JP4342921B2 - 基板処理装置の制御方法及び基板処理装置 - Google Patents

基板処理装置の制御方法及び基板処理装置 Download PDF

Info

Publication number
JP4342921B2
JP4342921B2 JP2003410105A JP2003410105A JP4342921B2 JP 4342921 B2 JP4342921 B2 JP 4342921B2 JP 2003410105 A JP2003410105 A JP 2003410105A JP 2003410105 A JP2003410105 A JP 2003410105A JP 4342921 B2 JP4342921 B2 JP 4342921B2
Authority
JP
Japan
Prior art keywords
substrate
inspection
flow
unit
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2003410105A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005175052A (ja
Inventor
真一 篠塚
栄希 和田
剛秀 山下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2003410105A priority Critical patent/JP4342921B2/ja
Priority to TW093136741A priority patent/TW200526494A/zh
Priority to US10/581,073 priority patent/US7529595B2/en
Priority to KR1020067011242A priority patent/KR20060120687A/ko
Priority to EP04820143A priority patent/EP1693886A4/en
Priority to CNB2004800364962A priority patent/CN100452294C/zh
Priority to PCT/JP2004/017752 priority patent/WO2005057633A1/ja
Publication of JP2005175052A publication Critical patent/JP2005175052A/ja
Application granted granted Critical
Publication of JP4342921B2 publication Critical patent/JP4342921B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H10P72/0604—
    • H10P72/0612—
    • H10P72/3304—
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • General Factory Administration (AREA)
JP2003410105A 2003-12-09 2003-12-09 基板処理装置の制御方法及び基板処理装置 Expired - Lifetime JP4342921B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2003410105A JP4342921B2 (ja) 2003-12-09 2003-12-09 基板処理装置の制御方法及び基板処理装置
TW093136741A TW200526494A (en) 2003-12-09 2004-11-29 Substrate treatment device control method and substrate treatment device
KR1020067011242A KR20060120687A (ko) 2003-12-09 2004-11-30 기판 처리 장치의 제어 방법 및 기판 처리 장치 기술 분야
EP04820143A EP1693886A4 (en) 2003-12-09 2004-11-30 SUBSTRATE TREATMENT DEVICE CONTROL METHOD AND SUBSTRATE TREATMENT DEVICE
US10/581,073 US7529595B2 (en) 2003-12-09 2004-11-30 Method of controlling substrate processing apparatus and substrate processing apparatus
CNB2004800364962A CN100452294C (zh) 2003-12-09 2004-11-30 基板处理装置的控制方法以及基板处理装置
PCT/JP2004/017752 WO2005057633A1 (ja) 2003-12-09 2004-11-30 基板処理装置の制御方法及び基板処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003410105A JP4342921B2 (ja) 2003-12-09 2003-12-09 基板処理装置の制御方法及び基板処理装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2009067273A Division JP5005720B2 (ja) 2009-03-19 2009-03-19 基板処理装置の制御方法及び基板処理装置

Publications (2)

Publication Number Publication Date
JP2005175052A JP2005175052A (ja) 2005-06-30
JP4342921B2 true JP4342921B2 (ja) 2009-10-14

Family

ID=34674920

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003410105A Expired - Lifetime JP4342921B2 (ja) 2003-12-09 2003-12-09 基板処理装置の制御方法及び基板処理装置

Country Status (7)

