JP4368805B2 - 集積回路およびこの集積回路に対応する集積回路パッケージ - Google Patents
集積回路およびこの集積回路に対応する集積回路パッケージ Download PDFInfo
- Publication number
- JP4368805B2 JP4368805B2 JP2004559621A JP2004559621A JP4368805B2 JP 4368805 B2 JP4368805 B2 JP 4368805B2 JP 2004559621 A JP2004559621 A JP 2004559621A JP 2004559621 A JP2004559621 A JP 2004559621A JP 4368805 B2 JP4368805 B2 JP 4368805B2
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- JP
- Japan
- Prior art keywords
- integrated circuit
- test
- self
- mark
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
- G01R31/318505—Test of Modular systems, e.g. Wafers, MCM's
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
- H01L2223/5444—Marks applied to semiconductor devices or parts containing identification or tracking information for electrical read out
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Description
欠陥のある集積回路ICは、作動不良時のテスト結果を用いて、この後で、通常の方法でマークされることになる。
Claims (10)
- テストされる集積機能回路(1)と、テスト結果を得るために、機能回路(1)の機能テストを行なうテスト装置(3A;3B)を機能回路(1)に接続するテストインターフェース(TI,ETI)とを有する集積回路において、
テスト結果に基づいて、磁気的に読み取り可能なマークを少なくとも1つ作る集積自己マーク装置(2)を備え、
集積自己マーク装置(2)は、磁気的に読み取り可能なマークを作る少なくとも1つの磁気マーク部材(M)と、磁気マーク部材(M)の近傍に位置し磁気マーク部材(M)を活性化させるマーク部材活性化ユニット(4,R;E1,E2)と、を有し、
マーク部材活性化ユニット(4,R;E1,E2)は、複数の接続部材(4)と、これらの接続部材(4)を互いに接続する導電性の抵抗部材(R)と、を有し、
磁気マーク部材(M)は、抵抗部材(R)の抵抗に基づいて加熱され、臨海温度TUを境に状態が変化することを特徴とする集積回路。 - 上記の磁気的に読み取り可能なマークが非揮発性のマークであることを特徴とする請求項1に記載の集積回路。
- テスト装置が、外部テストユニット(3B)、および/または、集積自己テストユニット(3A)であることを特徴とする請求項1または2に記載の集積回路。
- 集積自己マーク装置(2)が、集積機能回路(1)のテストの部分結果に応じて、マーク部分を作る複数の自己マーク装置部分を有することを特徴とする請求項1ないし3のいずれか1項に記載の集積回路。
- テスト結果を格納する、電気的に読み取り可能な非揮発性のメモリ部を有することを特徴とする請求項1ないし4のいずれか1項に記載の集積回路。
- 請求項1ないし5のいずれか1項に記載の集積回路(IC)をパッケージ(5)中にパッケージ化して有する集積回路パッケージにおいて、
少なくとも自己マーク装置(2)の領域(6)中で、パッケージ(5)が、集積回路(IC)上のマークを読み取りの可能である材料を有することを特徴とする集積回路パッケージ。 - パッケージ(5)が、少なくとも自己マーク装置(2)の領域(6)中で、磁気に対して透過性を有することを特徴とする請求項6に記載の集積回路パッケージ。
- 集積回路(IC)中のテストインターフェース(TI,ETI)が、パッケージ(5)上の接続端子(7)によって駆動されることを特徴とする請求項6または7に記載の集積回路パッケージ。
- テストされる集積回路(IC)と、テスト結果を得るために、集積回路(IC)の機能テストを行なうテスト装置を集積回路(IC)に接続するテストインターフェース(7)とを有する集積回路パッケージにおいて、
パッケージ(5)中に構成された、テスト結果に基づいて磁気的に読み取り可能なパッケージ用のマークを作る集積自己マーク装置を有し、
集積自己マーク装置(2)は、磁気的に読み取り可能なマークを作る少なくとも1つの磁気マーク部材(M)と、磁気マーク部材(M)の近傍に位置し磁気マーク部材(M)を活性化させるマーク部材活性化ユニット(4,R;E1,E2)と、を有し、
マーク部材活性化ユニット(4,R;E1,E2)は、複数の接続部材(4)と、これらの接続部材(4)を互いに接続する導電性の抵抗部材(R)とを有し、
磁気マーク部材(M)は、抵抗部材(R)の抵抗に基づいて加熱され、臨海温度TUを境に状態が変化することを特徴とする集積回路パッケージ。 - 集積自己マーク装置における、上記の磁気的に読み取り可能なマークは非揮発性のマークであることを特徴とする請求項9に記載の集積回路パッケージ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10258511A DE10258511A1 (de) | 2002-12-14 | 2002-12-14 | Integrierte Schaltung sowie zugehörige gehäuste integrierte Schaltung |
