head, ink jet pen, and ink jet apparatus
US5929517A (en) * 1994-12-29 1999-07-27 Tessera, Inc. Compliant integrated circuit package and method of fabricating the same
JPH09109392A (ja) 1995-10-13 1997-04-28 Canon Inc インクジェット記録ヘッドの製造方法および同方法により製造されたインクジェット記録ヘッド、並びにインクジェット記録装置
US6284563B1 (en) * 1995-10-31 2001-09-04 Tessera, Inc. Method of making compliant microelectronic assemblies
DE69732389T2 (de) 1996-04-12 2005-12-22 Canon K.K. Tintenstrahldruckkopfherstellungsverfahren
US6861735B2 (en) * 1997-06-27 2005-03-01 Matsushita Electric Industrial Co., Ltd. Resin molded type semiconductor device and a method of manufacturing the same
KR100282003B1 (ko) * 1997-10-15 2001-02-15 윤종용 칩 스케일 패키지
JP2000043271A (ja) 1997-11-14 2000-02-15 Canon Inc インクジェット記録ヘッド、その製造方法及び該インクジェット記録ヘッドを具備する記録装置
JP3592208B2 (ja) 2000-07-10 2004-11-24 キヤノン株式会社 液体噴射記録ヘッドおよびその製造方法
JP3652321B2 (ja) 2001-05-08 2005-05-25 キヤノン株式会社 インクジェット記録ヘッド
JP2003007765A (ja) 2001-06-22 2003-01-10 Canon Inc Ｔａｂテープ及びボンディング方法

Also Published As

Publication number Publication date
US7115975B2 (en) 2006-10-03
JP2005101546A (ja) 2005-04-14
US20050093128A1 (en) 2005-05-05

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