Country Link
US (1) US7529595B2 (enExample)
EP (1) EP1693886A4 (enExample)
JP (1) JP4342921B2 (enExample)
KR (1) KR20060120687A (enExample)
CN (1) CN100452294C (enExample)
TW (1) TW200526494A (enExample)
WO (1) WO2005057633A1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4734002B2 (ja) 2005-03-16 2011-07-27 株式会社東芝 検査システム及び半導体装置の製造方法
US20070250202A1 (en) 2006-04-17 2007-10-25 Tokyo Electron Limited Coating and developing system, method of controlling coating and developing system and storage medium
JP4560022B2 (ja) * 2006-09-12 2010-10-13 東京エレクトロン株式会社 塗布、現像装置及び塗布、現像装置の制御方法並びに記憶媒体
JP5058744B2 (ja) * 2006-10-12 2012-10-24 東京エレクトロン株式会社 基板の測定方法、プログラム、プログラムを記録したコンピュータ読み取り可能な記録媒体及び基板の処理システム
CN100465797C (zh) * 2007-01-24 2009-03-04 友达光电股份有限公司 具有宏观检测的显影装置
JP5006122B2 (ja) 2007-06-29 2012-08-22 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP4957426B2 (ja) 2007-07-19 2012-06-20 東京エレクトロン株式会社 塗布、現像装置及び塗布、現像装置の運転方法並びに記憶媒体
JP5179170B2 (ja) 2007-12-28 2013-04-10 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP4983724B2 (ja) * 2008-05-27 2012-07-25 東京エレクトロン株式会社 塗布、現像装置及び塗布、現像方法並びに記憶媒体
JP5744382B2 (ja) * 2008-07-24 2015-07-08 株式会社荏原製作所 基板処理装置および基板処理方法
JP4770938B2 (ja) * 2009-02-10 2011-09-14 東京エレクトロン株式会社 基板処理装置
JP2011211218A (ja) * 2011-06-02 2011-10-20 Tokyo Electron Ltd 塗布、現像装置及び塗布、現像装置の制御方法並びに記憶媒体
CN104267708A (zh) * 2014-10-20 2015-01-07 宜宾丝丽雅股份有限公司 短纤磺化流量信号丢失的检测方法
JP7274350B2 (ja) * 2019-05-28 2023-05-16 東京エレクトロン株式会社 搬送システム、検査システム及び検査方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10172902A (ja) * 1996-12-13 1998-06-26 Nikon Corp 重ね合わせ検査方法
JPH11176912A (ja) * 1997-12-08 1999-07-02 Mitsubishi Electric Corp 半導体基板処理装置及びその制御方法
JP3455458B2 (ja) 1999-02-01 2003-10-14 東京エレクトロン株式会社 塗布、現像装置及び塗布現像処理における基板再生システム
JP2001167996A (ja) * 1999-12-10 2001-06-22 Tokyo Electron Ltd 基板処理装置
JP4069236B2 (ja) * 2000-06-05 2008-04-02 東京エレクトロン株式会社 液処理装置
TW499702B (en) * 2000-07-04 2002-08-21 Tokyo Electron Ltd Method for monitoring operation of processing apparatus
EP1300874B1 (en) * 2000-07-07 2012-09-19 Tokyo Electron Limited Method for maintaining a processor
SG94851A1 (en) * 2000-07-12 2003-03-18 Tokyo Electron Ltd Substrate processing apparatus and substrate processing method
KR100811964B1 (ko) * 2000-09-28 2008-03-10 동경 엘렉트론 주식회사 레지스트 패턴 형성장치 및 그 방법
US6852194B2 (en) * 2001-05-21 2005-02-08 Tokyo Electron Limited Processing apparatus, transferring apparatus and transferring method
JP2003037043A (ja) * 2001-07-24 2003-02-07 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理システム
JP2003115426A (ja) 2001-07-30 2003-04-18 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理システム
JP2003045776A (ja) * 2001-07-30 2003-02-14 Dainippon Screen Mfg Co Ltd 基板処理装置
KR20030026862A (ko) * 2001-09-25 2003-04-03 다이닛뽕스크린 세이조오 가부시키가이샤 기판 처리장치 제어 시스템 및 기판 처리장치
JP2003100610A (ja) * 2001-09-26 2003-04-04 Dainippon Screen Mfg Co Ltd 基板処理装置制御システムおよび基板処理装置
JP3761081B2 (ja) * 2001-11-09 2006-03-29 東京エレクトロン株式会社 基板処理装置
JP2003158050A (ja) * 2001-11-21 2003-05-30 Dainippon Screen Mfg Co Ltd 基板処理システム及び基板検査システム
US6700090B2 (en) * 2002-04-26 2004-03-02 Hitachi High-Technologies Corporation Plasma processing method and plasma processing apparatus

Also Published As

Publication number Publication date
US20070088450A1 (en) 2007-04-19
TW200526494A (en) 2005-08-16
EP1693886A4 (en) 2011-08-17
TWI293938B (enExample) 2008-03-01
CN100452294C (zh) 2009-01-14
WO2005057633A1 (ja) 2005-06-23
JP2005175052A (ja) 2005-06-30
CN1890780A (zh) 2007-01-03
US7529595B2 (en) 2009-05-05
EP1693886A1 (en) 2006-08-23
KR20060120687A (ko) 2006-11-27

Similar Documents

Publication Publication Date Title
JP3916468B2 (ja) 基板処理装置および基板処理方法
KR101266735B1 (ko) 도포, 현상 장치 및 도포, 현상 장치의 제어 방법 및 기억 매체
JP4342921B2 (ja) 基板処理装置の制御方法及び基板処理装置
US7267497B2 (en) Coating and developing system and coating and developing method
US20060201423A1 (en) Coating/developing device and method
TWI828772B (zh) 塗布顯像裝置及塗布顯像方法
US20180164700A1 (en) Substrate treatment system, substrate transfer method, and computer storage medium
KR20080076713A (ko) 기판 처리 방법 및 기판 처리 장치
JP4494332B2 (ja) リンス処理方法、現像処理装置、および制御プログラム
JP3801849B2 (ja) 基板処理装置及びその方法
JP4957426B2 (ja) 塗布、現像装置及び塗布、現像装置の運転方法並びに記憶媒体
JP5258082B2 (ja) 基板処理装置及び基板処理方法
KR101072282B1 (ko) 기판 처리 장치, 기판 처리 방법, 기판 처리 프로그램 및 그 프로그램을 기록한 컴퓨터 판독 가능한 기록 매체
TWI305934B (enExample)
JP5005720B2 (ja) 基板処理装置の制御方法及び基板処理装置
JP2004214385A (ja) 塗布膜形成装置及びその方法
KR20080049018A (ko) 기판 처리 장치, 기판 처리 방법, 기판 처리 프로그램을 기록한 컴퓨터 판독 가능한 기록 매체
JP3725069B2 (ja) 基板処理システム
JP2007287909A (ja) 塗布、現像装置及び塗布、現像装置の制御方法並びに記憶媒体
KR20220017831A (ko) 기판 처리 장치 및 반송 스케줄 제작 방법
JP3793063B2 (ja) 処理方法及び処理装置
JP3653418B2 (ja) 基板処理装置及び基板処理方法
JP5058744B2 (ja) 基板の測定方法、プログラム、プログラムを記録したコンピュータ読み取り可能な記録媒体及び基板の処理システム
WO2024157825A1 (ja) 基板搬送方法、基板処理装置及びプログラム
JP2011211218A (ja) 塗布、現像装置及び塗布、現像装置の制御方法並びに記憶媒体

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050714

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090120

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090319

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20090707

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20090708

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120717

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 4342921

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150717

Year of fee payment: 6

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term