PCT/DE2003/004224 WO2004055534A1 (de) | 2002-12-14 | 2003-12-13 | Selbstmarkierungsvorrichtung für integrierte schaltung sowie zugehörige gehäuste integrierte schaltung |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006510209A JP2006510209A (ja) | 2006-03-23 |
JP4368805B2 true JP4368805B2 (ja) | 2009-11-18 |
Family
ID=32477643
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004559621A Expired - Fee Related JP4368805B2 (ja) | 2002-12-14 | 2003-12-13 | 集積回路およびこの集積回路に対応する集積回路パッケージ |
Country Status (8)
Country | Link |
---|---|
US (1) | US7233161B2 (ja) |
EP (1) | EP1570280B1 (ja) |
JP (1) | JP4368805B2 (ja) |
CN (1) | CN100516914C (ja) |
AU (1) | AU2003296540A1 (ja) |
DE (2) | DE10258511A1 (ja) |
TW (1) | TWI256122B (ja) |
WO (1) | WO2004055534A1 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
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GB0329516D0 (en) * | 2003-12-19 | 2004-01-28 | Univ Kent Canterbury | Integrated circuit with debug support interface |
US20080121709A1 (en) * | 2004-12-13 | 2008-05-29 | Tokyo Electron Limited | Semiconductor Chip With Identification Codes, Manufacturing Method Of The Chip And Semiconductor Chip Management System |
US7403027B2 (en) * | 2006-10-30 | 2008-07-22 | Intel Corporation | Apparatuses and methods for outputting signals during self-heat burn-in modes of operation |
US7573393B2 (en) * | 2007-02-08 | 2009-08-11 | Allegro Microsystems, Inc. | Integrated fault output/fault response delay circuit |
US7924045B2 (en) * | 2008-07-11 | 2011-04-12 | International Business Machines Corporation | Apparatus, system, and method for error detection in a stand alone power supply |
FR2973560A1 (fr) * | 2011-04-01 | 2012-10-05 | St Microelectronics Rousset | Tri de puces d'une plaquette de circuits électroniques |
US10522472B2 (en) | 2016-09-08 | 2019-12-31 | Asml Netherlands B.V. | Secure chips with serial numbers |
CN109964277B (zh) * | 2016-10-20 | 2023-08-11 | 德州仪器公司 | 用于检测及移除有缺陷集成电路封装的方法及设备 |
US10418324B2 (en) | 2016-10-27 | 2019-09-17 | Asml Netherlands B.V. | Fabricating unique chips using a charged particle multi-beamlet lithography system |
CN109406922B (zh) * | 2017-08-15 | 2020-09-22 | 昆山维信诺科技有限公司 | 电子产品及其测试方法和装置 |
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JPS6164137A (ja) | 1984-09-05 | 1986-04-02 | Sharp Corp | 半導体装置 |
DE3526485A1 (de) * | 1985-07-24 | 1987-02-05 | Heinz Krug | Schaltungsanordnung zum pruefen integrierter schaltungseinheiten |
JPS63102332A (ja) | 1986-10-20 | 1988-05-07 | Matsushita Electronics Corp | 半導体装置の検査方法 |
CA1303901C (en) * | 1988-06-24 | 1992-06-23 | Normand Nadeau | Low profile inker |
JPH04139850A (ja) * | 1990-10-01 | 1992-05-13 | Matsushita Electric Ind Co Ltd | 半導体集積回路装置及びその検査方法 |
US5424651A (en) * | 1992-03-27 | 1995-06-13 | Green; Robert S. | Fixture for burn-in testing of semiconductor wafers, and a semiconductor wafer |
