JP4352282B1 - 半導体用接着剤組成物およびそれを用いて製造した半導体装置 - Google Patents

半導体用接着剤組成物およびそれを用いて製造した半導体装置 Download PDF

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JP4352282B1
JP4352282B1 JP2008554353A JP2008554353A JP4352282B1 JP 4352282 B1 JP4352282 B1 JP 4352282B1 JP 2008554353 A JP2008554353 A JP 2008554353A JP 2008554353 A JP2008554353 A JP 2008554353A JP 4352282 B1 JP4352282 B1 JP 4352282B1
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bis
compound
adhesive composition
meth
acrylate
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JPWO2010046996A1 (ja
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伸樹 田中
光 大久保
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Sumitomo Bakelite Co Ltd
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Sumitomo Bakelite Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/02—Polysilicates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/5406—Silicon-containing compounds containing elements other than oxygen or nitrogen
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    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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    • H01L2924/156—Material
    • H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
    • H01L2924/15747—Copper [Cu] as principal constituent

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  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Dispersion Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2008554353A 2008-10-24 2008-10-24 半導体用接着剤組成物およびそれを用いて製造した半導体装置 Active JP4352282B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2008/069358 WO2010046996A1 (fr) 2008-10-24 2008-10-24 Composition adhésive pour semi-conducteur et dispositif semi-conducteur fabriqué à partir de ladite composition

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JP4352282B1 true JP4352282B1 (ja) 2009-10-28
JPWO2010046996A1 JPWO2010046996A1 (ja) 2012-03-15

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JP (1) JP4352282B1 (fr)
KR (1) KR20100049499A (fr)
CN (1) CN101778919B (fr)
TW (1) TW201016734A (fr)
WO (1) WO2010046996A1 (fr)

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JP5604828B2 (ja) * 2009-08-31 2014-10-15 住友ベークライト株式会社 樹脂組成物及び樹脂組成物を使用して作製した半導体装置
TWI488345B (zh) * 2010-12-03 2015-06-11 Hon Hai Prec Ind Co Ltd 發光二極管導線架
US9391000B2 (en) 2012-04-11 2016-07-12 Taiwan Semiconductor Manufacturing Company, Ltd. Methods for forming silicon-based hermetic thermal solutions
US9034695B2 (en) * 2012-04-11 2015-05-19 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated thermal solutions for packaging integrated circuits
KR101395322B1 (ko) * 2012-07-18 2014-05-16 도레이첨단소재 주식회사 고전압에서 전기적 신뢰성이 향상된 접착제 조성물 및 이를 이용한 반도체 패키지용 접착 테이프
JP6413249B2 (ja) * 2014-02-03 2018-10-31 住友ベークライト株式会社 熱伝導性シートおよび半導体装置
KR102325095B1 (ko) * 2014-10-01 2021-11-11 나믹스 가부시끼가이샤 수지 조성물
SG11201706655VA (en) 2015-08-03 2017-09-28 Furukawa Electric Co Ltd Electrically conductive composition
CN109777342A (zh) * 2018-12-29 2019-05-21 江苏创景科技有限公司 一种用于双组分有机硅灌封胶的固化促进剂及其应用

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JPS59184192A (ja) * 1983-03-29 1984-10-19 デグツサ・アクチエンゲゼルシヤフト 含硫オルガノ珪素化合物の製法
JPH03105932A (ja) * 1989-09-20 1991-05-02 Hitachi Ltd シート状接着剤並びに当該接着剤を用いた半導体装置
JP2001257219A (ja) * 2000-03-13 2001-09-21 Sumitomo Bakelite Co Ltd ダイアタッチペースト及び半導体装置
JP2007262243A (ja) * 2006-03-28 2007-10-11 Sumitomo Bakelite Co Ltd 樹脂組成物及び樹脂組成物を使用して作製した半導体装置

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DE19818962A1 (de) * 1998-04-28 1999-11-04 Degussa Verfahren zum Verbinden zweier Festkörper und das so hergestellte Bauelement
ES2221909T3 (es) * 2000-04-10 2005-01-16 Henkel Kommanditgesellschaft Auf Aktien Composiciones de resina epoxi resilientes.

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CN101778919A (zh) 2010-07-14
KR20100049499A (ko) 2010-05-12
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