JP2839411B2 (ja) | 1992-05-15 | 1998-12-16 | 三菱電機株式会社 | 不良icの検査装置 |
JPH0653292A (ja) | 1992-07-31 | 1994-02-25 | Sony Corp | 半導体装置及びその検査方法 |
US5673028A (en) * | 1993-01-07 | 1997-09-30 | Levy; Henry A. | Electronic component failure indicator |
US5570035A (en) * | 1995-01-31 | 1996-10-29 | The United States Of America As Represented By The Secretary Of The Army | Built-in self test indicator for an integrated circuit package |
DE19528733C1 (de) * | 1995-08-04 | 1997-01-02 | Siemens Ag | Integrierte Schaltung |
US6040773A (en) * | 1995-10-11 | 2000-03-21 | Motorola, Inc. | Radio frequency identification tag arranged for magnetically storing tag state information |
JPH10125742A (ja) * | 1996-10-22 | 1998-05-15 | Mitsubishi Electric Corp | 半導体集積回路の良否判定方法及び半導体集積回路 |
JPH1126650A (ja) | 1997-06-30 | 1999-01-29 | Mitsumi Electric Co Ltd | 樹脂封止型パッケージ |
EP1031939B1 (en) * | 1997-11-14 | 2005-09-14 | Toppan Printing Co., Ltd. | Composite ic card |
JP3097643B2 (ja) * | 1998-01-14 | 2000-10-10 | 日本電気株式会社 | 半導体装置の試験方法及び半導体装置 |
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JP2001127236A (ja) | 1999-10-28 | 2001-05-11 | Mitsumi Electric Co Ltd | Icパッケージ |
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DE10037866A1 (de) * | 2000-08-01 | 2002-03-07 | Voith Turbo Kg | Flanschmitnehmer für ein Kardangelenk und Gelenkwelle |
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-
2002
- 2002-12-14 DE DE10258511A patent/DE10258511A1/de not_active Withdrawn
-
2003
- 2003-12-10 TW TW092134940A patent/TWI256122B/zh not_active IP Right Cessation
- 2003-12-13 AU AU2003296540A patent/AU2003296540A1/en not_active Abandoned
- 2003-12-13 DE DE50303142T patent/DE50303142D1/de not_active Expired - Lifetime
- 2003-12-13 JP JP2004559621A patent/JP4368805B2/ja not_active Expired - Fee Related
- 2003-12-13 CN CN200380106080.9A patent/CN100516914C/zh not_active Expired - Fee Related
- 2003-12-13 WO PCT/DE2003/004224 patent/WO2004055534A1/de active IP Right Grant
- 2003-12-13 EP EP03813081A patent/EP1570280B1/de not_active Expired - Fee Related
-
2005
- 2005-06-10 US US11/150,625 patent/US7233161B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE50303142D1 (de) | 2006-06-01 |
TWI256122B (en) | 2006-06-01 |
EP1570280B1 (de) | 2006-04-26 |
WO2004055534A1 (de) | 2004-07-01 |
CN100516914C (zh) | 2009-07-22 |
AU2003296540A1 (en) | 2004-07-09 |
DE10258511A1 (de) | 2004-07-08 |
CN1726399A (zh) | 2006-01-25 |
US7233161B2 (en) | 2007-06-19 |
JP2006510209A (ja) | 2006-03-23 |
EP1570280A1 (de) | 2005-09-07 |
US20050225348A1 (en) | 2005-10-13 |
TW200415772A (en) | 2004-08-16 |
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